公开(公告)号：WO2013173468A3

公开(公告)日：2014-03-27

申请号：PCT/US2013041169

申请日：2013-05-15

Applicant: KLA TENCOR CORP

Inventor： MACNAUGHTON CRAIG ,  SINHA JAYDEEP K

IPC: G03F7/20 ,  G05B19/418

CPC classification number: G03F7/70616 ,  G03F7/70525 ,  G03F7/70633 ,  G05B19/41875 ,  H01L21/67288

Abstract: A method and apparatus for process control in the processing of a substrate is disclosed in the present invention. Embodiments of the present invention utilize a first analysis tool to determine changes in a substrate's geometry. The substrate geometry data is used to generate sampling plan that will be used to check areas of the substrate that are likely to have errors after processing. The sampling plan is fed forwards to a second analysis tool that samples the substrate after it has been processed.

Abstract translation: 在本发明中公开了一种用于处理衬底中的过程控制的方法和装置。 本发明的实施例利用第一分析工具来确定衬底几何形状的变化。 基板几何数据用于产生采样计划，该采样计划将用于检查处理后可能出现错误的基板区域。 采样计划向前馈送到第二个分析工具，对其进行处理后进行采样。

公开(公告)号：EP3114705A4

公开(公告)日：2017-11-08

申请号：EP15758366

申请日：2015-03-05

Applicant: KLA - TENCOR CORP

Inventor： CHANG WEI ,  RAO KRISHNA ,  GUTIERREZ JOSEPH ,  OLAVARRIA RAMON ,  MACNAUGHTON CRAIG ,  AZORDEGAN AMIR ,  DIGHE PRASANNA

IPC: H01L21/66 ,  G01B9/02 ,  G03F7/20 ,  G06F17/50

CPC classification number: G03F7/705 ,  G03F1/144 ,  G03F1/36 ,  G03F7/70633 ,  G06F17/5068 ,  G06F17/5081 ,  G06F2217/12 ,  G06N5/04 ,  G06N99/005 ,  Y02P90/265

公开(公告)号：EP3005411A4

公开(公告)日：2017-01-18

申请号：EP14804391

申请日：2014-05-28

Applicant: KLA-TENCOR CORP

Inventor： MACNAUGHTON CRAIG ,  VEERARAGHAVAN SATHISH ,  VUKKADALA PRADEEP ,  SINHA JAYDEEP K ,  AZORDEGAN AMIR

IPC: H01L21/66 ,  G03F7/20 ,  G03F9/00

CPC classification number: G03F7/70616 ,  G03F7/70633 ,  G03F7/70783 ,  G03F9/7003 ,  H01J37/28 ,  H01J37/304 ,  H01J37/3172 ,  H01J37/3174 ,  H01J2237/221 ,  H01J2237/2814 ,  H01J2237/30472 ,  H01J2237/30483 ,  H01J2237/31701

Abstract: Systems and methods for providing improved scanner corrections are disclosed. Scanner corrections provided in accordance with the present disclosure may be referred to as wafer geometry aware scanner corrections. More specifically, wafer geometry and/or wafer shape signature information are utilized to improve scanner corrections. By removing the wafer geometry as one of the error sources that may affect the overlay accuracy, better scanner corrections can be obtained because one less contributing factor needs to be modeled.

Abstract translation: 用于提供改进的扫描仪校正的系统和方法是游离缺失盘。 在雅舞蹈设置有本公开的扫描仪的校正可通过为晶片几何扫描器意识到校正被称为。 更具体地，晶片的几何形状和/或晶片形状的签名信息被利用来改善扫描器校正。 通过除去晶片的几何形状的误差源做可能会影响重叠精度之一，更好扫描器校正可以由于少了一个起作用的因素需要建模来获得。