中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.027 seconds)

    USE OF OVERLAY DIAGNOSTICS FOR ENHANCED AUTOMATIC PROCESS CONTROL
    1.
    发明申请
    USE OF OVERLAY DIAGNOSTICS FOR ENHANCED AUTOMATIC PROCESS CONTROL 审中-公开

    公开(公告)号：WO2003104929A3

    公开(公告)日：2003-12-18

    申请号：PCT/US2003/017899

    申请日：2003-06-05

    Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

    Inventor： SELIGSON, Joel, L. ,  GHINOVKER, Mark ,  IZIKSON, Pavel ,  SIMKIN, Boris ,  ROBINSON, John ,  ADEL, Michael, E. ,  TULIPMAN, David

    IPC: G06K9/00

    Abstract: Disclosed are methods and apparatus for analyzing the quality of overlay targets. In one embodiment, a method of extracting data from an overlay target is disclosed. Initially, image information or one or more intensity signals of the overlay target are provided. An overlay error is obtained from the overlay target by analyzing the image information or the intensity signal(s) of the overlay target. A systematic error metric is also obtained from the overlay target by analyzing the image information or the intensity signal(s) of the overlay target. For example, the systematic error may indicate an asymmetry metric for one or more portions of the overlay target. A noise metric is further obtained from the overlay target by applying a statistical model to the image information or the intensity signal(s) of the overlay target. Noise metric characterizes noise, such as a grainy background, associated with the overlay target. In other embodiments, an overlay and/or stepper analysis procedure is then performed based on the systematic error metric and/or the noise metric, as well as the overlay data.

    APPARATUS AND METHOD FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY
    3.
    发明申请
    APPARATUS AND METHOD FOR DETECTING OVERLAY ERRORS USING SCATTEROMETRY 审中-公开
    用于使用散射检测来检测重叠错误的装置和方法

    公开(公告)号：WO2004076963A2

    公开(公告)日：2004-09-10

    申请号：PCT/US2004/005419

    申请日：2004-02-23

    Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  MIEHER, Walter, D. ,  LEVY, Ady ,  GOLOVANEVSKY, Boris ,  FRIEDMANN, Michael ,  SMITH, Ian ,  ADEL, Michael ,  FABRIKANT, Anatoly ,  BEVIS, Christopher, F. ,  FIELDEN, John ,  BAREKET, Noah ,  GROSS, Ken ,  ZALICKI, Piotr ,  WACK, Dan ,  DECECCO, Paola ,  DZIURA, Thaddeus, G. ,  GHINOVKER, Mark

    Inventor： MIEHER, Walter, D. ,  LEVY, Ady ,  GOLOVANEVSKY, Boris ,  FRIEDMANN, Michael ,  SMITH, Ian ,  ADEL, Michael ,  FABRIKANT, Anatoly ,  BEVIS, Christopher, F. ,  FIELDEN, John ,  BAREKET, Noah ,  GROSS, Ken ,  ZALICKI, Piotr ,  WACK, Dan ,  DECECCO, Paola ,  DZIURA, Thaddeus, G. ,  GHINOVKER, Mark

    IPC: G01B

    CPC classification number: G03F9/7088 ,  G01N21/956 ,  G01N2021/213 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70683 ,  G03F9/7049 ,  G03F9/7084

    Abstract: Disclosed is a method of determining an overlay error between two layers of a multiple layer sample. For a plurality of periodic targets that each have a first structure formed from a first layer and a second structure formed from a second layer of the sample, an optical system is employed to thereby measure an optical signal from each of the periodic targets. There are predefined offsets between the first and second structures. An overlay error is determined between the first and second structures by analyzing the measured optical signals from the periodic targets using a scatterometry overlay technique based on the predefined offsets. The optical system comprises any one or more of the following apparatus: an imaging reflectometer, an imaging spectroscopic reflectometer, a polarized spectroscopic imaging reflectometer, a scanning reflectometer system, a system with two or more reflectometers capable of parallel data acquisition, a system with two or more spectroscopic reflectometers capable of parallel data acquisition, a system with two or more polarized spectroscopic reflectometers capable of parallel data acquisition, a system with two or more polarized spectroscopic reflectometers capable of serial data acquisition without moving the wafer stage or moving any optical elements or the reflectometer stage, imaging spectrometers, imaging system with wavelength filter, imaging system with long-pass wavelength filter, imaging system with short-pass wavelength filter, imaging system without wavelength filter, interferometric imaging system, imaging ellipsometer, a spectroscopic ellipsometer, a laser ellipsometer having a photoelastic modulator, an imaging spectroscopic ellipsometer, a scanning ellipsometer system, a system with two or more ellipsometers capable of parallel data acquisition, a system with two or more ellipsometers capable of serial data acquisition without moving the wafer stage or moving any optical elements or the ellipsometer stage, a Michelson interferometer, and a Mach-Zehnder interferometer, a Sagnac interferometer, a scanning angle of incidence system, a scanning azimuth angle system, a +/- first order differential reflectometer, a +/- first order differential polarized reflectometer.

    Abstract translation: 公开了一种确定多层样本的两层之间的覆盖误差的方法。 对于每个具有由第一层形成的第一结构和由第二层样品形成的第二结构的多个周期性目标，采用光学系统，从而测量来自每个周期性目标的光信号。 在第一和第二结构之间有预定义的偏移。 通过使用基于预定偏移的散射测量覆盖技术来分析来自周期性目标的所测量的光信号，在第一和第二结构之间确定覆盖误差。 光学系统包括以下装置中的任何一个或多个：成像反射计，成像光谱反射计，偏振光谱成像反射计，扫描反射计系统，具有两个或更多个能够并行数据采集的反射计的系统，具有两个 具有能够并行数据采集的两个或更多个偏振分光反射计的系统，具有两个或更多个偏振光谱反射计的系统，其能够进行串行数据采集而不移动晶片台或移动任何光学元件或 反射计阶段，成像光谱仪，波长滤波器成像系统，长波长滤波器成像系统，短波长滤波器成像系统，无波长滤波器成像系统，干涉成像系统，成像椭偏仪，光谱椭偏仪，激光 椭偏仪具有 光弹性调制器，成像光谱椭偏仪，扫描椭偏仪系统，具有能够并行数据采集的两个或更多个椭偏仪的系统，具有两个或更多个椭圆计的系统，能够进行串行数据采集而不移动晶片台或移动任何光学元件或 椭圆偏振台，迈克尔逊干涉仪和马赫 - 策德尔干涉仪，Sagnac干涉仪，入射系统的扫描角度，扫描方位角系统，+/-一阶微分反射计，+/-一阶差分偏振反射计 。

    APPARATUS AND METHODS FOR DETERMINING OVERLAY OF STRUCTURES HAVING ROTATIONAL OR MIRROR SYMMETRY
    4.
    发明申请
    APPARATUS AND METHODS FOR DETERMINING OVERLAY OF STRUCTURES HAVING ROTATIONAL OR MIRROR SYMMETRY 审中-公开
    用于确定具有旋转或反射对称结构的重叠的装置和方法

    公开(公告)号：WO2007008473A2

    公开(公告)日：2007-01-18

    申请号：PCT/US2006/025836

    申请日：2006-06-30

    Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  GHINOVKER, Mark

    Inventor： GHINOVKER, Mark

    IPC: G01B11/00

    CPC classification number: G01B11/272 ,  G01N21/4785 ,  G01N21/9501 ,  G03F7/70633 ,  H01L21/68 ,  H01L21/682 ,  H01L23/544 ,  Y10S438/975

    Abstract: Disclosed are overlay targets having flexible symmetry characteristics and metrology techniques for measuring the overlay error between two or more successive layers of such targets. In one embodiment, a target includes structures for measuring overlay error (or a shift) in both the x and y direction, wherein the x structures have a different center of symmetry (COS) than the y structures. In another embodiment, one of the x and y structures is invariant with a 180° rotation and the other one of the x and y structures has a mirror symmetry. In one aspect, the x and y structures together are variant with a 180° rotation. In yet another example, a target for measuring overlay in the x and/or y direction includes structures on a first layer having a 180 symmetry and structures on a second layer having mirror symmetry. In another embodiment, a target for determining overlay in the x and/or y direction includes structures on a first layer and structures on a second layer, wherein the structures on the first layer have a COS that is offset by a known amount from the COS of the structures on the second layer. In a specific implementation, any of the disclosed target embodiments may take the form of device structures. In a use case, device structures that have an inherent 180° rotational symmetry or a mirror symmetry in each of the first and second layers are used to measure overlay in a first layer and a second layer. Techniques for imaging targets with flexible symmetry characteristics and analyzing the acquired images to determine overlay or alignment error are disclosed.

    Abstract translation: 公开了具有灵活对称特征的覆盖目标和用于测量这些目标的两个或更多个连续层之间的重叠误差的计量技术。 在一个实施例中，目标包括用于测量x和y方向上的重叠误差（或移位）的结构，其中x结构具有与y结构不同的对称中心（COS）。 在另一个实施例中，x和y结构之一是不变的，具有180°旋转，并且x和y结构中的另一个具有镜像对称性。 在一个方面，x和y结构一起是180°旋转的变型。 在又一示例中，用于测量x和/或y方向上的覆盖层的目标包括具有180对称性的第一层上的结构，并且在具有镜像对称性的第二层上的结构。 在另一个实施例中，用于确定x和/或y方向上的覆盖的目标包括第一层上的结构和第二层上的结构，其中第一层上的结构具有由COS的已知量偏移的COS 的第二层结构。 在具体实现中，所公开的目标实施例中的任何一个可以采取设备结构的形式。 在用例中，使用在第一和第二层中的每一个中具有固有的180°旋转对称性或镜像对称性的装置结构来测量第一层和第二层中的覆盖层。 公开了用于对具有灵活对称特性的目标成像和分析所获取的图像以确定覆盖或对准误差的技术。

    USE OF OVERLAY DIAGNOSTICS FOR ENHANCED AUTOMATIC PROCESS CONTROL
    5.
    发明申请
    USE OF OVERLAY DIAGNOSTICS FOR ENHANCED AUTOMATIC PROCESS CONTROL 审中-公开
    用于加强自动过程控制的覆盖诊断

    公开(公告)号：WO2003104929A2

    公开(公告)日：2003-12-18

    申请号：PCT/US2003/017899

    申请日：2003-06-05

    Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

    Inventor： SELIGSON, Joel, L. ,  GHINOVKER, Mark ,  IZIKSON, Pavel ,  SIMKIN, Boris ,  ROBINSON, John ,  ADEL, Michael, E. ,  TULIPMAN, David

    IPC: G06F

    CPC classification number: G03F7/70483 ,  G03F7/705 ,  G03F7/70516 ,  G03F7/70633

    Abstract: Disclosed are methods and apparatus for analyzing the quality of overlay targets. In one embodiment, a method of extracting data from an overlay target is disclosed. Initially, image information or one or more intensity signals of the overlay target are provided. An overlay error is obtained from the overlay target by analyzing the image information or the intensity signal(s) of the overlay target. A systematic error metric is also obtained from the overlay target by analyzing the image information or the intensity signal(s) of the overlay target. For example, the systematic error may indicate an asymmetry metric for one or more portions of the overlay target. A noise metric is further obtained from the overlay target by applying a statistical model to the image information or the intensity signal(s) of the overlay target. Noise metric characterizes noise, such as a grainy background, associated with the overlay target. In other embodiments, an overlay and/or stepper analysis procedure is then performed based on the systematic error metric and/or the noise metric, as well as the overlay data.

    Abstract translation: 公开了分析覆盖目标质量的方法和装置。 在一个实施例中，公开了一种从覆盖目标提取数据的方法。 首先，提供覆盖目标的图像信息或一个或多个强度信号。 通过分析覆盖目标的图像信息或强度信号，从覆盖目标获得重叠错误。 通过分析覆盖目标的图像信息或强度信号也可以从覆盖目标获得系统误差度量。 例如，系统误差可以指示覆盖目标的一个或多个部分的不对称度量。 通过将统计模型应用于覆盖目标的图像信息或强度信号，从覆盖目标进一步获得噪声度量。 噪声度量表示与覆盖目标相关联的噪声，例如粒状背景。 在其他实施例中，然后基于系统误差度量和/或噪声度量以及覆盖数据来执行覆盖和/或步进分析程序。

    USE OF OVERLAY DIAGNOSTICS FOR ENHANCED AUTOMATIC PROCESS CONTROL
    7.
    发明公开
    USE OF OVERLAY DIAGNOSTICS FOR ENHANCED AUTOMATIC PROCESS CONTROL 审中-公开
    使用复诊断先进的自动过程控制

    公开(公告)号：EP1512112A2

    公开(公告)日：2005-03-09

    申请号：EP03736896.6

    申请日：2003-06-05

    Applicant: KLA-Tencor Technologies Corporation

    Inventor： SELIGSON, Joel, L. ,  GHINOVKER, Mark ,  IZIKSON, Pavel ,  SIMKIN, Boris ,  ROBINSON, John ,  ADEL, Michael, E. ,  TULIPMAN, David

    IPC: G06K9/00 ,  G01B5/28 ,  G06F17/50 ,  H01L21/76

    CPC classification number: G03F7/70483 ,  G03F7/705 ,  G03F7/70516 ,  G03F7/70633

    Abstract: Disclosed are methods and apparatus for analyzing the quality of overlay targets. In one embodiment, a method of extracting data from an overlay target is disclosed. Initially, image information or one or more intensity signals of the overlay target are provided. An overlay error is obtained from the overlay target by analyzing the image information or the intensity signal(s) of the overlay target. A systematic error metric is also obtained from the overlay target by analyzing the image information or the intensity signal(s) of the overlay target. For example, the systematic error may indicate an asymmetry metric for one or more portions of the overlay target. A noise metric is further obtained from the overlay target by applying a statistical model to the image information or the intensity signal(s) of the overlay target. Noise metric characterizes noise, such as a grainy background, associated with the overlay target. In other embodiments, an overlay and/or stepper analysis procedure is then performed based on the systematic error metric and/or the noise metric, as well as the overlay data.

Patent Agency Ranking