公开(公告)号：WO2003073476A3

公开(公告)日：2003-09-04

申请号：PCT/US2003/006182

申请日：2003-02-26

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： WOLF, Ralph, C. ,  BENITEZ, Eva, L. ,  CHEN, Dongsheng (Don) ,  GREENE, John, D. ,  SULLIVAN, Jamie, M. ,  VELLA, Eric, N. ,  VO, Khiem, D.

IPC: G01N21/88

Abstract: Disclosed are methods and apparatus for detecting a wide dynamic range of intensity values from a beam from a sample, which is analyzed to determine the presence of defects on the sample. In one embodiment, the system directs an incident beam towards a sample and a detector positioned to detect a beam from the sample. The detector has a sensor (10) for detecting the incident beam and generating a signal and a non-linear component (182) coupled to the sensor arranged to generate a non-linear detected signal. An alternative embodiment provides a high-gain sensor (1502a) to detect the beam from the sample and a low-gain sensor (1502b) which also detects the beam and is used to sense the sample when the beam is originating in a bright region and protect the high-gain sensor by switching it off when the beam is too bright.

公开(公告)号：WO2003073476A2

公开(公告)日：2003-09-04

申请号：PCT/US2003/006182

申请日：2003-02-26

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： WOLF, Ralph, C. ,  BENITEZ, Eva, L. ,  CHEN, Dongsheng (Don) ,  GREENE, John, D. ,  SULLIVAN, Jamie, M. ,  VELLA, Eric, N. ,  VO, Khiem, D.

IPC: H01L

CPC classification number: G01N21/956 ,  G01N21/47 ,  G01N21/9501

Abstract: Disclosed are methods and apparatus for detecting a relatively wide dynamic range of intensity values from a beam (e.g., scattered light, reflected light, or secondary electrons) originating from a sample, such as a semiconductor wafer. In other words, the inspection system provides detected output signals having wide dynamic ranges. The detected output signals may then be analyzed to determine whether defects are present on the sample. For example, the intensity values from a target die are compared to the intensity values from a corresponding portion of a reference die, where a significant intensity difference may be defined as a defect. In a specific embodiment, an inspection system for detecting defects on a sample is disclosed. The system includes a beam generator for directing an incident beam towards a sample surface and a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam. The detector has a sensor for detecting the detected beam and generating a detected signal based on the detected beam and a non-linear component coupled to the sensor. The non-linear component is arranged to generate a non-linear detected signal based on the detected signal. The detector further includes a first analog-to-digital converter (ADC) coupled to the non-linear component. The first ADC is arranged to digitize the non-linear detected signal into a digitized detected signal.

Abstract translation: 公开了用于检测来自诸如半导体晶片的样品的光束（例如，散射光，反射光或二次电子）的相对宽的动态范围的方法和装置。 换句话说，检查系统提供检测到的具有宽动态范围的输出信号。 然后可以分析检测到的输出信号，以确定样品中是否存在缺陷。 例如，将来自目标管芯的强度值与来自参考管芯的相应部分的强度值进行比较，其中将显着的强度差定义为缺陷。 在具体实施例中，公开了一种用于检测样品上的缺陷的检查系统。 该系统包括用于将入射光束引向样品表面的光束发生器，以及响应入射光束检测来自样品表面的检测光束的检测器。 检测器具有用于检测检测到的光束并基于检测到的光束产生检测信号的传感器和耦合到传感器的非线性分量。 非线性分量被布置成基于检测到的信号产生非线性检测信号。 检测器还包括耦合到非线性分量的第一模数转换器（ADC）。 第一ADC被布置成将非线性检测信号数字化为数字化的检测信号。