수동소자가 내장된 반도체 패키지 및 그 제조방법

    公开(公告)号:KR20200134596A

    公开(公告)日:2020-12-02

    申请号:KR20190060244

    申请日:2019-05-22

    Abstract: 본발명의일실시예에따르면, 상면에전극패드가형성된반도체칩, 상면에기능전극이미형성된수동소자, 상기반도체칩과수동소자를커버하는커버층, 및상기커버층상에형성되어전기신호를전달하는하나이상의전극패턴을포함하며, 상기커버층은상기기능전극이형성될영역을노출시키도록형성된하나이상의제1 오픈부를포함하며, 상기전극패턴은상기제1 오픈부를통해상기수동소자의기능전극이형성될영역에형성되는기능전극부를포함하는, 수동소자가내장된반도체패키지및 그제조방법을제공하며, 전극패턴을형성하는과정에서수동소자의기능전극을함께형성할수 있어서공정단계를생략할수 있고제조비용이절감되는효과가있다.

    광대역 특성을 갖는 분배/합성기
    2.
    发明公开

    公开(公告)号:KR20180071611A

    公开(公告)日:2018-06-28

    申请号:KR20160174435

    申请日:2016-12-20

    Abstract: 광대역특성을갖는분배/합성기가개시된다. 상기분배/합성기는표면에제1 내지제3 저항이실장되고, 제1층내지제6층을포함하는기판을포함하고, 상기제1층에는, 입력포트, 상기입력포트로부터분기되는일단과상기제1 저항에연결되는타단을갖는한 쌍의제1 전송선로및 상기제3 저항과연결되는 2개의출력포트들이배치되고, 상기제2층에는, 제1 접지판이배치되고, 상기제3층에는, 상기제1 접지판을관통하는한 쌍의제1 비아에의해상기제1 저항과연결되는일단과상기제1 접지판을관통하는한 쌍의제2 비아에의해상기제2 저항과연결되는타단을갖는한 쌍의제2 전송선로가배치되고, 상기제4층에는, 제2 접지판이배치되고, 상기제5층에는, 상기제2 접지판을관통하는제3 비아에의해상기한 쌍의제2 전송선로의타단과연결되는일단과상기제1 및제2 접지판을동시에관통하는제4 비아에의해상기제3 저항과연결되는타단을갖는한 쌍의제3 전송선로가배치되고, 상기제6층에는, 제3 접지판이배치된다.

    Bandpass modulator
    3.
    发明授权
    Bandpass modulator 有权
    BANDPASS调制器

    公开(公告)号:KR101136969B1

    公开(公告)日:2012-04-19

    申请号:KR20100139495

    申请日:2010-12-30

    CPC classification number: H03M3/39 H03M3/32 H03M2201/196 H03M2201/61

    Abstract: PURPOSE: A bandpass modulator is provided to increase stability, the size of an output signal, and coding efficiency by reducing the signal accumulation of a resonator. CONSTITUTION: A bandpass delta-sigma modulator(200) comprises first to fourth calculation units(202,204,206,208), first and second resonant units(212,214), first and second quantization units(222,224), a shifter(232), and a delay unit(242). The first and the second resonant units are parallely connected. The first calculation unit, the first resonant unit, and a first quantization unit are included in a first stage. The second calculation unit, the second resonant unit, and the second quantization unit are included in a second stage. The first calculation unit is connected to the input of the first resonant unit. The first resonant unit passes through a signal having a specific frequency band from an output signal of the first calculation unit.

    Abstract translation: 目的:提供一种带通调制器,通过减少谐振器的信号累积来提高稳定性,输出信号的大小和编码效率。 构成:带通Δ-Σ调制器(200)包括第一至第四计算单元(202,204,206,208),第一和第二谐振单元(212,214),第一和第二量化单元(222,224),移位器(232)和延迟单元 242)。 第一和第二谐振单元并联连接。 第一计算单元,第一谐振单元和第一量化单元包括在第一级中。 第二计算单元,第二谐振单元和第二量化单元包括在第二阶段中。 第一计算单元连接到第一谐振单元的输入端。 第一谐振单元从第一计算单元的输出信号通过具有特定频带的信号。

    Embeding antenna device
    4.
    发明公开
    Embeding antenna device 无效
    嵌入天线设备

    公开(公告)号:KR20120025278A

    公开(公告)日:2012-03-15

    申请号:KR20100087573

    申请日:2010-09-07

    CPC classification number: H01Q1/2283 H01Q1/24 H01Q1/38 H01Q9/0414 H05K1/0298

    Abstract: PURPOSE: An embedding antenna device is provided to offer wideband characteristics more than bandwidth which is provided from an existing antenna by adjusting properties of an antenna based on the length of an additionally designed pattern. CONSTITUTION: An antenna pattern(AP) comprises a main pattern(MP) and a sub pattern(P4). The main pattern comprises a first line pattern(P1), a second line pattern(P2), and a third line pattern(P3). The first line pattern comprises a 1-1 line pattern(P1-1) and a 1-2 line pattern(P1-2). The sub pattern is formed on the same layer with the main pattern. The sub pattern is extended from one pattern among a plurality of patterns and is patterned as a fan shape.

    Abstract translation: 目的:提供一种嵌入天线装置,通过根据附加设计的图案的长度调整天线的性质,提供比现有天线提供的带宽更多的宽带特性。 构成:天线图案(AP)包括主图案(MP)和子图案(P4)。 主图案包括第一线图案(P1),第二线图案(P2)和第三线条图案(P3)。 第一线图案包括1-1线图案(P1-1)和1-2线图案(P1-2)。 子图案与主图案形成在同一层上。 子图案从多个图案中的一个图案延伸并且被图案化为扇形。

    전력 분배기 회로 장치
    5.
    发明公开

    公开(公告)号:KR20200141775A

    公开(公告)日:2020-12-21

    申请号:KR20190068743

    申请日:2019-06-11

    Abstract: 본발명에따른전력분배기회로장치는일단이상기입력단에연결되는입력캐패시터와, 일단이상기입력캐패시터의타단에연결되고타단은접지되는션트인덕터와, 일단이상기입력캐패시터의타단에연결되고타단이출력단에연결되는복수의병렬로연결된캐패시터를포함하는캐패시터부와, 상기출력단에연결되는적어도하나의저항을포함하는출력저항부를포함한다.

    하프 동축 전송선로, 이를 포함하는 반도체 패키지 및 그 제조방법

    公开(公告)号:KR20200137819A

    公开(公告)日:2020-12-09

    申请号:KR20190064761

    申请日:2019-05-31

    Abstract: 본발명의일실시예에따르면, 반도체패키지에사용되는전송선로에있어서, 베이스기판의상면과하면을관통하도록형성되어전기신호를전달하는코어, 상기코어와이격되고상기코어의측면을동축으로둘러싸도록형성되는실드를포함하며, 상기실드는일측면의적어도일부가제거되는오픈부가형성된, 하프동축전송선로, 이를포함하는반도체패키지및 그제조방법을제공할수 있고, 하프동축전송선로는외부회로기판과연결되는부분에서전기신호의왜곡이발생하지않고, 하프동축전송선로를포함하는반도체패키지의면적을줄일수 있다.

    An electromagnetic absorber sheet, an rfid antenna and tag with the absorber and a method for fabricating the same
    7.
    发明公开
    An electromagnetic absorber sheet, an rfid antenna and tag with the absorber and a method for fabricating the same 无效
    一种电磁吸收片,一种具有吸收体的RFID天线和标签及其制造方法

    公开(公告)号:KR20100127391A

    公开(公告)日:2010-12-06

    申请号:KR20090045817

    申请日:2009-05-26

    Abstract: PURPOSE: An electromagnetic wave absorber, an antenna for an RFID tag, the RFID tag, and a manufacturing method thereof are provided to secure the stable operation of the RFID tag regardless of attached materials by absorbing the electromagnetic waves reflected from the attached materials. CONSTITUTION: An antenna for an RFID tag includes an electromagnetic wave absorber(100), a dielectric layer(120a), and a metal layer(130). The dielectric layer is formed on the electromagnetic wave absorber. The metal layer is formed on the dielectric layer. The electromagnetic wave absorber is made of a mixture of powder with high permeability, urethane binder, and silicon disperser. The powder with high permeability is sendust powder or permalloy powder.

    Abstract translation: 目的:提供一种电磁波吸收体,RFID标签用天线,RFID标签及其制造方法,通过吸收从附着材料反射的电磁波,来保证RFID标签的稳定运行,无论附加材料如何。 构成:RFID标签的天线包括电磁波吸收体(100),电介质层(120a)和金属层(130)。 电介质层形成在电磁波吸收体上。 金属层形成在电介质层上。 电磁波吸收体由高透过性粉末,聚氨酯粘合剂和硅分散器的混合物构成。 高渗透性粉末是粉末粉末或坡莫合金粉末。

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