Abstract:
PURPOSE: A bandpass modulator is provided to increase stability, the size of an output signal, and coding efficiency by reducing the signal accumulation of a resonator. CONSTITUTION: A bandpass delta-sigma modulator(200) comprises first to fourth calculation units(202,204,206,208), first and second resonant units(212,214), first and second quantization units(222,224), a shifter(232), and a delay unit(242). The first and the second resonant units are parallely connected. The first calculation unit, the first resonant unit, and a first quantization unit are included in a first stage. The second calculation unit, the second resonant unit, and the second quantization unit are included in a second stage. The first calculation unit is connected to the input of the first resonant unit. The first resonant unit passes through a signal having a specific frequency band from an output signal of the first calculation unit.
Abstract:
PURPOSE: An embedding antenna device is provided to offer wideband characteristics more than bandwidth which is provided from an existing antenna by adjusting properties of an antenna based on the length of an additionally designed pattern. CONSTITUTION: An antenna pattern(AP) comprises a main pattern(MP) and a sub pattern(P4). The main pattern comprises a first line pattern(P1), a second line pattern(P2), and a third line pattern(P3). The first line pattern comprises a 1-1 line pattern(P1-1) and a 1-2 line pattern(P1-2). The sub pattern is formed on the same layer with the main pattern. The sub pattern is extended from one pattern among a plurality of patterns and is patterned as a fan shape.
Abstract:
PURPOSE: An electromagnetic wave absorber, an antenna for an RFID tag, the RFID tag, and a manufacturing method thereof are provided to secure the stable operation of the RFID tag regardless of attached materials by absorbing the electromagnetic waves reflected from the attached materials. CONSTITUTION: An antenna for an RFID tag includes an electromagnetic wave absorber(100), a dielectric layer(120a), and a metal layer(130). The dielectric layer is formed on the electromagnetic wave absorber. The metal layer is formed on the dielectric layer. The electromagnetic wave absorber is made of a mixture of powder with high permeability, urethane binder, and silicon disperser. The powder with high permeability is sendust powder or permalloy powder.