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公开(公告)号:JPH07201889A
公开(公告)日:1995-08-04
申请号:JP30654394
申请日:1994-12-09
Applicant: KOREA ELECTRONICS TELECOMM
Inventor: YOU TENKIYOKU , GO OUKI , IN KIYOUSHIYOU , RI SHINKI , BOKU TETSUJIYUN , BOKU KIYOUMO
IPC: H01L29/43 , H01L21/30 , H01L21/338 , H01L29/423 , H01L29/49 , H01L29/812
Abstract: PURPOSE: To simplify the forming process of a fine pattern and a T-shape gate by doubly exposing a photoresist film through the use of an optical stepper, making it the photoresist film of a lower layer, forming the photoresist film of an upper layer on it and applying a metallic film on it. CONSTITUTION: A photoresist film 20 is applied on the semi-insulating GaAs substrate 10. A photomask 30 having an opaque region 31 is arranged on it and the region of a gate is exposed by the exposure of ultraviolet rays. When the region is exposed again in a state in which the photomask is moved for a prescribed distance, the regions which are not exposed are again classified as a region 22 which is not exposed and regions 23 which have been exposed once, and the region except for the regions is the region that has been exposed twice. Thus, a pattern which is finer than the resolution of the applied stepper can be formed in the formation of the fire form, and the form of the T-shape gate can efficiently be formed.
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公开(公告)号:JPH09129653A
公开(公告)日:1997-05-16
申请号:JP31687395
申请日:1995-12-05
Applicant: KOREA ELECTRONICS TELECOMM
Inventor: GO OUKI , YOU TENKIYOKU , BOKU TETSUJIYUN
IPC: H01L21/28 , H01L21/285 , H01L21/306 , H01L21/336 , H01L21/338 , H01L29/08 , H01L29/10 , H01L29/423 , H01L29/45 , H01L29/78 , H01L29/812
Abstract: PROBLEM TO BE SOLVED: To provide a method by which an MESFET(metal semiconductor field effect transistor) having such a T-type gate and LDD(lightly doped drain) structure that can reduce the resistance of a source and at, the same time, can improve the breakdown voltage characteristic of a drain and can reduce the resistance of a gate can be manufactured. SOLUTION: An inverted mesa section 30 is formed at a prescribed part of a channel area 23 formed between a source area 27 and a drain area 28 by utilizing a cap layer 29 and low-concentration source and drain areas 33 and 34 are formed so that the area 34 can become wider than the area 33 by implanting ions into the areas between the source and drain areas 27 and 28 and the channel area 23 at a low concentration with low energy by utilizing the mesa section 30 as a mask and a T-type gate electrode is formed on the surface of the mesa section 30 or in a groove formed by removing the section 30 so that the electrode cannot come into contact with the source and drain areas 33 and 34.
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