Abstract:
Provided is a method of depositing an amorphous silicon thin film by chemical vapor deposition (CVD) to prevent bubble defect occurring when an amorphous silicon thin film is deposited on a substrate contaminated by air exposure. The deposition method includes cleaning a surface of the contaminated substrate with a reaction gas activated by plasma and depositing an amorphous silicon thin film on the cleaned substrate. Here, a vacuum state is maintained from the substrate cleaning step to the thin film deposition step in order to prevent contamination of the surface of the cleaned substrate by re-exposure to air.
Abstract:
PURPOSE: A method for depositing of an amorphous silicon thin film is provided to prevent the deformity of the bubble type due to the evaporation of the amorphous silicon thin film to the polluted top of the substrate. The manufacture yield of device is improved. CONSTITUTION: A polluted substrate is provided by a reaction chamber(S20). Here, the polluted substrate comes due to exposure among the air. The surface of substrate is washed with a reaction gas(S22). Here, the reaction gas is activated with the plasma. The amorphous silicon thin film is evaporated in the washed substrate(S24). In the cleaning step of substrate, vacuum maintains for the deposition step of the thin film.