公开(公告)号：JPH11330111A

公开(公告)日：1999-11-30

申请号：JP12698298

申请日：1998-05-11

Applicant: KOSAKA LAB

Inventor： ABIKO KENJI ,  ITO MICHIHIKO ,  KAMIO SEISUKE

IPC: H01L21/52

Abstract: PROBLEM TO BE SOLVED: To shorten heating time and to prevent excessive temperature rise by a method, wherein the position of installation of a spot heater is controlled in such a manner that soldering material is positioned about on the focal point of the spot heater. SOLUTION: A plurality of retaining devices 10 are provided on a plurality of places on the upper surface of a turntable 9, which is rotatingly driven intermittently in the clockwise direction with the vertical shaft 8, which is arranged in vertical direction, as the center. The retaining devices 10 are mechanically retained in the state in which their mounting surface is positioned horizontally directing to upward, and the turntable 9 is brought into the state where it can be moved to the diametral direction and the circumferential direction of the turn table 9. In association with the intermittent rotation of the turn table 9, a sheet of foil of brazing filler metal is placed on the surface of mounting, the foil and the brazing filler metal layer, coated on the upper surface of a silicon chip, are positioned about on the focal point, and the setting position of each spot heater 45 is controlled so as to concentrate the heat generated by the heater element to the foil and the brazing filler metal layer.