公开(公告)号：JPH11330111A

公开(公告)日：1999-11-30

申请号：JP12698298

申请日：1998-05-11

Applicant: KOSAKA LAB

Inventor： ABIKO KENJI ,  ITO MICHIHIKO ,  KAMIO SEISUKE

IPC: H01L21/52

Abstract: PROBLEM TO BE SOLVED: To shorten heating time and to prevent excessive temperature rise by a method, wherein the position of installation of a spot heater is controlled in such a manner that soldering material is positioned about on the focal point of the spot heater. SOLUTION: A plurality of retaining devices 10 are provided on a plurality of places on the upper surface of a turntable 9, which is rotatingly driven intermittently in the clockwise direction with the vertical shaft 8, which is arranged in vertical direction, as the center. The retaining devices 10 are mechanically retained in the state in which their mounting surface is positioned horizontally directing to upward, and the turntable 9 is brought into the state where it can be moved to the diametral direction and the circumferential direction of the turn table 9. In association with the intermittent rotation of the turn table 9, a sheet of foil of brazing filler metal is placed on the surface of mounting, the foil and the brazing filler metal layer, coated on the upper surface of a silicon chip, are positioned about on the focal point, and the setting position of each spot heater 45 is controlled so as to concentrate the heat generated by the heater element to the foil and the brazing filler metal layer.

公开(公告)号：JPH11111740A

公开(公告)日：1999-04-23

申请号：JP27078597

申请日：1997-10-03

Applicant: KOSAKA LAB

Inventor： KAMIO SEISUKE

IPC: H01L21/60 ,  H01L21/52 ,  H05K13/04

Abstract: PROBLEM TO BE SOLVED: To correctly ascertain the position of a small chip, by making an absorption head of transparent material such as glass or acrylic resin and directly observing with a camera the small chip to be taken out by the absorption head. SOLUTION: A small chip 4 absorbed by an absorption head 6a to the bottom opening thereof can be directly observed with a camera arranged above the absorption head 6a, because the top plate 9 and the bottom plate 10 are made of transparent glass plate. This makes it possible to correctly ascertain the position of the small chip 4 and to correctly position the small chip 4. Therefore, the small chip 4 can be correctly bonded to the predetermined part of a stem or a substrate.

公开(公告)号：JPH05190904A

公开(公告)日：1993-07-30

申请号：JP1842392

申请日：1992-01-08

Applicant: RIYOUKOUSHIYA KK ,  KOSAKA LAB

Inventor： HIYAMA NOBUO ,  KAMIO SEISUKE

IPC: H01L33/62

Abstract: PURPOSE:To achieve the speedup of bonding operation by taking in a picture data and then analyzing the picture data to take out micro chips one by one to shorten a period of time required for the operation of taking in the picture data. CONSTITUTION:Micro chips such as three or are pieces of LED chips 4, 4 and the like are simultaneously taken in as a picture data through a camera placed over a number of micro chips such as the LED chips 4, 4 and the like standing in a row on a transfer table such as a precision X-Y table and the like. After that, the distance between micro chips adjoining each other is derived as to two or more pieces thereof by analyzing the picture data, and the transfer table is horizontally moved in an intermittent manner based on the derived distance, and the micro chips are taken out one by one with a vertically and horizontally movable taking-out member such as an adsorbing head and the like. Thus, a plurality of chips are taken out with the operation of taking in a picture once performed, so that the speedup of bonding operation may be achieved.