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公开(公告)号：JPH05185270A
公开(公告)日：1993-07-27
申请号：JP2435692
申请日：1992-01-16
Applicant: KOSAKA LAB
Inventor： MATSUMOTO FUMIO , SOYAMA YUKIO
Abstract: PURPOSE:To improve a cutting speed, prevent splashing of glass splinters generated by chipping and prevent surface flawing of the glass panel 8 by the glass splinters. CONSTITUTION:A slight volume of liquid 25 is stuck to the surface of the glass panel 8 to cover line traces 22 formed on this surface. These line traces 22 are then irradiated with a laser beam to generate thermal strains in the line trace 22 parts and to evaporate the liquid 25 advancing into a crack 26. As a result, the glass panel 8 is rapidly cut. The glass splinters are confined by the liquid 25 and are prevented from splashing to the surroundings.
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公开(公告)号：JPS6245123A
公开(公告)日：1987-02-27
申请号：JP18397885
申请日：1985-08-23
Applicant: KOSAKA LAB
Inventor： KASAI TOSHIO , KOBAYASHI AKIRA , MATSUMOTO FUMIO , SOYAMA YUKIO
IPC: B24B37/00 , H01L21/304
Abstract: PURPOSE:To conduct polishing rapidly while obtaining an excellent specular surface by thickening the concentration of abrasives first and thinning it as processing progresses. CONSTITUTION:A semiconductor wafer 1 is fitted onto the lower surface of a holding plate 11, the holding plate 11 is turned through a belt 13, a pulley 12 and a vertical shaft 10 while a lifting lever 14 is rotated and operated so as to push down a thrust bearing 14b, and the ground surface of the wafer 1 is pushed against the ground surface of a polisher 3. The upper surface of the polisher 3 is supplied with abrasive 4 under the state, and a rotating disk 7 is revolved and the holding plate 11 is reciprocated while being turned, thus rubbing the polisher 3 and the wafer 1 each other. When the concentration of abrasives is thickened first and thinned as processing progresses, strong etching action is obtained at the initial stage of processing, and an excellent specular surface is acquired at the last stage of processing.
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公开(公告)号：JPH09262736A
公开(公告)日：1997-10-07
申请号：JP7216296
申请日：1996-03-27
Applicant: KOSAKA LAB
Inventor： FUJII KENJI , YOSHIHARA KOJI , SOYAMA YUKIO
Abstract: PROBLEM TO BE SOLVED: To prevent an edge of a glass panel from being damaged when the glass panel is sucked on an upper surface of a supporting base after it is positioned. SOLUTION: After a glass panel 1 is elastically held between a stopper 6a and a pusher 7a, it is sucked on a reference plane 4 above a supporting base 5. During the suction, the glass panel 1 is slightly lowered. The stopper 6a and the pusher 7a are elastically supported in a freely lowering manner. Thus, the stopper 6a, the pusher 7a, and an edge of the glass panel 1a are not rubbed with each other during the suction, and the glass panel 1 is prevented from being damaged.
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Patent Agency Ranking
公开(公告)号：JPH08133774A
公开(公告)日：1996-05-28
申请号：JP27102894
申请日：1994-11-04
Applicant: KOSAKA LAB
Inventor： FUJII KENJI , YOSHIHARA KOJI , SOYAMA YUKIO
IPC: C03B33/03 , C03B33/033
Abstract: PURPOSE: To inexpensively obtain a glass panel having good quality at a good yield without staining and flawing the front surface of this glass panel by forming a straight line score on the rear surface of the glass panel and applying a stress thereon from the front surface side. CONSTITUTION: The glass panel 1 is placed on a table 22 by pressing its rear surface atop this table and is so held by a pressing plate 25, etc., so as not to slip. A cutter 24 disposed on the rear surface side of the table 22 and the table 22 are relatively moved until the cutter 24 faces the part to be broken of the glass panel 1. The cutter 24 is risen to press the cutter 24 to the rear surface of the glass panel 1 when the cutter 24 moves to a desired position. The table 22 and the cutter 24 are relatively moved in a lateral direction in this state, by which the line score arriving at the other end edge from the one end edge of the longitudinal direction is formed on the part to be broken on the rear surface side of the glass panel 1. A breaker is then lowered from the up position to apply the stress on the part to be formed with the line score, by which the glass panel 1 is broken.
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公开(公告)号：JPH0617169B2
公开(公告)日：1994-03-09
申请号：JP18169885
申请日：1985-08-21
Applicant: KOSAKA LAB
Inventor： MATSUMOTO FUMIO , SOYAMA YUKIO
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公开(公告)号：JPH02100036A
公开(公告)日：1990-04-12
申请号：JP25187388
申请日：1988-10-07
Applicant: USHIO ELECTRIC INC , KOSAKA LAB
Inventor： SUZUKI SHIGERU , TANAKA KAZUYA , SOYAMA YUKIO , ITO SEIJI
Abstract: PURPOSE:To enable accurate positioning by detecting the position of a film which is fed in a slacking state from a film supply reel to a supply-side friction roller and from a take-up side friction roller to a film take-up reel at the upper and lower positions. CONSTITUTION:The position of the film which is fed in the slacking state without no tension from the film supply reel 1 to the supply-side friction roller 31 is detected at the two upper and lower positions by 1st and 2nd photosensors 33a and 33b, and 34a and 34b respectively. Further, the position of the film which is conveyed in the slacking state without tension from the take-up side friction roller 32 to the film take-up reel 4 is detected at the two upper and lower positions by 3rd and 4th photosensors 36a and 36b, and 37a and 37b. Consequently, the high-accuracy positioning is performed.
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公开(公告)号：JPS5941524B2
公开(公告)日：1984-10-08
申请号：JP143077
申请日：1977-01-12
Applicant: Kosaka Lab
Inventor： ISHIBASHI YASUHIRO , MATSUMOTO FUMIO , SOYAMA YUKIO
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公开(公告)号：JPS6246811A
公开(公告)日：1987-02-28
申请号：JP18169885
申请日：1985-08-21
Applicant: KOSAKA LAB
Inventor： MATSUMOTO FUMIO , SOYAMA YUKIO
Abstract: PURPOSE:To protect a semiconductor wafer from scratches and dust sticking, by inserting the thin disclike semiconductor wafer into an oval section transfer pipe whose major axis is larger than a diameter of this semiconductor wafer and the minor axis is shorter than this diameter, and transferring the wafer with a fluid. CONSTITUTION:A transfer pipe 2 consists in an oval section taking its major axis (a) to be larger than a diameter R of a semiconductor wafer 1 and to be smaller than the diameter R of its minor axis (b). A fluid is made to flow in this transfer pipe whereby the semiconductor wafer is transferable, and since this semiconductor wafer 1 has a little chance to be exposed in the air, a fear of dust being stuck is reducible and, what is more, scratches and the like attributable to a conveying device are hardly sustained.
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