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公开(公告)号：EP2981158A4
公开(公告)日：2017-01-18
申请号：EP14774851
申请日：2014-03-26
Applicant: KYOCERA CORP
Inventor： KAJITA SATOSHI , HAGIHARA MITSUHIRO , MATSUMOTO YUUHEI
CPC classification number: H05K1/0306 , H05K1/0298 , H05K1/036 , H05K1/09 , H05K1/115 , H05K1/181 , H05K3/0038 , H05K3/421 , H05K3/4602 , H05K3/4655 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0266 , H05K2201/09845 , H05K2201/09854 , H05K2201/09863 , H05K2201/2072
Abstract: A wiring board (3) in accordance with an embodiment of the invention includes: an inorganic insulating layer (13) having a via hole (V) formed so as to penetrate the inorganic insulating layer (13) in a thickness direction thereof; a conductive layer (11) disposed on the inorganic insulating layer (13); and a via conductor (12) which adheres to an inner wall (W) of the via hole (V) and is connected with the conductive layer (11). The inorganic insulating layer (13) includes a first section (33) including a plurality of inorganic insulating particles (16) partly connected to each other, and a resin portion (18) located in gaps (17) between the inorganic insulating particles (16), and a second section (34) which is interposed between the first section (33) and the via conductor (12), including a plurality of inorganic insulating particles (16) partly connected to each other, and a conducting portion (19) composed of part of the via conductor (12) which is located in gaps (17) between the inorganic insulating particles (16).
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公开(公告)号：JP2004063560A
公开(公告)日：2004-02-26
申请号：JP2002216628
申请日：2002-07-25
Applicant: Kyocera Corp , 京セラ株式会社
Inventor： KAJITA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a wiring board where marks can be formed which have large differences in hue and in a contrast ratio from those of its surroundings and have robustness and excellent recognizability.
SOLUTION: On a surface of an organic material based insulating board 1 covered with wiring conductors 2, there is provided a first resin film 3 for laser markings that is covered with a first resin film 3a comprising a titanium oxide pigment and a nonsolvent based thermosetting resin, and with a second resin film 3b comprising a carbon pigment and a resin on an upper surface of the first resin film 3a.
COPYRIGHT: (C)2004,JPO-
公开(公告)号：JP2003017857A
公开(公告)日：2003-01-17
申请号：JP2001231412
申请日：2001-07-31
Applicant: Kyocera Corp , 京セラ株式会社
Inventor： KAJITA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To provide the manufacturing method of multilayer interconnection boards of high connection reliability, and of all-layer IVH structure. SOLUTION: The manufacturing method should include a first process for laminating an uncured bonding layer 2A/a protecting layer 3 on the upper and lower surfaces of an insulation plate 1; a second process of forming a through-hole 4 in (the insulation plate 1). (bonding layer 2A). (protecting layer 3), a third process of peeling off the protecting layer 3 after the formation of an uncured through conductor 5A for obtaining a first substrate 7 made of the insulation plate 1, through conductor 5A, and bonding layer 2A; a fourth process of laminating first copper foil 6A onto the upper and lower surfaces of the first substrate 7, heating and pressurizing them for bonding the first copper foil 6A, making the first copper foil 6A to be subjected to pattern machining for forming a first wiring conductor 6C, and obtaining a second substrate 8; a fifth process of successively laminating the first substrate 7 and second copper foil 6B onto the upper and lower surfaces of the second substrate 8, and heating and pressurizing them for bonding; and a sixth process of allowing the second copper foil 6B to be subjected to pattern machining for forming a second wiring conductor layer 6D.
Abstract translation: 要解决的问题：提供具有高连接可靠性和全层IVH结构的多层互连板的制造方法。 解决方案：制造方法应包括在绝缘板1的上表面和下表面上层压未固化的接合层2A /保护层3的第一工艺; （绝缘板1）中形成通孔4的第二工序。 （接合层2A）。 （保护层3），通过导体5A和接合层2A形成用于获得由绝缘板1制成的第一基板7的未固化贯通导体5A形成后的剥离保护层3的第三工序; 将第一铜箔6A层压到第一基板7的上表面和下表面上的第四工序，对第一铜箔6A进行加热加压，使第一铜箔6A进行图案加工，以形成第一布线 导体6C，并获得第二基板8; 将第一基板7和第二铜箔6B依次层叠在第二基板8的上表面和下表面上的第五工序，对其进行加热加压以进行接合; 以及允许第二铜箔6B经受用于形成第二布线导体层6D的图案加工的第六工序。
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公开(公告)号：JP2003017850A
公开(公告)日：2003-01-17
申请号：JP2001231411
申请日：2001-07-31
Applicant: Kyocera Corp , 京セラ株式会社
Inventor： KAJITA SATOSHI
IPC: H05K3/46
Abstract: PROBLEM TO BE SOLVED: To provide a multilayer wiring board which exhibits high reliability of connection and all the layers of which area of all-layer IVH structure. SOLUTION: The method for manufacturing a multilayer wiring board has a first step of stacking adhesive layers 2A and protective layers 3 on both sides of an insulation board 1; a second step for forming through-holes 4 in these layers; a third step of removing the protective layers 3 and obtaining a first board 7 composed of the insulation board 1, through-conductors 5A and the adhesive layers 2A; a fourth step of stacking copper foil 6A on both sides of the first board 7, then heating and pressurizing the board for setting the through-conductors 5A and the adhesive layers 2A, bonding copper foil 6A to both sides of the first board 7, and forming wiring conductors 6 by processing the copper foil 6A for obtaining a second board 8 composed of the insulation board 1, the through-conductors 5, the adhesive layers 2 and the wiring conductors 6; and a fifth step of stacking two second boards 8 by sandwiching a first board 7, then heating and pressurizing the boards for setting the through- conductors 5A and the adhesive layers 2A of the first board 7, and for bonding the first board 7 and the second boards 8 and electrically connecting between the wiring conductors 6 of the second boards 8, which are positioned on the upper side and on the lower side, through the first board 7 by the through conductors 5 of the first board 7.
Abstract translation: 要解决的问题：提供一种具有高连接可靠性和全层IVH结构的所有层的多层布线板。 解决方案：多层布线板的制造方法具有在绝缘基板1的两面上堆叠粘合层2A和保护层3的第一工序; 用于在这些层中形成通孔4的第二步骤; 去除保护层3并获得由绝缘板1，贯通导体5A和粘合层2A构成的第一板7的第三步骤; 在第一板7的两面上堆叠铜箔6A的第四步骤，然后对用于设置贯通导体5A和粘合层2A的板进行加热加压，将铜箔6A接合到第一板7的两侧，以及 通过加工用于获得由绝缘板1，贯通导体5，粘合剂层2和布线导体6构成的第二基板8的铜箔6A形成布线导体6; 以及通过夹着第一板7堆叠两个第二板8的第五步骤，然后加热和加压用于设置第一板7的贯通导体5A和粘合层2A的板，并且用于将第一板7和 第二板8，并且通过第一板7的贯通导体5通过第一板7电连接位于上侧和下侧的第二板8的布线导体6。
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Patent Agency Ranking
公开(公告)号：JP2003347694A
公开(公告)日：2003-12-05
申请号：JP2002152972
申请日：2002-05-27
Applicant: Kyocera Corp , 京セラ株式会社
Inventor： KAJITA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a wiring substrate capable of forming a mark excellent in recognizability with a large color-tone difference and a large contrast ratio against surroundings.
SOLUTION: A surface of an insulating substrate 1 of an organic material, on which wiring conductors 2 are formed to adhere, is coated with a resin coating film 3 for laser marking. The resin coating film 3 consists of a white- colored first resin coating film 3a containing a titanium-oxide pigment, and a black-colored second resin coating film 3b containing a carbon pigment and adhering on the first resin coating film 3a.
COPYRIGHT: (C)2004,JPOAbstract translation: 要解决的问题：提供能够形成具有优异的可识别性的标记的布线基板，其具有大的色调差和对比度较大的对比度。 解决方案：在其上形成有布线导体2的有机材料的绝缘基板1的表面被涂覆有用于激光打标的树脂涂膜3。 树脂涂膜3由含有氧化钛颜料的白色第一树脂涂膜3a和含有碳颜料并附着在第一树脂涂膜3a上的黑色第二树脂涂膜3b组成。 版权所有（C）2004，JPO
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公开(公告)号：JP2003347726A
公开(公告)日：2003-12-05
申请号：JP2002152889
申请日：2002-05-27
Applicant: Kyocera Corp , 京セラ株式会社
Inventor： KAJITA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a substrate in which a through hole has small diameter of such as 70 to 130 μm, no breaking in penetrating conductors occurs and extremely high density wiring can be achieved.
SOLUTION: A plurality of the through holes 3 having diameters of 70 to 130 μm and enlarging their diameters outward are formed from an upper surface to a lower surface of both sides of copper-clad plate in which surface layer conductive bodies 2A, 2B comprising copper foils with a thickness of 3 to 12 μm and plated layers on the copper foil are attached to an upper and lower surfaces of an insulating resin plate 1 with a thickness of 0.2 to 0.8 mm. The penetrating conductors 4 comprising plated metal layer for connecting the surface layer conductive bodies 2A, 2B of the upper and lower surfaces are attached to an inner wall of the through holes 3.
COPYRIGHT: (C)2004,JPOAbstract translation: 要解决的问题：为了提供其中通孔具有70至130μm的小直径的基板，不会发生穿透导体的断裂，并且可以实现极高密度的布线。 解决方案：从覆铜板的两侧的上表面到下表面形成多个直径为70至130μm并且将其直径向外扩大的通孔3，其中表层导电体2A， 2B，其厚度为3〜12μm的铜箔，铜箔上的镀层以0.2〜0.8mm的厚度安装在绝缘树脂板1的上下表面。 包括用于连接上表面和下表面的表层导电体2A，2B的电镀金属层的穿透导体4附接到通孔3的内壁。（C）2004，JPO
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公开(公告)号：JPH06232288A
公开(公告)日：1994-08-19
申请号：JP1328693
申请日：1993-01-29
Applicant: KYOCERA CORP
Inventor： KAJITA SATOSHI
Abstract: PURPOSE:To provide a wiring board that can be connected with an external electric circuit board firmly and surely, by preventing a metallized pad from separating from an insulating base board effectively. CONSTITUTION:A wiring board has a plurality of metallized wiring layers. A plurality of metallized pads 3 connected electrically to the metallized layer are formed on a rear face of a rectangular insulating base board 1. A boundary part of the metallized pad 3 located in the vicinity (A) of a corner of the insulating base board 1 is supported between the rear face of the insulating base board 1 and a circular projected part 5 elongated from the rear face at a surrounding part of the insulating base board 1.
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公开(公告)号：JPH10209324A
公开(公告)日：1998-08-07
申请号：JP1036497
申请日：1997-01-23
Applicant: KYOCERA CORP
Inventor： FUJII SHUNICHI , KAJITA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To avoid breaking or cracking even due to application of an external force, by depositing wiring conductors made from a metal foil on the surface of an insulation board made by bonding an inorg. insulator powder of specified wt.% with a thermosetting resin and burying conductors bonded with a metal powder inside. SOLUTION: An insulation board 1 is composed of three insulation sheets 1a-1c, each composed of an inorg. insulator powder 60-95wt.% and thermosetting resin 5-40wt.% bonding the powder. Wiring conductors 2 composed of metal foils e.g. Cu foils are overlaid on the upper and lower surfaces of the board 1, and wiring conductors 3 composed of a Cu or other metal powder bonded with a thermosetting resin are buried therein. This avoids causing breaking or cracking the insulation board 1 even if the wiring boards collide each other or with part of a semiconductor device.
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公开(公告)号：JPH1050890A
公开(公告)日：1998-02-20
申请号：JP20048796
申请日：1996-07-30
Applicant: KYOCERA CORP
Inventor： KAJITA SATOSHI
Abstract: PROBLEM TO BE SOLVED: To make wiring fine, and provide a high density wiring board by coating an insulating board, which is formed by bonding specific inorganic insulating powder by specific thermosetting resin, with a wiring conductor, which is formed by boding metal powder by thermosetting resin and thermoplastic resin. SOLUTION: An insulating base 1 is formed by laminating three insulating boards 1a, 1b and 1c, a recessed part 1d is provided at the center of the top plane, and a semiconductor element 3 is bonded and fixed with adhesive such as resin. The insulating boards 1a, 1b and 1c which form the insulating base 1 contain inorganic insulating powder at 60-95wt.%, and thermosetting resin at 5-40wt.%, and the area from the periphery of the recessed part 1d to the bottom plane is coated with wiring conductor 2, which is formed by bonding metal powder by thermosetting resin such as epoxy resin and thermoplastic resin such as acrylic resin. Thus, high density wiring board with fine wiring is obtained.
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