유로 부재
    1.
    发明公开
    유로 부재 审中-公开
    流量成员

    公开(公告)号:KR20180030689A

    公开(公告)日:2018-03-23

    申请号:KR20187004933

    申请日:2016-08-26

    Applicant: KYOCERA CORP

    CPC classification number: C04B41/80 F28F1/04 F28F3/12 F28F21/04

    Abstract: 본개시의유로부재는비산화물세라믹스로이루어지는베이스체의내부에유입구와유출구를구비하는유로를갖고, 상기베이스체의외면에제 1 산화층을구비한다.

    Abstract translation: 本发明的流路部件具有具有入口和在由非氧化物陶瓷的基体的内部的出口,设置有在基体的外表面上的第一氧化物层的流路。

    CERAMIC SINTERED COMPACT, CIRCUIT BOARD USING THE SAME, ELECTRONIC DEVICE AND THERMOELECTRIC CONVERSION MODULE
    4.
    发明公开
    CERAMIC SINTERED COMPACT, CIRCUIT BOARD USING THE SAME, ELECTRONIC DEVICE AND THERMOELECTRIC CONVERSION MODULE 有权
    GESINTERTER KERAMIKPRESSLING,LEITERPLATTE DAMIT,ELEKTRONISCHE VORRICHTUNG UND THERMOELEKTRISCHES UMWANDLUNGSMODUL

    公开(公告)号:EP2546216A4

    公开(公告)日:2013-12-18

    申请号:EP11753404

    申请日:2011-03-09

    Applicant: KYOCERA CORP

    Abstract: [Problem] There are provided a ceramic sintered body with superior thermal conductivity as well as high rigidity, a circuit board that does not crack easily, a highly reliable electronic device and a highly reliable thermoelectric conversion module. [Solution] A ceramic sintered body with superior thermal conductivity as well as high rigidity may be obtained by having a main crystalline phase predominantly composed of silicon nitride, and a grain boundary phase predominantly composed of magnesium oxide and rare-earth oxide, the grain boundary phase containing a component which is expressed in compositional formula form as: REMgSi 2 O 5 N, where RE represents rare-earth metal. Furthermore, when the ceramic sintered body is used in a circuit board, the circuit board does not crack easily and a highly reliable circuit board may be formed. An electronic device and thermoelectric conversion module that use this circuit board may be made highly reliable.

    Abstract translation: 提供一种导热性优异且刚性高的陶瓷烧结体,不容易开裂的电路基板,高可靠性的电子设备以及高可靠性的热电转换模块。 通过具有主要由氮化硅组成的主结晶相和主要由氧化镁和稀土氧化物组成的晶界相,可以获得具有优异导热性和高刚性的陶瓷烧结体,晶界 其包含以组成式形式表示的组分:REMgSi 2 O 5 N,其中RE代表稀土金属。 此外,当陶瓷烧结体用于电路板时,电路板不容易破裂,并且可以形成高度可靠的电路板。 使用该电路板的电子器件和热电转换模块可以高度可靠。

    Silicon nitride sintered compact, and circuit board and electronic device using the same
    7.
    发明专利
    Silicon nitride sintered compact, and circuit board and electronic device using the same 有权
    氮化硅烧结紧固件,电路板和使用其的电子器件

    公开(公告)号:JP2013203633A

    公开(公告)日:2013-10-07

    申请号:JP2012076856

    申请日:2012-03-29

    Abstract: PROBLEM TO BE SOLVED: To provide a silicon nitride sintered compact which has high dielectric strength and a superior heat-dissipating property and mechanical property, and a circuit board and an electronic device using the same.SOLUTION: A silicon nitride sintered compact includes silicon nitride as the major constituent, magnesium, a rare earth element and aluminum in an amount not less than 2 mass% and not more than 6 mass%, not less than 4 mass% and not more than 10 mass%, and not less than 0.1 mass% and not more than 0.5 mass% respectively, includes β-SiNas a main crystal phase and a grain boundary phase containing a component expressed by the compositional formula: RESiNO(RE is a rare earth element). The ratio of the first peak intensity Iof RESiNOat a diffraction angle of 30°-35° to the first peak intensity Iof β-SiNat a diffraction angle of 27°-28° (I/I) as determined by X-ray diffractometry is not greater than 20% (excluding 0%).

    Abstract translation: 要解决的问题:提供一种具有高介电强度和优异的散热性能和机械性能的氮化硅烧结体,以及使用其的电路板和电子器件。解决方案:氮化硅烧结体包括氮化硅 作为主要成分的镁,稀土元素和铝的量不小于2质量%且不大于6质量%,不低于4质量%且不大于10质量%,并且不小于0.1质量% %以上且0.5质量%以下,包括主要结晶相和含有由组成式表示的成分的晶界相:RESiNO(RE为稀土元素)。 衍射角为30°-35°的第一峰强度I与通过X射线衍射测定的衍射角为27°-28°(I / I)的第一峰强度Iof&bgr; -SiN的比率为 不超过20%(不包括0%)。

    Composite
    8.
    发明专利
    Composite 审中-公开
    综合

    公开(公告)号:JP2013023413A

    公开(公告)日:2013-02-04

    申请号:JP2011160017

    申请日:2011-07-21

    Abstract: PROBLEM TO BE SOLVED: To provide a composite formed by fitting a first member firmly with a second member, the fitting being hardly loosened, and hardly loosening the fitting.SOLUTION: This composite is formed by fitting a first member 1 in which a ceramic sintered compact containing silicon nitrate as a main component is used as a base body 1a with a second member 2 comprising a metal or graphite, wherein, a granular material 1b containing silicon is integrated with the surface of the first member 1 having a contact with the second member 2, and at least either of needle crystals 1c and columnar crystals 1d containing silicon nitrate as a main component are extended plurally from a part of the granular material 1b.

    Abstract translation: 要解决的问题:为了提供通过将第一构件与第二构件牢固地配合而形成的复合体,配件几乎不松动,并且几乎不松动配件。 解决方案:该复合材料通过配合第一构件1形成,其中使用包含硝酸铈作为主要成分的陶瓷烧结体作为基体1a,其中第二构件2包括金属或石墨,其中,颗粒状 含有硅的材料1b与第一构件1的与第二构件2接触的表面一体化,并且以晶体1c和包含硝酸铯为主要成分的柱状晶体1d中的至少一个从多个部分延伸 颗粒材料1b。 版权所有(C)2013,JPO&INPIT

    試料支持部材
    9.
    发明专利
    試料支持部材 审中-公开

    公开(公告)号:JP2017117935A

    公开(公告)日:2017-06-29

    申请号:JP2015251767

    申请日:2015-12-24

    Abstract: 【課題】試料との接触を繰り返しても、試料に微細な傷を付けにくいとともに、パーティクルが発生しにくい試料支持部材を提供する。【解決手段】本発明の試料支持部材10は炭化珪素質セラミックスからなる基体1と、基体1上に位置し、支持面2を有する突起部3とを備える。そして、支持面2には金属珪素4および炭化珪素粒子5が存在し、支持面2において、金属珪素4および炭化珪素粒子5が占める面積比率の合計を100%としたとき、金属珪素4が占める面積比率が69%以上97%以下であるとともに、炭化珪素粒子5が占める面積比率が3%以上31%以下である。【選択図】図1

    Ceramic sintered compact, heat dissipating substrate and electronic device
    10.
    发明专利
    Ceramic sintered compact, heat dissipating substrate and electronic device 审中-公开
    陶瓷烧结紧凑,散热基板和电子设备

    公开(公告)号:JP2010235335A

    公开(公告)日:2010-10-21

    申请号:JP2009082541

    申请日:2009-03-30

    CPC classification number: H01L2924/0002 H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To solve such the problem that the demand of reliability on insulation performance is not necessarily sufficient because higher reliability is required nowadays although a conventional ceramic circuit substrate has superior heat resistant cycle characteristics and bending strength characteristics. SOLUTION: A ceramic sintered compact is characterized by including a main ingredient of silicon nitride and a grain boundary phase containing a rare earth metal oxide and by the number of the grain boundary phases in the range of an area at an optional cross section of 100 μm 2 being 42. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 解决的问题为了解决绝缘性能可靠性的需求不一定是足够的问题,因为现有的陶瓷电路基板具有优异的耐热循环特性和弯曲强度特性,因此需要更高的可靠性。 解决方案:陶瓷烧结体的特征在于包括氮化硅的主要成分和含有稀土金属氧化物的晶界相,并且在任意的截面积的范围内包括晶界相数 (P)版权所有(C)2011,JPO&INPIT

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