Abstract:
Provided is a silicon nitride substrate capable of enhancing the bond strength when a member made of a metal is bonded to the substrate, and a circuit substrate and an electronic device capable of improving reliability by using the silicon nitride substrate. The silicon nitride substrate 1 comprises a substrate 1a comprising a silicon nitride sintered body, and a plurality of granular bodies 1b containing silicon and integrated to a principal surface of the substrate 1a, wherein a plurality of needle crystals 1c or column crystals 1d comprising mainly silicon nitride are extended from a portion of the granular bodies 1b. A brazing material is applied to a principal surface of the substrate 1a, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies 1b integrated to the principal surface of the substrate 1a, and a plurality of the needle crystals 1c or the column crystals 1d extended from a portion of the granular bodies 1b, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate 1.
Abstract:
[Object] Provided are a flow channel member having high heat-exchange efficiency in addition to high corrosion resistance and high mechanical characteristics, a heat exchanger including the flow channel member, and a semiconductor module including the flow channel member. [Solution] A flow channel member 10 according to the present invention includes a ceramic substrate 1, a flow channel 3 inside the ceramic substrate 1 through which a fluid flows, and multiple protrusions 2 on an outer surface of the substrate 1. The flow channel member 10 according to the present invention having such a configuration has high heat-exchange efficiency in addition to high corrosion resistance and high mechanical characteristics.
Abstract:
[Problem] There are provided a ceramic sintered body with superior thermal conductivity as well as high rigidity, a circuit board that does not crack easily, a highly reliable electronic device and a highly reliable thermoelectric conversion module. [Solution] A ceramic sintered body with superior thermal conductivity as well as high rigidity may be obtained by having a main crystalline phase predominantly composed of silicon nitride, and a grain boundary phase predominantly composed of magnesium oxide and rare-earth oxide, the grain boundary phase containing a component which is expressed in compositional formula form as: REMgSi 2 O 5 N, where RE represents rare-earth metal. Furthermore, when the ceramic sintered body is used in a circuit board, the circuit board does not crack easily and a highly reliable circuit board may be formed. An electronic device and thermoelectric conversion module that use this circuit board may be made highly reliable.
Abstract translation:提供一种导热性优异且刚性高的陶瓷烧结体,不容易开裂的电路基板,高可靠性的电子设备以及高可靠性的热电转换模块。 通过具有主要由氮化硅组成的主结晶相和主要由氧化镁和稀土氧化物组成的晶界相,可以获得具有优异导热性和高刚性的陶瓷烧结体,晶界 其包含以组成式形式表示的组分:REMgSi 2 O 5 N,其中RE代表稀土金属。 此外,当陶瓷烧结体用于电路板时,电路板不容易破裂,并且可以形成高度可靠的电路板。 使用该电路板的电子器件和热电转换模块可以高度可靠。
Abstract:
PROBLEM TO BE SOLVED: To provide a silicon nitride sintered compact which has high dielectric strength and a superior heat-dissipating property and mechanical property, and a circuit board and an electronic device using the same.SOLUTION: A silicon nitride sintered compact includes silicon nitride as the major constituent, magnesium, a rare earth element and aluminum in an amount not less than 2 mass% and not more than 6 mass%, not less than 4 mass% and not more than 10 mass%, and not less than 0.1 mass% and not more than 0.5 mass% respectively, includes β-SiNas a main crystal phase and a grain boundary phase containing a component expressed by the compositional formula: RESiNO(RE is a rare earth element). The ratio of the first peak intensity Iof RESiNOat a diffraction angle of 30°-35° to the first peak intensity Iof β-SiNat a diffraction angle of 27°-28° (I/I) as determined by X-ray diffractometry is not greater than 20% (excluding 0%).
Abstract:
PROBLEM TO BE SOLVED: To provide a composite formed by fitting a first member firmly with a second member, the fitting being hardly loosened, and hardly loosening the fitting.SOLUTION: This composite is formed by fitting a first member 1 in which a ceramic sintered compact containing silicon nitrate as a main component is used as a base body 1a with a second member 2 comprising a metal or graphite, wherein, a granular material 1b containing silicon is integrated with the surface of the first member 1 having a contact with the second member 2, and at least either of needle crystals 1c and columnar crystals 1d containing silicon nitrate as a main component are extended plurally from a part of the granular material 1b.
Abstract:
PROBLEM TO BE SOLVED: To solve such the problem that the demand of reliability on insulation performance is not necessarily sufficient because higher reliability is required nowadays although a conventional ceramic circuit substrate has superior heat resistant cycle characteristics and bending strength characteristics. SOLUTION: A ceramic sintered compact is characterized by including a main ingredient of silicon nitride and a grain boundary phase containing a rare earth metal oxide and by the number of the grain boundary phases in the range of an area at an optional cross section of 100 μm 2 being 42. COPYRIGHT: (C)2011,JPO&INPIT