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    CIRCUIT BOARD AND ELECTRONIC DEVICE PROVIDED WITH SAME
    2.
    发明公开
    CIRCUIT BOARD AND ELECTRONIC DEVICE PROVIDED WITH SAME 审中-公开
    LELERPLATTE UND ELEKTRONISCHE VORRICHTUNG DAMIT

    公开(公告)号：EP2720520A4

    公开(公告)日：2015-05-27

    申请号：EP12797274

    申请日：2012-05-30

    Applicant: KYOCERA CORP

    Inventor： NAKAMURA KIYOTAKA ,  OHASHI YOSHIO ,  ABE YUUICHI ,  HIRANO EISUKE ,  SHIKATA KUNIHIDE ,  SEKIGUCHI KEIICHI

    IPC: H05K1/11 ,  H01L23/13 ,  H01L23/14 ,  H05K1/09

    CPC classification number: H05K1/09 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/0266 ,  H05K2201/0326 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: [Problem] To provide a highly-reliable circuit board and an electronic device obtained by mounting electronic components on the circuit board, which have high bonding strength and excellent heat discharge properties, and can be used over a long period as a result of minimizing cavities in a metal wiring layer formed on a through conductor. [Solution] A circuit board (10) is provided with a through conductor (13) comprising a metal in a through hole (12) that penetrates in the thickness direction of a ceramic sintered body (11), and a metal wiring layer (14) that covers and is connected to the surface of the through conductor (13) on at least one main surface side of the ceramic sintered body (11). The through conductor (13) comprises: a first portion (13a) that is positioned on an inner wall side of the through hole (12), from one end to the other end of the through hole (12) in the thickness direction of the ceramic sintered body (11); and a second portion (13b) that adjoins the first portion (13a). The average crystal grain size in the second portion (13b) is larger than the average crystal grain size in the first portion (13a).

    Abstract translation: [问题]提供一种高可靠性的电路板和通过将电子部件安装在电路板上而获得的电路板和电子器件，其具有高的接合强度和优异的散热性能，并且由于使空腔最小化，可以长时间使用 在形成在贯通导体上的金属布线层中。 电路板（10）在贯通陶瓷烧结体（11）的厚度方向的贯通孔（12）中设置贯通导体（13），该穿通导体（13）具有金属，金属配线层（14） ），其在陶瓷烧结体（11）的至少一个主表面侧覆盖并连接到贯通导体（13）的表面。 贯通导体（13）包括：第一部分（13a），其位于通孔（12）的内壁侧，从通孔（12）的一端到另一端沿着该通孔的厚度方向 陶瓷烧结体（11）; 和邻接第一部分（13a）的第二部分（13b）。 第二部分（13b）中的平均晶粒尺寸大于第一部分（13a）中的平均晶粒尺寸。

    Circuit board and electronic apparatus including the same
    4.
    发明专利
    Circuit board and electronic apparatus including the same 有权
    电路板和电子设备，包括它们

    公开(公告)号：JP2013030616A

    公开(公告)日：2013-02-07

    申请号：JP2011165650

    申请日：2011-07-28

    Applicant: Kyocera Corp ,  京セラ株式会社

    Inventor： NAKAMURA KIYOTAKA ,  OHASHI YOSHIO ,  ABE YUICHI ,  HIRANO OSUKE ,  SEKIGUCHI KEIICHI ,  YOMO KUNIHIDE

    IPC: H05K1/09 ,  H05K1/02

    Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable circuit board available over a long period of time in which a ceramic sintered body and a metal wiring layer can be bonded rigidly, and are not peeled off by the thermal cycle due to the heat generated by operation of an electronic component or repetition of operation, and to provide an electronic device obtained by mounting an electronic component on the circuit board.SOLUTION: In a circuit board 10 including a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, the average diameter of holes is 2-10 μm in an arbitrary cross section of the metal wiring layer 12, the average area occupation rate of holes is 1-4 area%, and the average inter-centroid distance of holes is 7-15 μm.

    Abstract translation: 要解决的问题：为了提供高可靠性的电路板，其长时间可以被陶瓷烧结体和金属布线层刚性地粘合，并且由于热循环不会被剥离 通过电子部件的操作产生的热量或重复操作，并且提供通过将电子部件安装在电路板上而获得的电子设备。 解决方案：在包括陶瓷烧结体11的至少一个主表面上的金属布线层12的电路板10中，在金属布线层12的任意截面中，孔的平均直径为2-10μm 孔的平均占地率为1-4面积％，孔的平均中心距为7-15μm。 版权所有（C）2013，JPO＆INPIT

    Electroconductive paste and circuit board as well as electronic device
    5.
    发明专利
    Electroconductive paste and circuit board as well as electronic device 有权
    电焊膏和电路板作为电子设备

    公开(公告)号：JP2014086398A

    公开(公告)日：2014-05-12

    申请号：JP2012236961

    申请日：2012-10-26

    Applicant: Kyocera Corp ,  京セラ株式会社

    Inventor： OHASHI YOSHIO ,  YOMO KUNIHIDE

    IPC: H01B1/22 ,  H01B5/14 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24

    Abstract: PROBLEM TO BE SOLVED: To provide an electroconductive paste yielding a metal wiring layer having a favorable plating deposition friendliness and a circuit board wherein a ceramic sintered compact possesses a metal wiring layer consisting of this electroconductive paste as well as an electronic device obtained by loading electronic components on this circuit board.SOLUTION: The provided electroconductive paste includes a metal powder, an alumina powder, a glass powder, and an organic vehicle, whereas the average particle diameter of the alumina powder is smaller than the average particle diameter of the glass powder. A circuit board 10 wherein a ceramic sintered compact 11 possesses a metal wiring layer 12 consisting of this electroconductive paste and wherein the metal wiring layer 12 is at least partially covered with a plating layer 13 is also provided. An electronic device 20 wherein electronic components 21 are loaded on this circuit board 10 is also provided.

    Abstract translation: 要解决的问题：为了提供产生具有良好的电镀沉积友好性的金属布线层的导电浆料和电路板，其中陶瓷烧结体具有由该导电浆料组成的金属布线层以及通过加载电子器件而获得的电子器件 该电路板上的组件。所提供的导电浆料包括金属粉末，氧化铝粉末，玻璃粉末和有机载体，而氧化铝粉末的平均粒径小于玻璃粉末的平均粒径 。 电路板10，其中陶瓷烧结体11具有由该导电浆料组成的金属布线层12，并且其中金属布线层12至少部分被镀层13覆盖。 还提供了一种电子装置20，其中电子部件21装载在该电路板10上。

    Circuit board and electronic apparatus equipped with the same
    6.
    发明专利
    Circuit board and electronic apparatus equipped with the same 有权
    电路板和与此相同的电子设备

    公开(公告)号：JP2013157389A

    公开(公告)日：2013-08-15

    申请号：JP2012015409

    申请日：2012-01-27

    Applicant: Kyocera Corp ,  京セラ株式会社

    Inventor： NAKAMURA KIYOTAKA ,  OHASHI YOSHIO ,  YOMO KUNIHIDE

    IPC: H05K1/09 ,  H01L23/12

    CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/45099

    Abstract: PROBLEM TO BE SOLVED: To provide a circuit board in which a metal wiring layer has excellent heat radiation characteristics capable of quickly radiating heat generated by an operation of an electronic component, and which has high reliability and long-term usability by improving an adhesion strength between a ceramic sintered body and the metal wiring layer thereby to decrease separation of the metal wiring layer due to a cooling cycle when an operation and non-operation of the electronic are repeated, and provide an electronic apparatus in which electronic components are mounted on the circuit board.SOLUTION: A circuit board comprises a metal wiring layer on at least one principal surface of a ceramic sintered body. The metal wiring layer contains a glass component. The number of pores having an equivalent circle diameter of 0.2 μm or more and 1.1 μm or less per unit area in a unit area of the metal wiring layer is 35% or more and 65% or less with respect to the total number of pores.

    Abstract translation: 要解决的问题：提供一种电路板，其中金属布线层具有优异的散热特性，能够快速地辐射由电子部件的操作产生的热量，并且通过提高粘合强度具有高可靠性和长期可用性 在陶瓷烧结体与金属配线层之间，由于在重复电子设备的动作和不操作时，由于冷却循环而导致的金属配线层的分离，并且提供了将电子部件安装在 电路板。解决方案：电路板包括在陶瓷烧结体的至少一个主表面上的金属布线层。 金属布线层含有玻璃成分。 金属布线层的单位面积的单位面积的当量圆直径为0.2μm以上且1.1μm以下的孔的数量相对于总孔数为35％以上且65％以下。

    Circuit board and electronic device including the same
    7.
    发明专利
    Circuit board and electronic device including the same 有权
    电路板和电子设备，包括它们

    公开(公告)号：JP2013135054A

    公开(公告)日：2013-07-08

    申请号：JP2011283676

    申请日：2011-12-26

    Applicant: Kyocera Corp ,  京セラ株式会社

    Inventor： NAKAMURA KIYOTAKA ,  OHASHI YOSHIO ,  YOMO KUNIHIDE ,  SEKIGUCHI KEIICHI

    IPC: H01L23/36 ,  H01L23/15

    CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable circuit board which can be used over a long term, and to provide an electronic device obtained by mounting an electronic component on the circuit board.SOLUTION: In a circuit board, a metal wiring layer is provided on at least one principal surface of a ceramic sintered compact, and the metal wiring layer consists of a first region in contact with the principal surface, and a second region on the first region. In a cross section perpendicular to the principal surface, the mean area occupation rate of pores in the second region is smaller than the mean area occupation rate of pores in the first region, and 0.1 area% or less.

    Abstract translation: 要解决的问题：提供可长期使用的高度可靠的电路板，并提供通过将电子部件安装在电路板上而获得的电子装置。解决方案：在电路板中，金属布线层为 提供在陶瓷烧结体的至少一个主表面上，并且所述金属布线层由与所述主表面接触的第一区域和所述第一区域上的第二区域组成。 在垂直于主表面的截面中，第二区域的孔的平均面积占有率小于第一区域的孔的平均面积占有率，0.1面积％以下。

    Circuit board and electronic apparatus including the same
    8.
    发明专利
    Circuit board and electronic apparatus including the same 审中-公开
    电路板和电子设备，包括它们

    公开(公告)号：JP2013051253A

    公开(公告)日：2013-03-14

    申请号：JP2011187282

    申请日：2011-08-30

    Applicant: Kyocera Corp ,  京セラ株式会社

    Inventor： SEKIGUCHI KEIICHI ,  ABE YUICHI ,  HIRANO OSUKE ,  NAKAMURA KIYOTAKA ,  OHASHI YOSHIO ,  YOMO KUNIHIDE

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40

    Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable circuit board which allows through holes to be formed into shapes that are less likely to dent while outer shapes of the through holes in a plain view of a substrate are being increased, thereby improving the heat radiation performance and enabling the long term use, and to provide an electronic apparatus formed by mounting electronic components on the circuit board.SOLUTION: A circuit board 10 includes: a base substrate 11 formed by a ceramic sintered body where through holes 12, penetrating from one main surface to the other main surface, are provided; through conductors 13 respectively provided in the through holes 12; and metal wiring layers 14 provided on at least any of the main surfaces of the base substrate 11 and electrically connecting with the through electrodes 13. In the plain view of the base substrate 11, the outer shape of each through hole 12 has a shape formed by joining multiple circles.

    Abstract translation: 要解决的问题：提供一种高度可靠的电路板，其允许通孔形成为不太可能凹陷的形状，而在基板的平面图中的通孔的外形增加，从而改善 热辐射性能并且能够长期使用，并且提供通过将电子部件安装在电路板上而形成的电子设备。 电路板10包括：由陶瓷烧结体形成的基底基板11，其中设置从一个主表面到另一个主表面穿透的通孔12; 分别设置在通孔12中的贯通导体13; 以及金属布线层14，其设置在基底基板11的至少任一个主表面上，并且与贯通电极13电连接。在基板11的平面图中，各贯通孔12的外形形成 加入多个圈子。 版权所有（C）2013，JPO＆INPIT

    Circuit board and electronic apparatus using the same
    9.
    发明专利
    Circuit board and electronic apparatus using the same 审中-公开
    电路板和使用该电路的电子设备

    公开(公告)号：JP2012209355A

    公开(公告)日：2012-10-25

    申请号：JP2011072607

    申请日：2011-03-29

    Applicant: Kyocera Corp ,  京セラ株式会社

    Inventor： NAKAMURA KIYOTAKA ,  HIRANO OSUKE ,  OHASHI YOSHIO ,  YOMO KUNIHIDE

    IPC: H05K1/02

    Abstract: PROBLEM TO BE SOLVED: To provide a circuit board improving heat radiation performance, and to provide an electronic apparatus using the circuit board.SOLUTION: A circuit board has a glass layer 12 on a surface of a substrate 11, and metal wiring layers 13 composed mainly of copper are provided on an upper surface of the glass layer 12 so as to be spaced away from each other. Further, copper oxide 14a exists on the upper surface of the glass layer 12 located between the adjacent metal wiring layers 13. These features improve heat radiation characteristics. Further, if an electronic component 15 is mounted on the above-described circuit board 1, a highly reliable electronic apparatus 3 is obtained.

    Abstract translation: 要解决的问题：提供一种提高散热性能的电路板，并提供使用电路板的电子设备。 解决方案：电路板在基板11的表面上具有玻璃层12，并且主要由铜构成的金属布线层13设置在玻璃层12的上表面上以彼此间隔开 。 此外，位于相邻的金属布线层13之间的玻璃层12的上表面上存在氧化铜14a。这些特征提高了散热特性。 此外，如果将电子部件15安装在上述电路板1上，则获得高可靠性的电子设备3。 版权所有（C）2013，JPO＆INPIT

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