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Patent Agency Ranking
公开(公告)号：US20160150642A1
公开(公告)日：2016-05-26
申请号：US14779232
申请日：2014-03-26
Applicant: KYOCERA CORPORATION
Inventor： Satoshi KAJITA , Mitsuhiro HAGIHARA , Yuuhei MATSUMOTO
CPC classification number: H05K1/0306 , H05K1/0298 , H05K1/036 , H05K1/09 , H05K1/115 , H05K1/181 , H05K3/0038 , H05K3/421 , H05K3/4602 , H05K3/4655 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0266 , H05K2201/09845 , H05K2201/09854 , H05K2201/09863 , H05K2201/2072
Abstract: A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.
Abstract translation: 布线板包括：无机绝缘层，其具有形成为在其厚度方向上穿透无机绝缘层的通孔; 设置在无机绝缘层上的导电层; 以及通孔导体，其粘附到通孔的内壁并与导电层连接。 无机绝缘层包括：第一部分，其包括彼此部分连接的多个无机绝缘颗粒，以及位于无机绝缘颗粒之间的间隙中的树脂部分和介于第一部分和通孔导体之间的第二部分， 包括彼此部分连接的多个无机绝缘颗粒和由位于无机绝缘颗粒之间的间隙中的通孔导体的一部分组成的导电部分。
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公开(公告)号：US20220002522A1
公开(公告)日：2022-01-06
申请号：US17293264
申请日：2018-11-15
Applicant: KYOCERA Corporation
Inventor： Satoshi KAJITA , Yasuhide TAMI
Abstract: A flame retardant is included in a resin phase, and the flame retardant has a maximum number frequency in a range of 1 μm or less when a particle size distribution is evaluated by dividing a particle size into 1 μm increments. The resin phase includes inorganic particles, and the inorganic particles have a maximum number frequency in a range of 0.5 μm or less when the particle size distribution is evaluated by dividing the particle size into 0.5 μm increments. The flame retardant has an average particle size larger than the average particle size of inorganic particles. The number frequency of the flame retardant and the inorganic particles, respectively, decreases with increasing the particle size.
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公开(公告)号：US20210260847A1
公开(公告)日：2021-08-26
申请号：US17254881
申请日：2019-06-20
Applicant: KYOCERA Corporation
Inventor： Tadashi NAGASAWA , Satoshi YOSHIURA , Chie CHIKARA , Satoshi KAJITA , Yasuhide TAMI
IPC: B32B3/26 , C08J5/18 , C08K3/36 , C08K5/03 , C08K13/02 , C09K21/08 , H05K1/03 , B32B15/08 , B32B27/08 , B32B27/20
Abstract: A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.
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公开(公告)号：US20200077514A1
公开(公告)日：2020-03-05
申请号：US16319183
申请日：2017-07-19
Applicant: KYOCERA Corporation
Inventor： Tadashi NAGASAWA , Chie CHIKARA , Satoshi KAJITA
IPC: H05K1/03 , B32B15/085 , C08K5/14 , H05K1/09
Abstract: There is provided an organic insulating body which contains a cyclic olefin copolymer as a main component and a peroxide having a benzene ring, and has such a property that a loss tangent peak appears at 120° C. or higher in a dynamic mechanical analysis.
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公开(公告)号：US20230209708A1
公开(公告)日：2023-06-29
申请号：US17927479
申请日：2021-05-24
Applicant: KYOCERA Corporation
Inventor： Chie CHIKARA , Tadashi NAGASAWA , Satoshi YOSHIURA , Satoshi KAJITA , Kouji FUJIKAWA
CPC classification number: H05K1/0373 , H05K1/0256 , H05K2201/0158
Abstract: An organic insulator is produced by cured resin product containing a cyclic olefin copolymer as a main component and has a cumulative luminescence amount measured by chemiluminescence measurement method of 3.7×105 cpm or less. The glass transition temperature of the cured product is from 134° C. to 140° C. The cumulative luminescence amount is from 2.8×105 cpm to 3.2×105 cpm. A wiring board includes an insulation layer and an electrical conductor layer disposed on a surface of the insulation layer, and the insulation layer is the organic insulator described above.
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