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公开(公告)号:EP4166087A1
公开(公告)日:2023-04-19
申请号:EP21822144.8
申请日:2021-02-01
Applicant: Korea Institute of Science and Technology
Inventor: LEE, Byung Chul , KANG, Dong-Hyun , SHIM, Shinyong
Abstract: The present invention relates to a method for determining the relative positions of arrays of a flexible array device. The flexible array device, according to one embodiment, comprises a plurality of arrays which are arranged at predetermined intervals in a deformable substrate, and the method for determining the relative positions of the arrays comprises the steps of: measuring a first capacitance for adjacent arrays; measuring a second capacitance for the adjacent arrays after the deformation of the substrate; and determining the relative positions of the adjacent arrays on the basis of measurement values of the first capacitance and second capacitance. According to the embodiment, capacitance between adjacent arrays are measured for the plurality of arrays arranged in the deformable substrate, and a change in the capacitance caused by deformation (shrinkage, expansion, warpage, etc.) of the substrate is measured, and thus the relative positions of the arrays may be determined.
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公开(公告)号:EP4032619A1
公开(公告)日:2022-07-27
申请号:EP21193052.4
申请日:2021-08-25
Applicant: Korea Institute of Science and Technology
Inventor: LEE, Byung Chul , KANG, Dong-Hyun , SHIM, Shinyong , KIM, Dong Jun , PARK, Jin Soo , PAHK, Ki Joo , SEONG, Hyejeong
Abstract: A mesh type atomizer according to an embodiment includes a porous thin film having a multi-hole structure, a metal layer covering a remaining area except a nozzle area in which droplets are sprayed through the holes on a surface of the porous thin film, and an ultrasonic transducer to output ultrasonic waves to vibrate the porous thin film. According to an embodiment, it is possible to atomize a liquid into nanometer-level fine particles using the porous thin film including nanometer sized holes. It is possible to precisely adjust the sprayed droplet size by setting the shape, size and cycle of the nozzle in the manufacturing process, and it is possible to selectively increase the strength of the mesh by growing the metal material in the hole of the porous thin film through electroplating.
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