公开(公告)号：WO2013138085A3

公开(公告)日：2015-07-02

申请号：PCT/US2013028491

申请日：2013-03-01

Applicant: LAM RES CORP

Inventor： MCCHESNEY JON ,  PANAGOPOULOS THEO ,  PATERSON ALEX ,  BLAIR CRAIG

IPC: H01L21/331

CPC classification number: H01J37/32477 ,  C23C16/4404 ,  H01J37/321 ,  H01J37/32458 ,  H01L21/30655

Abstract: A chamber filler kit [or an inductively coupled plasma processing chamber in which semiconductor substrates are processed by inductively coupling RF energy through a window facing a substrate supported on a cantilever chuck. The kit includes at least one chamber filler which reduces the lower chamber volume in the chamber below the chuck. The fillers of the kit can be mounted in a standard chamber having a chamber volume of over 60 liters and by using different sized chamber fillers it is possible to reduce the chamber volume to provide desired gas flow conductance and accommodate changes in vacuum pressure during processing of the substrate.

Abstract translation: 腔室填充器套件[或电感耦合等离子体处理室，其中通过将RF能量通过面向支撑在悬臂卡盘上的衬底的窗口感应耦合而处理半导体衬底。 该套件包括至少一个室填充物，其减小了在卡盘下方的室中的下室体积。 套件的填充物可以安装在具有超过60升的室容积的标准室中，并且通过使用不同尺寸的室填料，可以减小室体积以提供期望的气体流动传导并适应处理过程中真空压力的变化 底物。

公开(公告)号：SG11201405505QA

公开(公告)日：2014-10-30

申请号：SG11201405505Q

申请日：2013-03-01

Applicant: LAM RES CORP

Inventor： MCCHESNEY JON ,  PANAGOPOULOS THEO ,  PATERSON ALEX ,  BLAIR CRAIG

IPC: H01L21/3065