SYSTEM AND METHOD FOR TESTING AN ELECTROSTATIC CHUCK
    1.
    发明申请
    SYSTEM AND METHOD FOR TESTING AN ELECTROSTATIC CHUCK 审中-公开
    用于测试静电卡盘的系统和方法

    公开(公告)号:WO2010042908A2

    公开(公告)日:2010-04-15

    申请号:PCT/US2009060290

    申请日:2009-10-10

    CPC classification number: H01L21/6833

    Abstract: The present invention provides a reliable, non-invasive, electrical test method for predicting satisfactory performance of electrostatic chucks (ESCs). In accordance with an aspect of the present invention, a parameter, e.g., impedance, of an ESC is measured over a frequency band to generate a parameter functions. This parameter function may be used to establish predetermined acceptable limits of the parameter within the frequency band.

    Abstract translation: 本发明提供了用于预测静电卡盘(ESC)的令人满意的性能的可靠的非侵入式电测试方法。 根据本发明的一个方面,在频带上测量ESC的参数,例如阻抗,以产生参数功能。 该参数功能可用于建立频带内参数的预定可接受极限。

    CHAMBER FILLER KIT FOR PLASMA ETCH CHAMBER USEFUL FOR FAST GAS SWITCHING
    2.
    发明申请
    CHAMBER FILLER KIT FOR PLASMA ETCH CHAMBER USEFUL FOR FAST GAS SWITCHING 审中-公开
    用于快速气体切换的等离子体气室的室内填充试剂盒

    公开(公告)号:WO2013138085A3

    公开(公告)日:2015-07-02

    申请号:PCT/US2013028491

    申请日:2013-03-01

    Applicant: LAM RES CORP

    Abstract: A chamber filler kit [or an inductively coupled plasma processing chamber in which semiconductor substrates are processed by inductively coupling RF energy through a window facing a substrate supported on a cantilever chuck. The kit includes at least one chamber filler which reduces the lower chamber volume in the chamber below the chuck. The fillers of the kit can be mounted in a standard chamber having a chamber volume of over 60 liters and by using different sized chamber fillers it is possible to reduce the chamber volume to provide desired gas flow conductance and accommodate changes in vacuum pressure during processing of the substrate.

    Abstract translation: 腔室填充器套件[或电感耦合等离子体处理室,其中通过将RF能量通过面向支撑在悬臂卡盘上的衬底的窗口感应耦合而处理半导体衬底。 该套件包括至少一个室填充物,其减小了在卡盘下方的室中的下室体积。 套件的填充物可以安装在具有超过60升的室容积的标准室中,并且通过使用不同尺寸的室填料,可以减小室体积以提供期望的气体流动传导并适应处理过程中真空压力的变化 底物。

    SYSTEM AND METHOD FOR TESTING AN ELECTROSTATIC CHUCK

    公开(公告)号:SG194409A1

    公开(公告)日:2013-11-29

    申请号:SG2013074539

    申请日:2009-10-10

    Applicant: LAM RES CORP

    Abstract: SYSTEM AND METHOD FOR TESTING AN ELECTROSTATIC CHUCKThe present invention provides a reliable, non-invasive, electrical test method for predicting satisfactory performance of electrostatic chucks (ESCs). In accordance with an aspect of the present invention, a parameter, e.g., impedance, of an ESC is measured over a frequency band to generate a parameter functions. This parameter function may be used to establish predetermined acceptable limits of the parameter within the frequency band.FIGS

    MOVEABLE EDGE RING DESIGNS
    6.
    发明专利

    公开(公告)号:SG11201908264QA

    公开(公告)日:2019-10-30

    申请号:SG11201908264Q

    申请日:2017-07-24

    Applicant: LAM RES CORP

    Abstract: INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 31 January 2019 (31.01.2019) WI PO I PCT omit omolom olo mo Immo lII ois (10) International Publication Number WO 2019/022707 Al (51) International Patent Classification: HOlL 21/687 (2006.01) HOlL 21/683 (2006.01) (21) International Application Number: PCT/US2017/043527 (22) International Filing Date: 24 July 2017 (24.07.2017) (25) Filing Language: English (26) Publication Language: English (71) Applicant: LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway, Fremont, California 94538 (US). (72) Inventors: RATHNASINGHE, Hiran Rajitha; 39199 Guardino Drive, Apt #377, Fremont, California 94538 (US). MCCHESNEY, Jon; 46509 Fremont Blvd., #104, Fre- mont, California 94539 (US). (74) Agent: AQUINO, Damian M. et al.; HARNESS, DICKEY & PIERCE, P.L.C., P.O. Box 828, Bloomfield Hills, Michi- gan 48303 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, (54) Title: MOVEABLE EDGE RING DESIGNS 300 1, 312 308 304 FIG. 3A (57) : An edge ring is configured to be raised and lowered relative to a substrate support, via one or more lift pins, in a substrate processing system. The edge ring is further configured to interface with a guide feature extending upward from a bottom ring and/or a middle ring of the substrate support during tuning of the edge ring. The edge ring includes an upper surface, an annular inner diameter, an annular outer diameter, a lower surface, and an annular groove arranged in the lower surface of the edge ring to interface with the guide feature. Walls of the annular groove are substantially vertical. [Continued on next page] WO 2019/022707 Al IMEDIMOMOIDEIRME10101101MENERVOIS MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: of inventorship (Rule 4.17(iv)) Published: — with international search report (Art. 21(3)) with amended claims (Art. 19(1))

    BOTTOM AND MIDDLE EDGE RINGS
    9.
    发明专利

    公开(公告)号:SG11201907515WA

    公开(公告)日:2019-09-27

    申请号:SG11201907515W

    申请日:2017-11-21

    Applicant: LAM RES CORP

    Abstract: 316 336 372 376 304 W O 20 19/ 1037 22 Al -364 r -344 136 0 388 384 j --324 348 320 FIG. 3B 352 356 312 308-f - (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 31 May 2019 (31.05.2019) WIPO I PCT 111111111111110111111111111111101111101011111111111111111111111011101111111011110111111 (10) International Publication Number WO 2019/103722 Al (51) International Patent Classification: HO1L 21/687 (2006.01) HO1L 21/67 (2006.01) HO1L 21/683 (2006.01) (21) International Application Number: PCT/US2017/062769 (22) International Filing Date: 21 November 2017 (21.11.2017) (25) Filing Language: English (26) Publication Language: English (71) Applicant: LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway, Fremont, California 94538 (US). (72) Inventors: RATHNASINGHE, Hiran Rajitha; 4300 Cushing Parkway, CA4 1011, Fremont, California 94538 (US). TOKAIRIN, Shawn E S; 40971 Cruz Ct., Fremont, California 94539 (US). MCCHESNEY, Jon; 46509 Fre- mont Blvd., #104, Fremont, California 94539 (US). (74) Agent: CHAPP, Jeffrey J. et al.; HARNESS, DICKEY & PIERCE, P.L. C., P.O. Box 828, Bloomfield Hills, Michigan 48303 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, 1E, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Declarations under Rule 4.17: — of inventorship (Rule 4.17(iv)) Published: with international search report (Art. 21(3)) (54) Title: BOTTOM AND MIDDLE EDGE RINGS (57) : A bottom ring is configured to support a moveable edge ring. The edge ring is configured to be raised and lowered relative to a substrate support. The bottom ring includes an upper surface that is stepped, an annular inner diameter, an annular outer diameter, a lower surface, and a plurality of vertical guide chan- nels provided through the bottom ring from the lower surface to the upper surface of the bottom ring. Each of the guide channels includes a first region having a smaller diameter than the guide channel, and the guide channels are configured to receive respec- tive lift pins for raising and lowering the edge ring.

    A PROTECTIVE COATING FOR A PLASMA PROCESSING CHAMBER PART AND A METHOD OF USE

    公开(公告)号:SG188141A1

    公开(公告)日:2013-03-28

    申请号:SG2013010210

    申请日:2009-02-06

    Applicant: LAM RES CORP

    Abstract: A PROTECTIVE COATING FOR A PLASMA PROCESSING CHAMBER PART AND A METHOD OF USEA flexible polymer or elastomer coated RF return strap to be used in a plasma chamber to protect the RF strap from plasma generated radicals such as fluorine and oxygen radicals, and a method of processing a semiconductor substrate with reduced particle contamination in a plasma processing apparatus. The coated RF strap minimizes particle generation and exhibits lower erosion rates than an uncoated base component. Such a coated member having a flexible coating on a conductive flexible base component provides an RF ground return configured to allow movement of one or more electrodes in an adjustable gap capacitively coupled plasma reactor chamber.

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