公开(公告)号：DE69920453T2

公开(公告)日：2005-11-24

申请号：DE69920453

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK S ,  KENNEDY S

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically andor thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

公开(公告)号：DE69931168D1

公开(公告)日：2006-06-08

申请号：DE69931168

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK S ,  KENNEDY S ,  MARASCHIN A

IPC: H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically andor thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

公开(公告)号：DE69920453D1

公开(公告)日：2004-10-28

申请号：DE69920453

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK S ,  KENNEDY S

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically andor thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

公开(公告)号：DE69931168T2

公开(公告)日：2007-03-08

申请号：DE69931168

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK S ,  KENNEDY S ,  MARASCHIN A

IPC: H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically andor thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

公开(公告)号：DE60006933T2

公开(公告)日：2004-11-11

申请号：DE60006933

申请日：2000-09-11

Applicant: LAM RES CORP

Inventor： KENNEDY S ,  MARASCHIN A ,  HUBACEK S

IPC: H05H1/46 ,  C23C16/44 ,  C23C16/507 ,  H01J37/32 ,  H01L21/3065 ,  C23C16/50

Abstract: A plasma processing chamber including a ceramic liner in the form of ceramic tiles mounted on a resilient support member. The liner and other parts such as a gas distribution plate and a plasma screen can be made of SiC which advantageously confines the plasma and provides temperature control of the inner surfaces of the chamber. The liner can be heated by a heater which provides heat to the liner by thermal conduction. To remove excess heat from the liner, the resilient support can be an aluminum support frame which conducts heat from the liner to a temperature controlled member such as a top plate of the chamber. The support frame can include a continuous upper portion and a segmented lower portion which allows thermal stresses to be accommodated during processing of semiconductor substrates in the plasma chamber.

公开(公告)号：DE60006933D1

公开(公告)日：2004-01-15

申请号：DE60006933

申请日：2000-09-11

Applicant: LAM RES CORP

Inventor： KENNEDY S ,  MARASCHIN A ,  HUBACEK S

IPC: H05H1/46 ,  C23C16/44 ,  C23C16/507 ,  H01J37/32 ,  H01L21/3065 ,  C23C16/50

Abstract: A plasma processing chamber including a ceramic liner in the form of ceramic tiles mounted on a resilient support member. The liner and other parts such as a gas distribution plate and a plasma screen can be made of SiC which advantageously confines the plasma and provides temperature control of the inner surfaces of the chamber. The liner can be heated by a heater which provides heat to the liner by thermal conduction. To remove excess heat from the liner, the resilient support can be an aluminum support frame which conducts heat from the liner to a temperature controlled member such as a top plate of the chamber. The support frame can include a continuous upper portion and a segmented lower portion which allows thermal stresses to be accommodated during processing of semiconductor substrates in the plasma chamber.