公开(公告)号：WO0000998A3

公开(公告)日：2000-08-10

申请号：PCT/US9915053

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

CPC classification number: H01J37/32009 ,  H01J37/3244 ,  H01J37/32532

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically and/or thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

Abstract translation: 可以执行用于等离子体反应室的电极组件，其中可以执行诸如单个晶片的半导体衬底的处理，制造电极组件的方法以及使用该组件处理半导体衬底的方法。 电极组件包括诸如石墨环之类的支撑构件，诸如呈均匀厚度的圆盘形式的硅喷头电极的电极以及在支撑构件与电极之间的弹性体接头。 由于电极组件的温度循环，弹性接头允许支撑构件和电极之间的移动以补偿热膨胀。 弹性体接头可以包括导电和/或导热填料，弹性体可以是在高温下稳定的催化剂固化的聚合物。

公开(公告)号：WO0000999A9

公开(公告)日：2000-10-12

申请号：PCT/US9914790

申请日：1999-06-30

Applicant: LAM RES CORP ,  LILLELAND JOHN ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S ,  MARASCHIN ROBERT A

Inventor： LILLELAND JOHN ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S ,  MARASCHIN ROBERT A

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46 ,  H01L21/00

CPC classification number: H01J37/32009 ,  H01J37/3244 ,  H01J37/32532

Abstract: An elastomeric joint assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the assembly and a method of processing a semiconductor substrate with the assembly. The elastomeric joint assembly can comprise a part such as an electrode, a window, a liner or other part bonded to a support member by an elastomeric material. In an electrode assembly, the support member can comprise a graphite ring bonded to an electrode such as a silicon showerhead electrode by an elastomeric joint. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically and/or thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

Abstract translation: 可以执行用于等离子体反应室的弹性体接头组件，其中可以执行诸如单个晶片的半导体衬底的处理，该组件的制造方法以及使用该组件处理半导体衬底的方法。 弹性接头组件可以包括诸如电极，窗口，衬垫或其他部分的部件，该部件通过弹性体材料结合到支撑构件。 在电极组件中，支撑构件可以包括通过弹性体接头结合到诸如硅喷头电极的电极的石墨环。 由于电极组件的温度循环，弹性接头允许支撑构件和电极之间的移动以补偿热膨胀。 弹性体接头可以包括导电和/或导热填料，弹性体可以是在高温下稳定的催化剂固化的聚合物。

公开(公告)号：EP1105917A4

公开(公告)日：2003-05-21

申请号：EP99933616

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S ,  MARASCHIN ROBERT A

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

CPC classification number: H01J37/32009 ,  H01J37/3244 ,  H01J37/32532

Abstract: An elastomeric joint assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the assembly and a method of processing a semiconductor substrate with the assembly. The elastomeric joint assembly can comprise a part such as an electrode, a window, a liner or other part bonded to a support member by an elastomeric material. In an electrode assembly, the support member can comprise a graphite ring bonded to an electrode such as a silicon showerhead electrode by an elastomeric joint. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically and/or thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

Abstract translation: 一种用于等离子体反应室的电极组件，其中可以执行诸如单个晶片的半导体衬底的处理，电极组件的制造方法和使用该组件处理半导体衬底的方法。 电极组件包括诸如石墨环的支撑构件，具有均匀厚度的圆盘形式的诸如硅喷头电极的电极和在支撑构件和电极之间的弹性体接头。 弹性接头允许支撑构件和电极之间的移动，以补偿由于电极组件的温度循环导致的热膨胀。 弹性体接头可以包括导电导热填料，弹性体可以是在高温下稳定的催化剂固化的聚合物。

公开(公告)号：JP2003133296A

公开(公告)日：2003-05-09

申请号：JP2002207379

申请日：2002-07-16

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S ,  MARASCHIN ROBERT A

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: PROBLEM TO BE SOLVED: To provide a plasma reaction chamber having an elastomeric joint, a method for manufacturing the plasma reaction chamber, and a method for treating substrates. SOLUTION: An elastomeric joint assembly can comprise parts such as an electrode, a window, a liner or the like, and/or other parts bonded to a support member by an elastomeric material. In an electrode assembly, the support member can comprise a graphite ring 42 coupled with the electrode of a silicon shower head electrode 42 or the like by the elastomeric joint. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically and/or thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

公开(公告)号：DE69931168T2

公开(公告)日：2007-03-08

申请号：DE69931168

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK S ,  KENNEDY S ,  MARASCHIN A

IPC: H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically andor thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

公开(公告)号：AU4963699A

公开(公告)日：2000-01-17

申请号：AU4963699

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S ,  MARASCHIN ROBERT A

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46 ,  H01L21/00

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically andor thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

公开(公告)号：ES2264263T3

公开(公告)日：2006-12-16

申请号：ES99933616

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S ,  MARASCHIN ROBERT A

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: Un conjunto de junta elastomérica de una cámara de reacción de plasma usada en el proceso de un sustrato semiconductor, que comprende: una primera pieza (42) que tiene una superficie de unión, una segunda pieza (44) que tiene una superficie de unión en contacto con la superficie de unión de la primera pieza (42); y una junta (46) elastomérica entre la primera pieza (42) y la segunda pieza (44), fijando de forma resiliente la junta (46) elastomérica la primera pieza (42) con la segunda pieza (44) para permitir el movimiento entre la primera pieza (42) y la segunda pieza (44) durante el ciclo de temperaturas de las mismas; en el que dicha junta elastomérica está localizada en un rebajo (48) en la primera pieza (42) definido por una pared (50) que protege la junta elastomérica (46) del ataque por el medio de plasma en una cámara de reactor de plasma.

公开(公告)号：AU4856299A

公开(公告)日：2000-01-17

申请号：AU4856299

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S

IPC: H01L21/302 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically andor thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

公开(公告)号：DE69939606D1

公开(公告)日：2008-10-30

申请号：DE69939606

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK JEROME S ,  KENNEDY WILLIAM S

IPC: H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically andor thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.

公开(公告)号：DE69931168D1

公开(公告)日：2006-06-08

申请号：DE69931168

申请日：1999-06-30

Applicant: LAM RES CORP

Inventor： LILLELAND JOHN ,  HUBACEK S ,  KENNEDY S ,  MARASCHIN A

IPC: H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/31 ,  H05H1/46

Abstract: An electrode assembly for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out, a method of manufacture of the electrode assembly and a method of processing a semiconductor substrate with the assembly. The electrode assembly includes a support member such as a graphite ring, an electrode such as a silicon showerhead electrode in the form of a circular disk of uniform thickness and an elastomeric joint between the support member and the electrode. The elastomeric joint allows movement between the support member and the electrode to compensate for thermal expansion as a result of temperature cycling of the electrode assembly. The elastomeric joint can include an electrically andor thermally conductive filler and the elastomer can be a catalyst-cured polymer which is stable at high temperatures.