公开(公告)号：MY163666A

公开(公告)日：2017-10-13

申请号：MYPI20054608

申请日：2005-09-29

Applicant: LAM RES CORP

Inventor： JAMES P GARCIA

IPC: B08B3/00

Abstract: A METHOD FOR PROCESSING A SUBSTRATE (108) IS PROVIDED WHICH INCLUDES APPLYING FLUID ONTO A SURFACE OF THE SUBSTRATE FROM A PORTION OF A PLURALITY OF INLETS (302, 306) AND REMOVING AT LEAST THE FLUID FROM THE SURFACE OF THE SUBSTRATE WHERE THE REMOVING BEING PROCESSED AS THE FLUID IS APPLIED TO THE SURFACE. THE APPLYING THE FLUID AND THE REMOVING THE FLUID FORMS A SEGMENT OF A FLUID MENISCUS (116) ON THE SURFACE OF THE SUBSTRATE. FIG. 11E

公开(公告)号：SG115838A1

公开(公告)日：2005-10-28

申请号：SG200502522

申请日：2005-03-23

Applicant: LAM RES CORP

Inventor： CARL WOODS ,  MICHAEL G R SMITH ,  JOHN PARKS ,  JAMES P GARCIA ,  JOHN M DE LARIOS

IPC: B05C9/02 ,  B05D1/00 ,  B05D3/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  H01L21/306

Abstract: An apparatus for processing a substrate is provided which includes a first manifold module to generate a fluid meniscus on a substrate surface. The apparatus also includes a second manifold module to connect with the first manifold module and also to move the first manifold module into close proximity to the substrate surface to generate the fluid meniscus.