公开(公告)号：JP2013042172A

公开(公告)日：2013-02-28

申请号：JP2012242490

申请日：2012-11-02

Applicant: Lam Res Corp ,  ラム リサーチ コーポレイション

Inventor： ERIK M FREER ,  REDEKER FRED C ,  KATRINA MIKHAYLICHENKO ,  MICHAEL RAVKIN ,  MIKHAIL KOROLIK ,  JOHN M DE LARIOS

IPC: H01L21/304

CPC classification number: H01L21/67092 ,  B08B3/00 ,  B08B7/00 ,  B08B7/02 ,  C11D9/02 ,  C11D11/0047 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67086 ,  Y10T137/4891

Abstract: PROBLEM TO BE SOLVED: To provide a method and apparatus for cleaning a semiconductor substrate.SOLUTION: A method for cleaning a substrate is provided. The method starts with applying an activation solution to a surface of the substrate. The activation solution and the surface of the substrate are in contact with a surface of a solid cleaning surface. The activation solution is absorbed into a portion of the solid cleaning element and then the die substrate or the solid cleaning surface is moved relative to each other to clean the surface of the substrate. A method is also provided for cleaning the surface of the substrate with a solid cleaning element that undergoes plastic deformation. Corresponding cleaning apparatus is also provided.

Abstract translation: 要解决的问题：提供一种用于清洁半导体衬底的方法和装置。 提供了一种清洗基板的方法。 该方法开始于将活化溶液施加到基底的表面。 活化溶液和基材的表面与固体清洁表面的表面接触。 活化溶液被吸收到固体清洁元件的一部分中，然后模具基底或固体清洁表面相对于彼此移动以清洁基底的表面。 还提供了一种用于利用经历塑性变形的固体清洁元件来清洁基板的表面的方法。 还提供了相应的清洁装置。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：SG115843A1

公开(公告)日：2005-10-28

申请号：SG200502559

申请日：2005-03-28

Applicant: LAM RES CORP

Inventor： MICHAEL RAVKIN ,  MICHAEL G R SMITH ,  JOHN M DE LARIOS ,  FRITZ REDEKER ,  MIKHAIL KOROLIK ,  CHRISTIAN DIPIETRO

IPC: B08B3/00 ,  B08B3/04 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306

Abstract: Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.

公开(公告)号：SG115838A1

公开(公告)日：2005-10-28

申请号：SG200502522

申请日：2005-03-23

Applicant: LAM RES CORP

Inventor： CARL WOODS ,  MICHAEL G R SMITH ,  JOHN PARKS ,  JAMES P GARCIA ,  JOHN M DE LARIOS

IPC: B05C9/02 ,  B05D1/00 ,  B05D3/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  H01L21/306

Abstract: An apparatus for processing a substrate is provided which includes a first manifold module to generate a fluid meniscus on a substrate surface. The apparatus also includes a second manifold module to connect with the first manifold module and also to move the first manifold module into close proximity to the substrate surface to generate the fluid meniscus.

公开(公告)号：MY159175A

公开(公告)日：2016-12-30

申请号：MYPI20062784

申请日：2006-06-13

Applicant: LAM RES CORP

Inventor： JOHN M DE LARIOS ,  MIKE RAVKIN ,  JEFFREY FARBER ,  MIKHAIL KOROLIK ,  FRED C REDEKER

IPC: B08B3/00

Abstract: A METHOD FOR CLEANING A SUBSTRATE (702) IS PROVIDED. IN THIS METHOD, A FLOW OF NON-NEWTONIAN FLUID IS PROVIDED WHERE AT LEAST A PORTION OF THE FLOW EXHIBITS PLUG FLOW. TO REMOVE PARTICLES FROM A SURFACE OF THE SUBSTRATE (702), THE SURFACE OF THE SUBSTRATE IS PLACED IN CONTACT WITH THE PORTION OF THE FLOW THAT EXHIBITS PLUG FLOW SUCH THAT THE PORTION OF THE FLOW EXHIBITING PLUG FLOW MOVES OVER THE SURFACE OF THE SUBSTRATE. ADDITIONAL METHODS AN APPARATUSES FOR CLEANING A SUBSTRATE (702) ALSO ARE DESCRIBED. FIG. 5

公开(公告)号：SG187413A1

公开(公告)日：2013-02-28

申请号：SG2012096426

申请日：2006-11-29

Applicant: LAM RES CORP

Inventor： ERIK M FREER ,  JOHN M DE LARIOS ,  KATRINA MIKHAYLICHENKO ,  MICHAEL RAVKIN ,  MIKHAIL KOROLIK ,  FRED C REDEKER

Abstract: 27A cleaning compound is provided. The cleaning compound includes about 0.1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.Fig. 1

公开(公告)号：SG115836A1

公开(公告)日：2005-10-28

申请号：SG200502519

申请日：2005-03-23

Applicant: LAM RES CORP

Inventor： MIKHAIL KOROLIK ,  JOHN M DE LARIOS ,  MIKE RAVKIN ,  JEFFREY FARBER

IPC: H01L21/304 ,  B08B3/04 ,  H01L21/00

Abstract: A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.