公开(公告)号：WO2011149508A3

公开(公告)日：2012-04-05

申请号：PCT/US2011000867

申请日：2011-05-17

Applicant: LAM RES CORP ,  RICCI ANTHONY ,  ULLAL SAURABH ,  KANG MICHAEL ,  BUSCHE MATTHEW

Inventor： RICCI ANTHONY ,  ULLAL SAURABH ,  KANG MICHAEL ,  BUSCHE MATTHEW

IPC: H01L21/683 ,  H01L21/205 ,  H01L21/3065

CPC classification number: H01L21/67248 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109

Abstract: A recirculation system of a substrate support on which a semiconductor substrate is subjected to a multistep process in a vacuum chamber, the system comprising a substrate support having at least one liquid flow passage in a base plate thereof, an inlet and an outlet in fluid communication with the flow passage, a supply line in fluid communication with the inlet, and a return line in fluid communication with the outlet; a first recirculator providing liquid at temperature T 1 in fluid communication with the supply line and the return line; a second recirculator providing liquid at temperature T 2 in fluid communication with the supply line and the return line, temperature T 2 being at least 10°C above temperature T 1 ; a pre-cooling unit providing liquid at temperature T pc connected to the inlet and the outlet, temperature T pc being at least 10C below T 1 ; a pre-heating unit providing liquid at temperature T ph connected to the inlet and the outlet, temperature T ph being at least 10°C above T 2 ; a controller operable to selectively operate valves of the recirculation system to recirculate liquid between the flow passage and the first recirculator, the second recirculator, the pre-cooling unit or the pre-heating unit.

Abstract translation: 一种衬底支撑件的再循环系统，半导体衬底在其上在真空室中进行多步骤处理，所述系统包括衬底支撑件，所述衬底支撑件在其底板中具有至少一个液体流动通道，流体连通的入口和出口 与流路连通，与入口流体连通的供应管线和与出口流体连通的回流管线; 第一再循环器，其在与所述供应管线和所述回流管线流体连通的温度T 1下提供液体; 提供温度T 2的液体与供应管线和返回管线流体连通的第二再循环器，温度T 2高于温度T 1至少10℃; 提供温度T pc连接到入口和出口的液体的预冷单元，温度T pc比T 1低至少10℃; 预热单元，其在与入口和出口连接的温度T ph下提供液体，温度T ph比T 2高至少10℃; 控制器，其可操作以选择性地操作所述再循环系统的阀，以在所述流动通道和所述第一再循环器，所述第二再循环器，所述预冷单元或所述预热单元之间再循环液体。

公开(公告)号：SG185670A1

公开(公告)日：2012-12-28

申请号：SG2012085320

申请日：2011-05-17

Applicant: LAM RES CORP

Inventor： RICCI ANTHONY ,  ULLAL SAURABH ,  KANG MICHAEL ,  BUSCHE MATTHEW

Abstract: A recirculation system of a substrate support on which a semiconductor substrate is subjected to a multistep process in a vacuum chamber, the system comprising a substrate support having at least one liquid flow passage in a base plate thereof, an inlet and an outlet in fluid communication with the flow passage, a supply line in fluid communication with the inlet, and a return line in fluid communication with the outlet; a first recirculator providing liquid at temperature T1 in fluid communication with the supply line and the return line; a second recirculator providing liquid at temperature T2 in fluid communication with the supply line and the return line, temperature T2being at least 10°C above temperature T1; a pre-cooling unit providing liquid at temperature Tpc connected to the inlet and the outlet, temperature Tpc being at least 10C below T1; a pre-heating unit providing liquid at temperature Tph connected to the inlet and the outlet, temperature Tph being at least 10°C above T2; a controller operable to selectively operate valves of the recirculation system to recirculate liquid between the flow passage and the first recirculator, the second recirculator, the pre-cooling unit or the pre-heating unit.