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1.发明申请METHODS FOR WET CLEANING QUARTZ SURFACES OF COMPONENTS FOR PLASMA PROCESSING CHAMBERS 审中-公开用于等离子体处理室的组件的清洁清洗表面的方法
公开(公告)号：WO2005123282A2
公开(公告)日：2005-12-29
申请号：PCT/US2005019466
申请日：2005-06-03
Applicant: LAM RES CORP , SHIH HONG , HUANG TUOCHUAN , OUTKA DUANE , KUO JACK , LIU SHENJIAN , MOREL BRUNO , CHEN ANTHONY
Inventor： SHIH HONG , HUANG TUOCHUAN , OUTKA DUANE , KUO JACK , LIU SHENJIAN , MOREL BRUNO , CHEN ANTHONY
CPC classification number: C23C16/4407 , H01J37/32862
Abstract: Methods for wet cleaning quartz surfaces of components for plasma processing chambers in which semiconductor substrates are processed, such as etch chambers and resist stripping chambers, include contacting the quartz surface with at least one organic solvent, a basic solution and different acid solutions, so as to remove organic and metallic contaminants from the quartz surface. The quartz surface is preferably contacted with one of the acid solutions at least two times.
Abstract translation: 用于湿处理其中处理半导体衬底的等离子体处理室的部件的石英表面的方法，例如蚀刻室和抗蚀剂剥离室，包括使石英表面与至少一种有机溶剂，碱性溶液和不同的酸溶液接触，以便 以从石英表面去除有机和金属污染物。 石英表面优选与一种酸溶液接触至少两次。
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2.发明公开METHODS FOR WET CLEANING QUARTZ SURFACES OF COMPONENTS FOR PLASMA PROCESSING CHAMBERS 审中-公开方法为等离子体处理室的组成部分石英曲面湿洗
公开(公告)号：EP1753549A4
公开(公告)日：2009-09-16
申请号：EP05756207
申请日：2005-06-03
Applicant: LAM RES CORP
Inventor： SHIH HONG , HUANG TUOCHUAN , OUTKA DUANE , KUO JACK , LIU SHENJIAN , MOREL BRUNO , CHEN ANTHONY
CPC classification number: C23C16/4407 , H01J37/32862
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