公开(公告)号：WO2012018368A2

公开(公告)日：2012-02-09

申请号：PCT/US2011001270

申请日：2011-07-18

Applicant: LAM RES CORP ,  RICCI ANTHONY ,  SAURABH ULLAL ,  MARTINEZ LARRY

Inventor： RICCI ANTHONY ,  SAURABH ULLAL ,  MARTINEZ LARRY

IPC: H05H1/24 ,  H01L21/205 ,  H01L21/3065

CPC classification number: H01L21/67069 ,  C23C16/4404 ,  H01J37/32477 ,  H01J37/32798 ,  H01L21/6833 ,  Y10T156/10

Abstract: Parasitic plasma in voids in a component of a plasma processing chamber can be eliminated by covering electrically conductive surfaces in an interior of the voids with a sleeve. The voids can be gas holes, lift pin holes, helium passages, conduits and/or plenums in chamber components such as an upper electrode and a substrate support.

Abstract translation: 通过用套筒覆盖空隙内部的导电表面，可以消除等离子体处理室的部件中的空隙中的寄生等离子体。 空隙可以是诸如上电极和衬底支撑件之类的室部件中的气孔，提升针孔，氦气通道，导管和/或增压室。

公开(公告)号：WO2012018368A3

公开(公告)日：2012-04-05

申请号：PCT/US2011001270

申请日：2011-07-18

Applicant: LAM RES CORP ,  RICCI ANTHONY ,  SAURABH ULLAL ,  MARTINEZ LARRY

Inventor： RICCI ANTHONY ,  SAURABH ULLAL ,  MARTINEZ LARRY

IPC: H05H1/24 ,  H01L21/205 ,  H01L21/3065

CPC classification number: H01L21/67069 ,  C23C16/4404 ,  H01J37/32477 ,  H01J37/32798 ,  H01L21/6833 ,  Y10T156/10

Abstract: Parasitic plasma in voids in a component of a plasma processing chamber can be eliminated by covering electrically conductive surfaces in an interior of the voids with a sleeve. The voids can be gas holes, lift pin holes, helium passages, conduits and/or plenums in chamber components such as an upper electrode and a substrate support.

公开(公告)号：SG187142A1

公开(公告)日：2013-02-28

申请号：SG2013004346

申请日：2011-07-18

Applicant: LAM RES CORP

Inventor： RICCI ANTHONY ,  ULLAL SAURABH ,  MARTINEZ LARRY

Abstract: Parasitic plasma in voids in a component of a plasma processing chamber can be eliminated by covering electrically conductive surfaces in an interior of the voids with a sleeve. The voids can be gas holes, lift pin holes, helium passages, conduits and/or plenums in chamber components such as an upper electrode and a substrate support.

公开(公告)号：SG10201505834VA

公开(公告)日：2015-09-29

申请号：SG10201505834V

申请日：2011-07-18

Applicant: LAM RES CORP

Inventor： RICCI ANTHONY ,  ULLAL SAURABH ,  MARTINEZ LARRY