公开(公告)号：WO0124216A3

公开(公告)日：2002-09-26

申请号：PCT/US0026637

申请日：2000-09-27

Applicant: LAM RES CORP

Inventor： RICCI ANTHONY J ,  KADKHODAYAN BABAK

IPC: H05H1/46 ,  H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/3244 ,  H01J2237/022

Abstract: A gas distribution plate (GDP) GDP is pretreated before implementation in a semiconductor fabrication apparatus so as to be stable over the operational lifetime of the GDP. The pre-treatment acts to reduce undesired reactions of the GDP with process chemistry used in the semiconductor fabrication apparatus. The pre-treatment is applied to at least a portion of the gas distribution plate. Preferably, surfaces of the gas distribution plate which come in contact with the process chemistry are pretreated.

Abstract translation: 在半导体制造设备实施前，预计燃气配电板（GDP）GDP将在国内生产总值的使用寿命内稳定。 预处理用于减少GDP与半导体制造装置中使用的工艺化学品的不期望的反应。 预处理被施加到气体分配板的至少一部分。 优选地，与处理化学品接触的气体分配板的表面被预处理。

公开(公告)号：WO2006073947A3

公开(公告)日：2007-04-05

申请号：PCT/US2005047109

申请日：2005-12-13

Applicant: LAM RES CORP ,  RICCI ANTHONY J ,  COMENDANT KEITH ,  TAPPAN JAMES

Inventor： RICCI ANTHONY J ,  COMENDANT KEITH ,  TAPPAN JAMES

IPC: H01L21/00

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

Abstract: An apparatus for control of a temperature of a substrate has a temperature­controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

Abstract translation: 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，介电材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合材料将金属板和加热器粘合到温度受控基底的顶面。 该粘合剂层是机械柔性的，并且具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备表面的物理性质。 电介质材料层形成静电夹持机构并支撑衬底。

公开(公告)号：SG158164A1

公开(公告)日：2010-01-29

申请号：SG2009085333

申请日：2005-12-13

Applicant: LAM RES CORP

Inventor： RICCI ANTHONY J ,  COMENDANT KEITH ,  TAPPAN JAMES

Abstract: An apparatus for control of a temperature of a substrate has a temperaturecontrolled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.