公开(公告)号：JP2003249474A

公开(公告)日：2003-09-05

申请号：JP2002040739

申请日：2002-02-18

Applicant: LAM RES CORP

Inventor： KOBAYASHI NAOAKI ,  YAMAGUCHI RYUTA ,  TAJIMA KAORI ,  ORI KOSUKE ,  HAIGATA HIDESATO ,  NAKAJIMA SHU ,  NOJIRI KAZUO ,  SAGANE YOICHI

IPC: G03F7/42 ,  B08B3/02 ,  H01L21/027 ,  H01L21/304

Abstract: PROBLEM TO BE SOLVED: To provide a water supply device having a parameter for determining highly efficient water supply conditions of high peeling/removal ability of unnecessary matters of a resist film or the like and its method. SOLUTION: In the water supply device and method for supplying water for washing/peeling/processing of an object, a nozzle device for spraying a spraying body of water vapor body and water mist body is provided to a plate- like object treatment surface of an object. As for parameters determining water supply conditions, at least (1) a weight ratio between water vapor body and water mist body in an object treatment surface, (2) a temperature of an object treatment surface and (3) a distance between a supply opening of a nozzle device (water) and an object treatment surface are provided. The parameters are constituted to be set at proper values so that water is supplied to an object. COPYRIGHT: (C)2003,JPO