公开(公告)号：WO2004041454A2

公开(公告)日：2004-05-21

申请号：PCT/US0334758

申请日：2003-10-30

Applicant: LAM RES CORP ,  KOBAYASHI NAOAKI ,  YAMAGUCHI RYUTA ,  TAJIMA KAORI ,  ORI KOHSUKE

Inventor： KOBAYASHI NAOAKI ,  YAMAGUCHI RYUTA ,  TAJIMA KAORI ,  ORI KOHSUKE

IPC: G02F1/13 ,  B08B3/00 ,  B08B3/02 ,  G03F7/42 ,  G11B5/84 ,  H01L21/00 ,  H01L21/027 ,  H01L21/304 ,  B08B7/04

CPC classification number: H01L21/6708 ,  B08B3/00 ,  B08B2230/01

Abstract: A substrate processing apparatus for performing processing including any one of pee-l­off, washing, and working processes on a substrate having a roughly circular planar substrate processing surface is provided. The substrate processing apparatus includes a nozzle portion for spraying a stream of steam on the substrate processing surface while moving between a center and an outer peripheral edge of the substrate processing surface. A stage portion having the substrate mounted thereon and which rotates integrally with the substrate around the center of the processing-substrate surface as a rotary axis, and at least one of a nozzle-operation control expedient for controlling a movement speed and a movement locus of the nozzle portion and a stage-operation control expedient for controlling a rotational speed of the stage.

Abstract translation: 提供了一种用于在具有大致圆形的平面基板处理表面的基板上执行包括撒尿，洗涤和加工过程中的任何一种的处理的基板处理设备。 基板处理装置包括用于在基板处理表面的中心和外周边缘之间移动的同时在基板处理表面上喷射蒸汽流的喷嘴部分。 具有安装在其上并与基板围绕处理基板表面的中心一体旋转的台部，作为旋转轴，以及用于控制移动速度和移动轨迹的喷嘴操作控制方法中的至少一个 喷嘴部分和用于控制载物台转速的载物台操作控制装置。

公开(公告)号：JP2003249474A

公开(公告)日：2003-09-05

申请号：JP2002040739

申请日：2002-02-18

Applicant: LAM RES CORP

Inventor： KOBAYASHI NAOAKI ,  YAMAGUCHI RYUTA ,  TAJIMA KAORI ,  ORI KOSUKE ,  HAIGATA HIDESATO ,  NAKAJIMA SHU ,  NOJIRI KAZUO ,  SAGANE YOICHI

IPC: G03F7/42 ,  B08B3/02 ,  H01L21/027 ,  H01L21/304

Abstract: PROBLEM TO BE SOLVED: To provide a water supply device having a parameter for determining highly efficient water supply conditions of high peeling/removal ability of unnecessary matters of a resist film or the like and its method. SOLUTION: In the water supply device and method for supplying water for washing/peeling/processing of an object, a nozzle device for spraying a spraying body of water vapor body and water mist body is provided to a plate- like object treatment surface of an object. As for parameters determining water supply conditions, at least (1) a weight ratio between water vapor body and water mist body in an object treatment surface, (2) a temperature of an object treatment surface and (3) a distance between a supply opening of a nozzle device (water) and an object treatment surface are provided. The parameters are constituted to be set at proper values so that water is supplied to an object. COPYRIGHT: (C)2003,JPO

公开(公告)号：AU2003286823A1

公开(公告)日：2004-06-07

申请号：AU2003286823

申请日：2003-10-30

Applicant: LAM RES CORP

Inventor： KOBAYASHI NAOAKI ,  YAMAGUCHI RYUTA ,  TAJIMA KAORI ,  ORI KOHSUKE

IPC: G02F1/13 ,  B08B3/00 ,  B08B3/02 ,  G03F7/42 ,  G11B5/84 ,  H01L21/00 ,  H01L21/027 ,  H01L21/304 ,  B08B7/04

Abstract: A method for applying steam onto a surface of a substrate (20) with a nozzle (16) by spinning the substrate with a rotary shaft (24).The stream of steam is supplied between point (23) and a peripheral edge of (20) and moving the stream of steam between the center (23) and the peripheral edge at correlated to an area of the substrate being subjected to the stream of steam.