METHOD AND APPARATUS FOR MONITORING A SEMICONDUCTOR WAFER DURING A SPIN DRYING OPERATION
    1.
    发明申请
    METHOD AND APPARATUS FOR MONITORING A SEMICONDUCTOR WAFER DURING A SPIN DRYING OPERATION 审中-公开
    用于在旋转干燥操作期间监测半导体波形的方法和装置

    公开(公告)号:WO02052637A2

    公开(公告)日:2002-07-04

    申请号:PCT/US0150595

    申请日:2001-12-21

    Inventor: TREUR RANDOLPH E

    CPC classification number: H01L21/67253 H01L21/67034 Y10S438/974

    Abstract: In one method for monitoring a semiconductor wafer during a spin processing operation, a capacitance value between a capacitance sensor (124) and the wafer (116) is measured as the wafer is being spun. When it is determined that the measured capacitance value has reached a desired, e.g., substantially constant, level, a signal (130) is generated indicating that the surface of the semiconductor wafer is in a desired condition, e.g., dry. In another method, light is directed toward a surface of the wafer as the wafer is being spun. The light is directed such that the light that reflects off of the surface of the wafer is substantially perpendicular to the surface of the wafer. The intensity of the light reflected off of the surface of the semiconductor wafer is measured. A signal indicating that the surface of the wafer is in a desired condition is generated when the measured intensity of the light reflected off of the surface of the wafer reaches an intensity level that corresponds to a measured intensity of light reflected off of the surface of the wafer when the surface is in the desired condition. In methods for spin drying a semiconductor wafer, spinning of the wafer is stopped in response to the signal. Apparatus for spin drying a semiconductor wafer including either a capacitance sensor or an interferometric sensor also are described.

    Abstract translation: 在用于在旋转处理操作期间监测半导体晶片的一种方法中,当晶片正在旋转时,测量电容传感器(124)和晶片(116)之间的电容值。 当确定测量的电容值已经达到期望的例如基本恒定的电平时,产生指示半导体晶片的表面处于所需条件例如干的信号(130)。 在另一种方法中,当晶片正在旋转时,光被引向晶片的表面。 光被引导为使得从晶片的表面反射的光基本上垂直于晶片的表面。 测量从半导体晶片的表面反射的光的强度。 当从晶片表面反射的光的测量强度达到对应于从该表面反射的光的测量强度的强度水平时,产生指示晶片的表面处于期望状态的信号。 当表面处于所需状态时,晶片。 在旋转干燥半导体晶片的方法中,晶片的旋转响应于信号而停止。 还描述了包括电容传感器或干涉测量传感器的半导体晶片的旋转干燥装置。

    METHOD AND APPARATUS FOR MEGASONIC CLEANING OF PATTERNED SUBSTRATES
    3.
    发明申请
    METHOD AND APPARATUS FOR MEGASONIC CLEANING OF PATTERNED SUBSTRATES 审中-公开
    方法和装置用于形成图案的基板清洗

    公开(公告)号:WO2004074931A3

    公开(公告)日:2005-01-27

    申请号:PCT/US2004003179

    申请日:2004-02-04

    CPC classification number: H01L21/67057 B08B3/12

    Abstract: A method for cleaning a semiconductor substrate is provided. The method initiates with generating acoustic energy oriented in a substantially perpendicular direction to a surface of a semiconductor substrate. Then, acoustic energy oriented in a substantially parallel direction to the surface of the semiconductor substrate is generated. Each orientation of the acoustic energy may be simultaneously generated or alternately generated. A system and an apparatus for cleaning a semiconductor substrate are also provided.

    Abstract translation: 提供一种清洗半导体衬底的方法。 该方法通过产生在与半导体衬底的表面基本上垂直的方向上定向的声能来启动。 然后,产生与半导体衬底的表面大致平行的方向的声能。 可以同时产生或交替地产生声能的每个取向。 还提供了用于清洁半导体衬底的系统和设备。

    4.
    发明专利
    未知

    公开(公告)号:DE60138199D1

    公开(公告)日:2009-05-14

    申请号:DE60138199

    申请日:2001-09-12

    Applicant: LAM RES CORP

    Abstract: A method for rinsing a semiconductor wafer in a module utilizing a fluid delivery ring is provided. The method includes providing a process bowl having a generally circular shape bottom wall, a sidewall that extends upwardly from the bottom wall to define a cylindrical chamber, and a plurality of channels in the sidewall that extend from the bottom wall to an upper edge of the sidewall. A fluid delivery ring is attached onto the sidewall of the process bowl. Utilizing the process bowl, a plurality of supply tubes is inserted into the fluid delivery ring. The fluid delivery ring has a plurality of ring inlet and outlet pairs and a plurality of respective slots. Fluid is supplied to the supply tubes, and fluid is directed onto a surface of the semiconductor wafer defined within the process bowl.

    Method and apparatus for monitoring a semiconductor wafer during a spin drying operation

    公开(公告)号:AU2002232884A1

    公开(公告)日:2002-07-08

    申请号:AU2002232884

    申请日:2001-12-21

    Applicant: LAM RES CORP

    Inventor: TREUR RANDOLPH E

    Abstract: An apparatus for spin drying a semiconductor wafer includes a hollow core spindle and a chuck assembly having grippers for supporting a wafer at an edge thereof. A sleeve is disposed in the central opening of the spindle and a manifold is disposed in the upper end of the sleeve. A capacitance sensor is affixed to the manifold. In another apparatus, an arm having a capacitance sensor mounted thereon is positioned such that the capacitance sensor is disposed above a space to be occupied by a wafer that is supported by the grippers. An additional apparatus includes an arm having a light source and a detector mounted thereon. The light source directs light toward a surface of a wafer such that light that reflects off of the surface is substantially perpendicular to that surface. The detector is positioned to measure the intensity of the reflected light.

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