公开(公告)号：WO03082522A8

公开(公告)日：2004-12-09

申请号：PCT/US0309421

申请日：2003-03-26

Applicant: LAM RES CORP

Inventor： WILLIAMS DAMON V ,  KISTLER RODNEY ,  HEMKER DAVID J ,  GOTKIS YEHIEL ,  OWCZARZ ALEKSANDER ,  MOREL BRUNO

IPC: B24B37/005 ,  B24B49/02 ,  B24B49/10 ,  B24B49/14 ,  H01L21/304 ,  H01L21/66 ,  B24B49/12

CPC classification number: B24B37/005 ,  B24B49/10 ,  B24B49/14

Abstract: In chemical mechanical polishing apparatus, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.

Abstract translation: 在化学机械抛光装置中，晶片承载板设置有用于接收位于非常接近待抛光晶片的传感器的空腔。 由抛光垫与晶片的暴露表面之间的接触所产生的能量仅传播到传感器非常短的距离，并由传感器感测，提供关于晶片的暴露表面的性质的数据以及 这些属性的转换。 相关方法提供了将感测能量与表面性质和转变相关联的图。 相关图提供过程控制的过程状态数据。