-
公开(公告)号：SG10201606450VA
公开(公告)日：2017-03-30
申请号：SG10201606450V
申请日：2016-08-04
Applicant: LAM RES CORP
Inventor： LAI CHIUKIN STEVEN , KANARIK KEREN JACOBS , TAN SAMANTHA , CHANDRASHEKAR ANAND , SU TEH‐TIEN , YANG WENBING , WOOD MICHAEL , DANEK MICHAL
Abstract: Methods of depositing tungsten into high aspect ratio features using a dep-etch-dep process integrating various deposition techniques with alternating pulses of surface modification and removal during etch are provided herein.
Search Results
1
records
(took 0.021 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
