公开(公告)号：US20230352272A1

公开(公告)日：2023-11-02

申请号：US18013145

申请日：2021-10-12

Applicant: LAM RESEARCH CORPORATION

Inventor： Juline SHOEB ,  Alexander Miller PATERSON

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32724 ,  H01J37/32091 ,  H01J2237/2007 ,  H01J2237/0656 ,  H01L21/6833

Abstract: A substrate processing system includes a substrate support, N RF sources and a controller. The substrate support is arranged in a processing chamber, supports a substrate on an upper surface thereof, and includes: a baseplate made of electrically conductive material and M electrodes disposed in the baseplate. Each of the N RF sources supplies a respective RF signal to one or more of the M electrodes, where: M and N are integers greater than or equal to two; each of the respective RF signals is supplied to a different set of the M electrodes; and each of the sets includes a different one or more of the M electrodes. The controller causes one or more coils to strike and maintain plasma in the processing chamber independently of the N RF sources and separately controls voltage outputs of the N RF sources to adjust the plasma in the processing chamber.