公开(公告)号：AU7383801A

公开(公告)日：2001-10-30

申请号：AU7383801

申请日：2001-04-10

Applicant: LEICA MICROSYSTEMS

Inventor： GANSER MICHAEL ,  WEISS ALBRECHT ,  STENZEL RUDIGER

IPC: G01N1/06 ,  B23K26/00 ,  B23K26/066 ,  G01N1/04 ,  G01N1/28 ,  G02B21/32 ,  B23K26/06

Abstract: The invention relates to a method and a device for laser cutting microscopic samples. The device for laser cutting microscopic samples comprises a microscope (1) having at least one lens (6) for observing a sample (12) that is to be cut The lens (6) defines an optical axis (14) and a lens aperture (34). A laser (4) is also connected to the microscope (1). The laser (4) generates a laser beam (41) that is injected into the lens (6) by means of at least one optical system (16). A diaphragm (18) is provided, which generates a dimmed laser beam (4b), whereby the laser aperture (36) generated by the lens (6) is smaller than the lens aperture (34) of the lens (6) itself.

公开(公告)号：AU5210701A

公开(公告)日：2001-10-30

申请号：AU5210701

申请日：2001-03-21

Applicant: LEICA MICROSYSTEMS

Inventor： GANSER MICHAEL ,  WEISS ALBRECHT ,  STENZEL RUDIGER

IPC: B23K26/00 ,  B23K26/10 ,  B23K26/40 ,  G01N1/04 ,  G01N1/28 ,  G02B21/32

Abstract: The invention relates to a device for laser cutting preparations which comprises an XY table ( 2 ) that defines a table surface ( 4 ). A holding device ( 14 ) for accommodating an object support ( 6 ) with a preparation ( 8 ) is arranged above the table surface ( 4 ) and is joined to the XY table ( 2 ) in a manner that permits it to be displaced in the Y direction ( 20 a) in the X direction ( 22 a). An open working space ( 16 ) is defined between the holding device ( 14 ) and the table surface ( 4 ). A catching device ( 10 ), which has at least one receptacle ( 12 ) for catching a preparation part that has been cut out, can be introduced into said working space. The invention also relates to a microscope that is equipped with the aforementioned laser cutting device.