公开(公告)号：WO2018190583A1

公开(公告)日：2018-10-18

申请号：PCT/KR2018/004103

申请日：2018-04-06

Applicant: LG ELECTRONICS INC.

Inventor： HEO, Younho ,  KIM, Soohyun ,  LEE, Hyun ,  JEONG, Changhyun

IPC: H01L31/18 ,  H01L31/0304 ,  H01L31/0224 ,  H01L31/0392

CPC classification number: H01L31/022441 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/0304 ,  H01L31/1868 ,  H01L31/1888 ,  H01L31/1892 ,  Y02E10/50

Abstract: According to an aspect of the present invention, there is provided a method for manufacturing a compound semiconductor solar cell, comprising: forming a sacrificial layer on one surface of a mother substrate; forming a compound semiconductor layer on the sacrificial layer; forming a first protective layer formed of a compound semiconductor on the compound semiconductor layer; depositing a second passivation layer on the first passivation layer; attaching a first lamination film on the second protective layer; separating the compound semiconductor layer, the first and second protective layers, and the first lamination film from the mother substrate by performing an ELO process to remove the sacrificial layer; forming a back electrode on the compound semiconductor layer; attaching a second lamination film on the back electrode; removing the first lamination film; removing the second protective layer; removing the first protective layer; and forming a front electrode on the compound semiconductor layer.

公开(公告)号：EP3993049A1

公开(公告)日：2022-05-04

申请号：EP19935289.9

申请日：2019-07-09

Applicant: LG Electronics Inc.

Inventor： JEONG, Changhyun ,  MOON, Seongmin ,  PARK, Changseo ,  OH, Donghae

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/02

Abstract: According to an embodiment of the present disclosure, an assembly board for use in a display manufacturing method for allowing semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field includes a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the assembly electrodes; and barrier ribs stacked on the dielectric layer while forming cells in which the semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the assembly electrodes so as to overlap a portion of the assembly electrodes, wherein the assembly electrodes includes first electrodes and second electrodes disposed on different planes on the base portion, and the first electrodes are disposed on one surface of the base portion, and the second electrodes are disposed on one surface of the dielectric layer.

公开(公告)号：EP3989282A1

公开(公告)日：2022-04-27

申请号：EP19933494.7

申请日：2019-07-02

Applicant: LG Electronics Inc.

Inventor： OH, Donghae ,  PARK, Changseo ,  LEE, Jinhyung ,  JEONG, Changhyun

IPC: H01L27/15 ,  H01L27/12 ,  H01L33/36

Abstract: An embodiment of the present invention relates to an assembly substrate used in a method for manufacturing a display in which semiconductor light emitting devices are mounted at predetermined positions of the assembly substrate using electric and magnetic fields, wherein the assembly substrate comprises: a base part; a plurality of assembly electrodes extending in one direction and disposed in parallel on the base part; a dielectric layer laminated on the base part so as to cover the assembly electrodes; and a protrusion part that includes a partition wall laminated on the dielectric layer while forming cells in which the semiconductor light emitting devices are mounted at predetermined intervals along the extending direction of the assembly electrodes so as to overlap with a part of the assembly electrodes, and that protrudes from the inner side surface of the cell to the inside of the cell on at least one surface of the inner side surface of the cell.