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公开(公告)号：JP2001198897A
公开(公告)日：2001-07-24
申请号：JP2000314632
申请日：2000-10-16
Applicant: LUCENT TECHNOLOGIES INC
Inventor： BISHOP DAVID JOHN , BOLLE CHRISTAIN A , KIM JUNGSANG , PARDO FLAVIO
Abstract: PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit having a MEMS relay flip-chip bonded to a CMOS chip. SOLUTION: The CMOS chip is bonded to a MEMS microrelay to form a rigid electric connection between the chips, whereby highly integral electric transmission through the hybrid integrated circuit can be formed. If a delay of signal propagation between the CMOS chip and the MEMS chip is greatly reduced, the hybrid integrated circuit can be used in high band width applications.
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