LEAD FRAME AND ELECTROPLATING METHOD

    公开(公告)号:JPH1060685A

    公开(公告)日:1998-03-03

    申请号:JP14911497

    申请日:1997-06-06

    Abstract: PROBLEM TO BE SOLVED: To provide a nickel coating of a lead frame which is not cracked when applied with a stress corresponding to the packaging of an electronic device. SOLUTION: The metallic lead frame substrate of a lead frame consists of copper, copper alloy or nickel alloy, the lead frame 10 is coated with a conformal nickel coating, and the lead frame substrate is made resistant to cracking when bent through an angle of at least 82 with 150-300μm radius of curvature. When the lead frame 10 is bent by this method, the surface of the lead frame substrate is deformed. Provided that the depth of deformation does not exceed about 5μm, a crack passing through the thickness of the conformal nickel coating is not brought about.

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