公开(公告)号：JP2000156594A

公开(公告)日：2000-06-06

申请号：JP22523899

申请日：1999-08-09

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS DIXON ,  GUTENTAG CHARLES

IPC: H05K13/02 ,  B65B15/04 ,  B65D73/02 ,  B65D85/86 ,  H01L21/00 ,  H01L21/50 ,  H01L21/60 ,  H01L21/683

Abstract: PROBLEM TO BE SOLVED: To arrange a chip while directing the circuit side downward by picking the chip from the back side of a carrier tape and dispensing the chip while directing the circuit side downward with the vacuum head of a pick tool touching the back side of the chip thereby picking the chip from the carrier tape by single pick operation. SOLUTION: A carrier tape 11 and a pick tool 16 are oriented such that the active side of a chip 14 faces the vacuum head of a pick tool 16. The carrier tape 11 is oriented reversely to an ejector pin 17 and the pick tool 16 and stepped to final station. The chip 14 is not lifted up from the top but the bottom of the carrier tape 11 is pushed up thus picking the chip 14 from the back side of the carrier tape 11 and the vacuum head of the pick tool 16 is brought into contact with the chip 14 thus dispensing the chip 14 while directing the circuit side downward. According to the method, the chip 14 can be picked by single pick operation and arranged while directing the circuit side downward.

公开(公告)号：JP2000040898A

公开(公告)日：2000-02-08

申请号：JP14717699

申请日：1999-05-26

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS D ,  GUTENTAG CHARLES

IPC: H05K13/02 ,  H01L21/00 ,  H01L21/50 ,  H01L21/60 ,  H01L21/683

Abstract: PROBLEM TO BE SOLVED: To provide a method for mounting a flip chip speedily suited for a flip flop bonding by taking out an IC chip. SOLUTION: A tape system for transportation for a flip-chip assembly device is configured so that a chip 14 is taken out of the reverse side of a tape 13 for transportation. In this case an evacuation head 21 of a take-out device 16 touches the reverse side of the IC chip 14, a die take-out pin 17 pushes up the IC chip 14 and takes it out with the circuit side (where a solder bump is located) of the chip 14 facing downward.

公开(公告)号：DE69942991D1

公开(公告)日：2011-01-13

申请号：DE69942991

申请日：1999-08-02

Applicant: GUTENTAG CHARLES ,  LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS DIXON ,  GUTENTAG CHARLES

IPC: H01L21/00 ,  H05K13/02 ,  B65B15/04 ,  B65D73/02 ,  B65D85/86 ,  H01L21/50 ,  H01L21/60 ,  H01L21/683