公开(公告)号：JP2002036200A

公开(公告)日：2002-02-05

申请号：JP2001170687

申请日：2001-06-06

Applicant: LUCENT TECHNOLOGIES INC ,  AGERE SYST OPTOELECTRONICS

Inventor： DEGANI YINON ,  DUDDERAR THOMAS DIXON ,  TAI KING L

IPC: G02B26/08 ,  B81B7/00 ,  B81B7/02

Abstract: PROBLEM TO BE SOLVED: To provide the interconnection of a micro electronic machine mechanical system MEMS. SOLUTION: A conventional MEMS device array has a number of mechanical devices respectively driven by a multi chip module MCM. By mounting the multi chip modules MCM on both faces of a system interconnection board, the interconnection of high density can be achieved. The multi chip modules MCM on a common circuit for driving a predetermined mechanical element are mounted on both faces of the system interconnection board, and interconnected to each other by vias penetrating through the board, whereby the total length of interconnection is reduced. By mounting all functional elements onto a socket by using a contact pin array for electric connection, the quick replacement/repairing can be easily executed. The in-service reliability can be obtained by providing a spare socket for the redundant MCM.

公开(公告)号：JP2000156594A

公开(公告)日：2000-06-06

申请号：JP22523899

申请日：1999-08-09

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS DIXON ,  GUTENTAG CHARLES

IPC: H05K13/02 ,  B65B15/04 ,  B65D73/02 ,  B65D85/86 ,  H01L21/00 ,  H01L21/50 ,  H01L21/60 ,  H01L21/683

Abstract: PROBLEM TO BE SOLVED: To arrange a chip while directing the circuit side downward by picking the chip from the back side of a carrier tape and dispensing the chip while directing the circuit side downward with the vacuum head of a pick tool touching the back side of the chip thereby picking the chip from the carrier tape by single pick operation. SOLUTION: A carrier tape 11 and a pick tool 16 are oriented such that the active side of a chip 14 faces the vacuum head of a pick tool 16. The carrier tape 11 is oriented reversely to an ejector pin 17 and the pick tool 16 and stepped to final station. The chip 14 is not lifted up from the top but the bottom of the carrier tape 11 is pushed up thus picking the chip 14 from the back side of the carrier tape 11 and the vacuum head of the pick tool 16 is brought into contact with the chip 14 thus dispensing the chip 14 while directing the circuit side downward. According to the method, the chip 14 can be picked by single pick operation and arranged while directing the circuit side downward.

公开(公告)号：JPH09186289A

公开(公告)日：1997-07-15

申请号：JP32826096

申请日：1996-12-09

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DEGANI YINON ,  HAN BYUNG JOON ,  DUDDERAR THOMAS DIXON

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To provide the assembly of integrated circuit chips laminated in multilayers. SOLUTION: The chip assembly of the laminated structure of multilayers is constituted by alternately disposing chips 11, 12, 13, 14, 15, 16, 17, 18 and connecting layers 122, 142, 162, 182 and solder bumps 201. The advantage is that the bottom surface of the chip is connected to the upper surface of the chip by insulating connecting layer. Further, another advantage is that the wiring pad on the bottom surface of the flip-chip is electrically connected to the wiring pad of the chip on the upper surface of the next lower level by the solder bump.

公开(公告)号：JPH11345932A

公开(公告)日：1999-12-14

申请号：JP13917599

申请日：1999-05-19

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DEGANI YINON ,  DUDDERAR THOMAS DIXON ,  TAI KING L

IPC: H05K1/14 ,  H01L25/04 ,  H01L25/065 ,  H01L25/18

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-on-silicon mutual connection package which is free from being affected by thermal expansion of a mutual connection package. SOLUTION: An integrated circuit package has a main printed circuit board 24, at least two intermediate printed circuit boards 15 loaded on the surface of the circuit board 24, and silicon-on-silicon multichip modules 11, 12 each of which is joined with one of the circuit boards 15 by solder junction 18. In this case, each multichip module has a silicon made integrated circuit chip 13 joined with a silicon made mutual connection substrate 14 and the thermal expansion coefficients of the main printed circuit board 24, and the intermediate printed circuit boards 15 are respectively

公开(公告)号：DE60037990T2

公开(公告)日：2009-02-05

申请号：DE60037990

申请日：2000-09-11

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS DIXON ,  KOSSIVES DEAN PAUL ,  LOW YEE LENG

IPC: H01L23/552 ,  H01L23/00 ,  H05K9/00 ,  H01L23/02 ,  H01L23/055 ,  H01L23/12 ,  H01L23/498 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34

Abstract: The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization (27). The normally exposed top and side surfaces of the MCM package are also metallized (21). A solder wall (25) is provided on the interconnect PCB which seals the gap between the MCM tile and the PCB interconnect substrate. The solder wall can be formed using standard solder bump technology, and the seal between the MCM and the PCB may be made during the same reflow operation that is used to flip-chip bond the MCM tile to the PCB.

公开(公告)号：DE60037990D1

公开(公告)日：2008-03-27

申请号：DE60037990

申请日：2000-09-11

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS DIXON ,  KOSSIVES DEAN PAUL ,  LOW YEE LENG

IPC: H01L23/552 ,  H01L23/00 ,  H05K9/00 ,  H01L23/02 ,  H01L23/055 ,  H01L23/12 ,  H01L23/498 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34

Abstract: The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization (27). The normally exposed top and side surfaces of the MCM package are also metallized (21). A solder wall (25) is provided on the interconnect PCB which seals the gap between the MCM tile and the PCB interconnect substrate. The solder wall can be formed using standard solder bump technology, and the seal between the MCM and the PCB may be made during the same reflow operation that is used to flip-chip bond the MCM tile to the PCB.

公开(公告)号：CA2342409A1

公开(公告)日：2001-11-22

申请号：CA2342409

申请日：2001-03-29

Applicant: LUCENT TECHNOLOGIES INC

Inventor： TAI KING LIEN ,  DUDDERAR THOMAS DIXON ,  DEGANI YINON

IPC: B81C3/00 ,  B81B7/00 ,  H01L23/02 ,  H01L23/06 ,  H01L31/02 ,  B81C5/00

Abstract: The specification describes packaging assemblies for micro-electronic machin ed mechanical systems (MEMS). The MEMS devices in these package assemblies are based on silicon MEMS devices on a silicon support and the MEMS devices and the silicon support are mechanically isolated from foreign materials. Foreign materials pose the potential for differential thermal expansion that deleteriously affects optical alignment in the MEMS devices. In a preferred embodiment the MEMS devices are enclosed in an all- silicon chamber. Mechanical isolation is also aided by using a pin contact array for interconnecting the silicon support substrate for the MEMS devices to the ne xt interconnect level. The use of the pin contact array also allows the MEMS devices to be easily demountable for replacement or repair.

公开(公告)号：DE60112003D1

公开(公告)日：2005-08-25

申请号：DE60112003

申请日：2001-05-31

Applicant: LUCENT TECHNOLOGIES INC ,  AGERE SYST OPTOELECTRONICS

Inventor： DEGANI YINON ,  DUDDERAR THOMAS DIXON ,  TAI KING LIEN

IPC: G02B26/08 ,  B81B7/00 ,  B81B7/02 ,  H01L23/538

Abstract: The specification describes interconnection strategies for micro-electronic machined mechanical systems (MEMS). Typical MEMS device array comprise a large number of individual mechanical devices each electrically driven by multi-chip modules (MCMs). High density interconnection is achieved by mounting the MCMs mounted on both sides of a system interconnection substrate. Overall interconnection length is reduced by locating the MCMs in a common circuit driving a given mechanical element on opposite sides of the system interconnection substrate and interconnecting them using vias through the substrate. Rapid replacement/repair is facilitated by mounted all active elements in sockets using contact pin arrays for electrical connections. In service reliability is obtained by providing spare sockets for redundant MCMs.

公开(公告)号：DE69942991D1

公开(公告)日：2011-01-13

申请号：DE69942991

申请日：1999-08-02

Applicant: GUTENTAG CHARLES ,  LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS DIXON ,  GUTENTAG CHARLES

IPC: H01L21/00 ,  H05K13/02 ,  B65B15/04 ,  B65D73/02 ,  B65D85/86 ,  H01L21/50 ,  H01L21/60 ,  H01L21/683

公开(公告)号：DE60112003T2

公开(公告)日：2006-06-01

申请号：DE60112003

申请日：2001-05-31

Applicant: LUCENT TECHNOLOGIES INC ,  AGERE SYST OPTOELECTRONICS

Inventor： DEGANI YINON ,  DUDDERAR THOMAS DIXON ,  TAI KING LIEN

IPC: B81B7/00 ,  G02B26/08 ,  B81B7/02 ,  H01L23/538

Abstract: The specification describes interconnection strategies for micro-electronic machined mechanical systems (MEMS). Typical MEMS device array comprise a large number of individual mechanical devices each electrically driven by multi-chip modules (MCMs). High density interconnection is achieved by mounting the MCMs mounted on both sides of a system interconnection substrate. Overall interconnection length is reduced by locating the MCMs in a common circuit driving a given mechanical element on opposite sides of the system interconnection substrate and interconnecting them using vias through the substrate. Rapid replacement/repair is facilitated by mounted all active elements in sockets using contact pin arrays for electrical connections. In service reliability is obtained by providing spare sockets for redundant MCMs.