公开(公告)号：JP2001203315A

公开(公告)日：2001-07-27

申请号：JP2000362327

申请日：2000-11-29

Applicant: LUCENT TECHNOLOGIES INC

Inventor： GABARA THADDEUS JOHN ,  JERICHIO J JAKARA ,  O'CONNOR KEVIN JOHN ,  TAI KING L

IPC: H01L21/66 ,  H01L25/04 ,  H01L25/18

Abstract: PROBLEM TO BE SOLVED: To provide a single integrated cluster chip having a plurality of chip sites packaged in an IC package of a maltichip module-(MCM). SOLUTION: A fully functioning cluster of chip sites or an almost fully functioning chip sites is identified by a wafer level test. The cluster is individualized as a single chip, and packaged. One cluster may contain, for example, a combination of chip types such as a combination of memories and logic circuits. The cluster normally includes 3 to 25 pieces of chip sites. Two or more types of clusters can be identified and created on a single wafer. The remaining fully functioning chips are individualized as individual chips, and can be packaged as a single chip package or in any of the MCM by a conventional method. Mutually connected substrates are added with an arrangement configuration of silicon-on-silicon to the cluster, and a plurality of chip sites can be connected to each other.