ELECTROPLATING SOLUTION FOR ELECTROPLATING LEAD AND LEAD/TIN ALLOYS

    公开(公告)号:CA2296900A1

    公开(公告)日:2000-08-05

    申请号:CA2296900

    申请日:2000-01-25

    Abstract: An electroplating solution for plating bright tin, lead, or tin-lead alloy solder coatings in high speed electroplating applications. The electroplating solution includes an alkane or alkanol sulfonic acid electrolyte, a non-ionic surfactant, a grain refiner and two brightening agents: an aromatic aldehyde and a carboxylic acid. In one embodiment of the electroplating solution, the sulfonic acid electrolyte is methane sulfonic acid, the non-ionic surfactant is octylphenoxy(10)polyethoxy ethanol, the grain refiner is phenolphthalein, the aromatic aldehyde is chlorobenzaldehyde, and the carboxylic acid is methacrylic acid.

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