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公开(公告)号：JP2000169994A
公开(公告)日：2000-06-20
申请号：JP34385999
申请日：1999-12-02
Applicant: LUCENT TECHNOLOGIES INC
Inventor： CHIU SEE HONG , ZHANG YUN
Abstract: PROBLEM TO BE SOLVED: To plate thin having high reflecting property on a substrate under fast electroplating conditions by incorporating stannous sulfonate and sulfonic acid to control the bath to specified pH, adding a specified concentration of a reaction product of polyalkylene glycol and phenolphthalein. SOLUTION: Sulfonic acid is mixed by about 10 to 30 g/l in an aq.soln. containing stannous sulfonate by preferably about 10 to 100 g/l concentration as metallic tin to control the pH of the liquid to about
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公开(公告)号：JP2002339097A
公开(公告)日：2002-11-27
申请号：JP2002135188
申请日：2002-05-10
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ABYS JOSEPH A , FAN CHONGLUN , XU CHEN , ZHANG YUN
IPC: C25D5/50 , C23C26/00 , C23C28/00 , C23C28/02 , C25D7/00 , H01L23/495 , H01L23/50 , H01R13/03 , C25D7/12
Abstract: PROBLEM TO BE SOLVED: To prevent production of whiskers on tin coated metallic products. SOLUTION: A metallic substrate is coated with a tin or tin alloy layer subjected to surface doping in order to suppress the growth of tin whiskers. A metallic ground surface layer is arbitrarily selectively arranged between the substrate and the tin. In an exemplary embodiment, the metallic substrate contains the nickel surface layer and the copper alloy formed by coating gold or palladium with the tin layer subjected to surface doping. The doping suppresses the growth of the whiskers and eventually the structure is particularly effective as an electrical connector or a lead frame.
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公开(公告)号：JP2000226686A
公开(公告)日：2000-08-15
申请号：JP2000027522
申请日：2000-02-04
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ABYS JOSEPH ANTHONY , KENNETH J MULSKI , ZHANG YUN
Abstract: PROBLEM TO BE SOLVED: To provide an aq. electroplating soln. for electroplating the coating films of bright tin and tin-lead alloy solder at a high speed, especially an electroplating soln. having a simplified chemical action to minimize the effect of org. matter on the solder coating film. SOLUTION: An electroplating soln. for plating coating films of bright tin, lead or tin-lead alloy for use in high-speed electroplating contains an alkane or alkanolsulfonic acid electrolyte, a nonionic surfactant, a grain comminuting agent and two kinds of brighteners, i.e., an aromatic aldehyde and a carboxylic acid. In one way of using the electroplating soln., methanesulfonic acid is used as the sulfonic acid electrolyte, octylphenoxy(10)polyethoxyethanol as the nonioic surfactant, phenolphthalein as the grain comminuting agent, chlorobezaldehyde as the aromatic aldehyde and methacrylic acid as the carboxylic acid.
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公开(公告)号：JPH1096095A
公开(公告)日：1998-04-14
申请号：JP24038797
申请日：1997-08-21
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ZHANG YUN
Abstract: PROBLEM TO BE SOLVED: To obtain a tin plating having a particle size in a desired range, by applying a pulse current in a prescribed aq. plating bath. SOLUTION: The plating bath contains a stannous sulfonate, a sulfonic acid and an organic additives containing at least one heterocyclic moiety and at least one aromatic moiety. In such a case, the concentration of the sulfonic acid is controlled so that the pH of the plating bath is
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公开(公告)号：CA2296900A1
公开(公告)日：2000-08-05
申请号：CA2296900
申请日：2000-01-25
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ZHANG YUN , MURSKI KENNETH J , ABYS JOSEPH ANTHONY
Abstract: An electroplating solution for plating bright tin, lead, or tin-lead alloy solder coatings in high speed electroplating applications. The electroplating solution includes an alkane or alkanol sulfonic acid electrolyte, a non-ionic surfactant, a grain refiner and two brightening agents: an aromatic aldehyde and a carboxylic acid. In one embodiment of the electroplating solution, the sulfonic acid electrolyte is methane sulfonic acid, the non-ionic surfactant is octylphenoxy(10)polyethoxy ethanol, the grain refiner is phenolphthalein, the aromatic aldehyde is chlorobenzaldehyde, and the carboxylic acid is methacrylic acid.
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Patent Agency Ranking
公开(公告)号：MY132467A
公开(公告)日：2007-10-31
申请号：MYPI9703825
申请日：1997-08-20
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ZHANG YUN
Abstract: A PROCESS FOR PLATING TIN OR TIN ALLOY ONTO METAL SUBSTRATES IS DESCRIBED. IN THE PROCESS, A METAL SUBSTRATE IS PLACED IN AN ELECTROPLATING BATH THAT CONTAINS A STANNOUS SULFATE AND AN ORGANIC COMPOUND ADDITIVE IN WHICH THE ORGANIC COMPOUND HAS A HETEROCYCLIC MOIETY IN AN AQUEOUS SOLUTION OF SULFONIC ACID. THE BATH IS THEN SUBJECTED TO PULSE PLATING CONDITIONS THAT PLATE A LAYER OF TINOR TIN ALLOY ONTO THE METAL SUBSTRATE WHEREIN THE TIN IN THE TIN LAYER HAS A GRAIN SIZE OF ABOUT 2 µM TO ABOUT 8 µM. DURING PULSE PLATING, A CURRENT DENSITY OF ABOUT 65 ASF TO ABOUT 250 ASF IS APPLIED TO THE ELECTROPLATING BATH IN A PULSED MANNER, I.E. THE CURRENT IS CYCLED ON AND OFF DURING PLATING. THE DUTY CYCYLE OF THE PULSE IS ABOUT TWENTY-FIVE PERCENT TO ABOUT THIRTY PERCENT. THE DURATION OF THE ON PULSE DURING THE CYCLE IS ABOUT 50 µS TO ABOUT 500 µS.
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公开(公告)号：DE69900057D1
公开(公告)日：2001-04-12
申请号：DE69900057
申请日：1999-11-23
Applicant: LUCENT TECHNOLOGIES INC
Inventor： CHIU SEE HONG , ZHANG YUN
Abstract: An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is the reaction product of polyalkylene glycol and phenolphthalein or derivatives of phenolphthalein.
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公开(公告)号：SG53044A1
公开(公告)日：1998-09-28
申请号：SG1997002955
申请日：1997-08-15
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ZHANG YUN
Abstract: A process for plating tin or tin alloy onto metal substrates is described. In the process, a metal substrate is placed in an electroplating bath that contains a stannous sulfate and an organic compound additive in which the organic compound has a heterocyclic moiety in an aqueous solution of sulfonic acid. The bath is then subjected to pulse plating conditions that plate a layer of tin or tin alloy onto the metal substrate wherein the tin in the tin layer has a grain size of about 2 mu m to about 8 mu m. During pulse plating, a current density of about 65 ASF to about 250 ASF is applied to the electroplating bath in a pulsed manner, i.e. the current is cycled on and off during plating. The duty cycle of the pulse is about twenty-five percent to about thirty percent. The duration of the on pulse during the cycle is about 50 mu s to about 500 mu s.
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公开(公告)号：MY130855A
公开(公告)日：2007-07-31
申请号：MYPI9905245
申请日：1999-12-02
Applicant: LUCENT TECHNOLOGIES INC
Inventor： CHIU SEE HONG , ZHANG YUN
Abstract: AN ELECTROLYTE BATH FOR PLATING TIN OR TIN ALLOY ONTO METAL SUBSTRATES USING A HIGH SPEED PLATING PROCESS IS DESCRIBED. THE ELECTROLYTE BATH CONTAINS A STANNOUS ALKYL SULFONATE AND AN ALKYL SULFONIC ACID. THE BATH ALSO CONTAINS AN ORGANIC COMPOUND THAT IS THE REACTION PRODUCT OF POLYALKYLENE GLYCOL AND PHENOLPHTHALEIN OR DERIVATIVES OF PHENOLPHTHALEIN.
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公开(公告)号：DE60200154D1
公开(公告)日：2004-02-05
申请号：DE60200154
申请日：2002-04-10
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ABYS JOSEPH ANTHONY , FAN CHONGLUN , XU CHEN , ZHANG YUN
Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer finish (11) comprising a layer (13) of tin or tin alloy and one or more outer metal layers (14). An optional metal underlayer (12) may be disposed between the substrate and the tin (13). In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.
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