BONDING OF ALUMINUM OXIDE COMPONENT TO SILICON SUBSTRATE

    公开(公告)号:JPH11109183A

    公开(公告)日:1999-04-23

    申请号:JP20614198

    申请日:1998-07-22

    Abstract: PROBLEM TO BE SOLVED: To enable the bonding excellent in reliability of a component to a substrate by forming a layer containing a metal such as titanium on a substrate including cavities, forming a layer containing aluminum on the titanium layer, and bonding an oxide component to the aluminum layer to improve the adhesion to aluminum. SOLUTION: A first layer 36 containing aluminum is formed on a part of a substrate including cavities. An oxide component 16 is bonded to the aluminum layer 36. A second layer 35 containing one material selected from a group comprising titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum and tungsten, is formed on a part of the substrate 11 including cavities, and the aluminum layer 36 is formed on a second layer 35.

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