METHOD FOR PROCESSING SILICON WORK PIECE USING COMPOSITE TYPE OPTICAL TEMPERATURE MEASUREMENT SYSTEM

    公开(公告)号:JP2000356554A

    公开(公告)日:2000-12-26

    申请号:JP2000104530

    申请日:2000-04-06

    Abstract: PROBLEM TO BE SOLVED: To correctly measure the temperature of a silicon work piece where a process material is present in a wide range including a low temperature by spectrum analyzing ultraviolet beams reflected by the silicon work piece and converting the obtained spectrum data into a temperature value. SOLUTION: A light source 11 of the light reflection type thermometer radiates ultraviolet rays and visible light beams in a wavelength range of 250-550 nm. The radiated light beams and ultraviolet beam 12 through a polariscope 13. A surface 10A of the silicon work piece 10 is irradiated thereon with the beam with an angle of incidence ϕ(ϕ>45 deg.). The reflecting light beam 12 at the surface 10A is corrected by a polariscope 14, and spectrum analyzed by a spectrum analysis apparatus 15 having an optical grating diffusion element 16 and a silicon photo detector 17, so that spectrum data is obtained. The obtained spectrum data is converted into a temperature value. Information on the temperature value is sent to an electronic circuit or heating element, thereby controlling a temperature. The temperature of the silicon work piece 10 when a process material is applied or the like can be correctly measured accordingly.

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