Modulation and transmission methods to provide a wireless link and transmitter circuit for providing a wireless link
    1.
    发明公开
    Modulation and transmission methods to provide a wireless link and transmitter circuit for providing a wireless link 审中-公开
    调制和用于提供无线连接提供无线连接和发射器电路发送方法

    公开(公告)号:EP1553694A1

    公开(公告)日:2005-07-13

    申请号:EP04257337.8

    申请日:2004-11-25

    CPC classification number: H03C3/02 H04L27/367

    Abstract: A modulation method, transmission method, and transmitter circuit are described which may enable realization of a wireless link for ultra-high transmission rates in the downlink to users. In a method of modulating an input signal to obtain a desired intermediate signal, the intermediate signal is to be processed for transmission over a wireless link at a carrier frequency within a desired frequency band. The processing may include subjecting the intermediate signal to a frequency multiplier operation that exhibits an ambiguous transfer function. In the modulation method, an input signal is provided, and a set of signal states applicable to the desired intermediate signal are generated so that a signal output from the frequency multiplier operation has a substantially non-ambiguous relation to the desired intermediate signal. The input signal may thus be modulated according to I and Q baseband signals to obtain the desired intermediate signal with the generated set of signal states.

    Abstract translation: 一种调制方法,发送方法,和发射机电路中描述了可以使实现在下行链路中向用户的无线链路用于超高传输速率。 在输入信号的调制,以获得所需的中间信号的方法,所述中间信号是用于传输在以载波频率的频带期望的内的无线链路进行处理。 该处理可以包括将中间信号进行倍频器手术并在暧昧传递函数展品。 在调制方法来输入信号被提供,和一组信号的陈述适用于所期望的中间信号生成所以没有从频率乘法器手术输出的信号具有基本上非含糊关系到所需的中间信号。 输入信号可被调制THUSgemäß于I和Q基带信号,以获得与所产生的一组信号状态的所需中间体信号。

    Multilayer printed circuit board with reduced signal losses at via holes
    3.
    发明公开
    Multilayer printed circuit board with reduced signal losses at via holes 有权
    Mehrlagige Leiterplatte mit an denKontaktlöchernverringerten Verlusten

    公开(公告)号:EP1463387A1

    公开(公告)日:2004-09-29

    申请号:EP04250909.1

    申请日:2004-02-20

    Abstract: An apparatus is disclosed that substantially reduces or eliminates the resonance that occurs in vias that connect the layers of a printed circuit board by electrically coupling a first transmission line (704) in a circuit board to a second transmission line (705) in a circuit board by two electrical paths (706,707) having substantially the same electrical length. The two electrical paths are created by connecting the first transmission line to a first via which is in turn connected to a second via having a second transmission line with a plurality of connecting electrical paths between the two vias. In one illustrative embodiment, electrical traces are used to connect the top of the first via to the top of the second via and the bottom of the first via to the bottom of the second via.

    Abstract translation: 公开了一种设备,其基本上减少或消除了在通过将电路板中的第一传输线(704)电耦合到电路板中的第二传输线(705)的连接印刷电路板的层的通孔中发生的共振 通过具有基本上相同电长度的两个电路径(706,707)。 通过将第一传输线连接到第一通孔而产生两个电路径,第一通孔又连接到第二通孔,第二通孔具有在两个通孔之间具有多个连接电路径的第二传输线。 在一个说明性实施例中,使用电迹线将第一通孔的顶部连接到第二通孔的顶部和第一通孔的底部到第二通孔的底部。

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