公开(公告)号：EP1126181A2

公开(公告)日：2001-08-22

申请号：EP01301027.7

申请日：2001-02-06

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Chen, Shiaw-Jong Steven ,  Hooey, Roger J.

IPC: F04D29/62

CPC classification number: F04D13/06 ,  F04D29/426

Abstract: The present invention provides a miniature liquid transfer pump. The pump has a housing that includes first and second blocks joinable to form a leak-resistant impeller chamber with a drive shaft aperture, an inlet and an outlet. An impeller is located in the impeller chamber and a micro-motor with a drive shaft extending therefrom is mounted to the housing. The drive shaft on the micro-motor passes through the drive shaft aperture and engages the impeller. The micro-motor drives the impeller to draw liquid through the inlet and eject the liquid through the outlet.

Abstract translation: 本发明提供一种微型液体输送泵。 泵具有壳体，该壳体包括可连接的第一和第二块，以形成具有驱动轴孔，入口和出口的防漏叶轮室。 叶轮位于叶轮室中，并且具有从其延伸的驱动轴的微型马达安装到壳体。 微型马达上的驱动轴通过驱动轴孔并接合叶轮。 微型马达驱动叶轮将液体通过入口抽出并通过出口排出液体。

公开(公告)号：EP1122991A3

公开(公告)日：2003-08-27

申请号：EP01300511.1

申请日：2001-01-22

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Chen, Shiaw-Jong Steve ,  Hooey, Roger J.

IPC: H05K7/20 ,  H05K7/14 ,  B29C45/14

CPC classification number: H05K7/20454 ,  H01L2924/0002 ,  H05K7/20463 ,  H05K7/209 ,  H01L2924/00

Abstract: The present invention provides an encapsulant structure (130) for retaining an electronic circuit (110) having heat-generating components within a case (120) that at least partially surrounds the electronic circuit. In one advantageous embodiment, the encapsulant structure provides for a thermally conductive insert to be located within the case proximate the heat-generating components. The insert increases the heat transfer efficiency from the electronic circuit to the case.

公开(公告)号：EP1121007A3

公开(公告)日：2003-05-14

申请号：EP01300291.0

申请日：2001-01-15

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Chen, Shiaw-Jong Steve ,  Hooey, Roger J. ,  Truong, Thang D.

IPC: H05K3/44

CPC classification number: H05K3/445 ,  H05K3/403 ,  H05K3/4608 ,  H05K2201/10386

Abstract: An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement comprises a metal substrate (22) having a first side (24) and a second side (26), a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum (32) alternated with at least one first-side dielectric stratum (28) affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum (34) alternated with at least one second-side dielectric stratum (30) affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses (46, 48) intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.

公开(公告)号：EP1133024A2

公开(公告)日：2001-09-12

申请号：EP01301722.3

申请日：2001-02-26

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Shiaw-Jong, Steve Chen ,  Hooey, Roger J.

IPC: H01R29/00 ,  H01R12/32 ,  H01R12/22

CPC classification number: H01R12/716

Abstract: A header (100) includes, in one embodiment, first (110) and second (120) contacts, and an intermediate body (130). The intermediate body includes an insulated section (135) interposed between the first and second contacts and has a cavity therein (140). The intermediate body also includes a semiconductor die (150), located within the cavity, adapted to condition a signal passing through at least a portion of the header.

Abstract translation: 一个头（100）包括，在一个实施方式中，第一（110）和第二（120）接触，并在中间体（130）。 中间主体包括在所述第一和第二触点之间的绝缘部分（135），并且其中具有空腔（140）。 因此，该中间体包括位于空腔内的半导体时，（150），angepasst来调节穿过所述报头的至少一部分的信号。

公开(公告)号：EP1133024A3

公开(公告)日：2003-11-12

申请号：EP01301722.3

申请日：2001-02-26

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Chen, Shiaw-Jong Steve ,  Hooey, Roger J.

IPC: H01R29/00 ,  H01R12/32 ,  H01R12/22 ,  H05K7/10

CPC classification number: H01R12/716

Abstract: A header (100) includes, in one embodiment, first (110) and second (120) contacts, and an intermediate body (130). The intermediate body includes an insulated section (135) interposed between the first and second contacts and has a cavity therein (140). The intermediate body also includes a semiconductor die (150), located within the cavity, adapted to condition a signal passing through at least a portion of the header.

公开(公告)号：EP1126181A3

公开(公告)日：2002-01-16

申请号：EP01301027.7

申请日：2001-02-06

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Chen, Shiaw-Jong Steven ,  Hooey, Roger J.

IPC: F04D29/62 ,  F04D13/06

CPC classification number: F04D13/06 ,  F04D29/426

Abstract: The present invention provides a miniature liquid transfer pump. The pump has a housing that includes first and second blocks joinable to form a leak-resistant impeller chamber with a drive shaft aperture, an inlet and an outlet. An impeller is located in the impeller chamber and a micro-motor with a drive shaft extending therefrom is mounted to the housing. The drive shaft on the micro-motor passes through the drive shaft aperture and engages the impeller. The micro-motor drives the impeller to draw liquid through the inlet and eject the liquid through the outlet.

Abstract translation: 本发明提供了一种微型液体输送泵。 该泵具有包括第一和第二块的壳体，该第一和第二块可连接以形成具有驱动轴孔，入口和出口的防泄漏叶轮室。 叶轮位于叶轮室中，并且具有从其延伸的驱动轴的微型马达安装到壳体。 微型电机上的传动轴穿过传动轴孔并与叶轮啮合。 微型马达驱动叶轮从进口吸取液体并通过出口排出液体。

公开(公告)号：EP1122991A2

公开(公告)日：2001-08-08

申请号：EP01300511.1

申请日：2001-01-22

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Chen, Shiaw-Jong Steve ,  Hooey, Roger J.

IPC: H05K7/20 ,  H05K7/14 ,  B29C45/14

CPC classification number: H05K7/20454 ,  H01L2924/0002 ,  H05K7/20463 ,  H05K7/209 ,  H01L2924/00

Abstract: The present invention provides an encapsulant structure (130) for retaining an electronic circuit (110) having heat-generating components within a case (120) that at least partially surrounds the electronic circuit. In one advantageous embodiment, the encapsulant structure provides for a thermally conductive insert to be located within the case proximate the heat-generating components. The insert increases the heat transfer efficiency from the electronic circuit to the case.

Abstract translation: 本发明提供了一种用于将具有发热部件的电子电路（110）保持在至少部分地围绕电子电路的壳体（120）内的密封剂结构（130）。 在一个有利的实施例中，密封剂结构提供导热插入件位于靠近发热部件的壳体内。 插件增加了从电子电路到壳体的传热效率。

公开(公告)号：EP1121007A2

公开(公告)日：2001-08-01

申请号：EP01300291.0

申请日：2001-01-15

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Chen, Shiaw-Jong Steve ,  Hooey, Roger J. ,  Truong, Thang D.

IPC: H05K3/44

CPC classification number: H05K3/445 ,  H05K3/403 ,  H05K3/4608 ,  H05K2201/10386

Abstract: An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement comprises a metal substrate (22) having a first side (24) and a second side (26), a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum (32) alternated with at least one first-side dielectric stratum (28) affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum (34) alternated with at least one second-side dielectric stratum (30) affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses (46, 48) intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.

Abstract translation: 一种被配置用于将电子部件安装在电路装置中的改进的电路板装置包括具有第一侧面（24）和第二侧面（26），第一侧面层状结构和第二侧面层状结构的金属基板（22）。 第一侧层状结构包括至少一个与固定在第一侧上的至少一个第一侧介电层（28）交替的第一侧导电层（32）。第二侧层流结构包括至少一个第二侧导电层 层（34）与固定在金属基板的第二侧的至少一个第二侧电介质层（30）交替。 所述装置还包括位于所述至少一个第一侧导电层的所选择的第一侧层和所述至少一个第二侧导电层的选定的第二侧层之间的多个导电的内侧平台（46,48）。