公开(公告)号：EP0989794A3

公开(公告)日：2000-11-15

申请号：EP99307258.6

申请日：1999-09-14

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Roy, Apurba

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20509 ,  H05K1/0209 ,  H05K3/341 ,  H05K2201/09781 ,  H05K2201/10204

Abstract: In accordance with the invention, a plurality of high thermal conductivity bodies are bonded to relatively hot spots of a component-populated substrate surface to provide thermal conduction from the surface to an overlying thermal plane. The high conductivity bodies can be configured for pick-and-place application and self-aligned in solder bonding. Receiving solder pads on the substrate facilitate low thermal resistance solder bonding and self-alignment. In a preferred embodiment the bodies are rectangular parallelpipeds with bifurcated bonding surfaces.

公开(公告)号：EP0989794A2

公开(公告)日：2000-03-29

申请号：EP99307258.6

申请日：1999-09-14

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Roy, Apurba

IPC: H05K7/20

CPC classification number: H05K7/20509 ,  H05K1/0209 ,  H05K3/341 ,  H05K2201/09781 ,  H05K2201/10204

Abstract: In accordance with the invention, a plurality of high thermal conductivity bodies are bonded to relatively hot spots of a component-populated substrate surface to provide thermal conduction from the surface to an overlying thermal plane. The high conductivity bodies can be configured for pick-and-place application and self-aligned in solder bonding. Receiving solder pads on the substrate facilitate low thermal resistance solder bonding and self-alignment. In a preferred embodiment the bodies are rectangular parallelpipeds with bifurcated bonding surfaces.

Abstract translation: 根据本发明，多个高导热体被结合到组分填充的衬底表面的相对热点上以提供从表面到上覆热平面的热传导。 高导电体可以配置用于拾取和放置应用，并在焊接中自对准。 接收衬底上的焊盘有助于低热阻焊接和自对准。 在优选实施例中，主体是具有分叉结合表面的矩形平行镊子。