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    Adjustable solid state illumination module having array of light pixels
    1.
    发明授权
    Adjustable solid state illumination module having array of light pixels 有权
    具有光像素阵列的可调固态照明模块

    公开(公告)号：US09041316B2

    公开(公告)日：2015-05-26

    申请号：US13806676

    申请日：2011-06-27

    Applicant: Bo Pi ,  Li Xu

    Inventor： Bo Pi ,  Li Xu

    IPC: H05B37/00 ,  G05F1/00 ,  H05B33/08

    CPC classification number: H05B33/0845 ,  H05B33/0818 ,  H05B33/0854 ,  H05B33/086

    Abstract: Techniques for constructing a solid-state lighting module that includes solid-state light emitters that emit light of different colors and are selected from separated groups of solid-state light emitters that emit light of two or more separated colors, wherein one or more solid-state light emitters are selected from each of the separated color groups of solid-state light emitters. The lighting module includes a programmable device that stores or remembers desirable optical intensities of the separated color groups of solid-state light emitters, and a control circuit that individually controls light intensity of each of the separated color groups of solid-state light emitters. The light control circuit is coupled to or in communication with the programmable device to receive the desirable optical intensities of the separated groups of solid-state light emitters and is operable to adjust the intensities of the separated color groups of solid-state light emitters based on the desirable intensities.

    Abstract translation: 一种用于构造固态照明模块的技术，该固态照明模块包括发射不同颜色的光的固态发光体，其选自发射两种或更多种分离颜色的光的固态发光体的分离组，其中一个或多个固 - 从固态发光体的分离颜色组中的每一个中选择状态光发射器。 照明模块包括存储或记住固态发光体的分离色组的期望光强度的可编程装置，以及分别控制固态发光体分离的各色组的光强度的控制电路。 光控制电路耦合到可编程器件或与可编程器件通信，以接收分离的固态发光体组的期望的光强度，并且可操作以基于以下方式调整固态发光器的分离色组的强度 所需的强度。

    OPTICAL BEAM SHAPING AND POLARIZATION SELECTION ON LED WITH WAVELENGTH CONVERSION
    2.
    发明申请
    OPTICAL BEAM SHAPING AND POLARIZATION SELECTION ON LED WITH WAVELENGTH CONVERSION 有权
    具有波长转换的LED的光学波束形状和极化选择

    公开(公告)号：US20130258634A1

    公开(公告)日：2013-10-03

    申请号：US13807269

    申请日：2011-06-28

    Applicant: Li Xu ,  Bo Pi

    Inventor： Li Xu ,  Bo Pi

    IPC: G02B5/04 ,  F21V9/00 ,  F21V9/14

    CPC classification number: G02B5/04 ,  F21V9/00 ,  F21V9/14 ,  G02B5/0231 ,  G02B5/0278

    Abstract: Techniques, devices and materials for light source devices that convert excitation light into different light via wavelength conversion materials. One example of a light source includes an excitation light source; a wavelength conversion material that absorbs light from the excitation light source and emits a longer wavelength light; and a layer of a transparent material that has plural optical structures in contact to or in close proximity to the wavelength conversion material to receive the emitted light from the wavelength conversion material and to modify the received light to produce output light with a desired spatial pattern associated with the plural optical structures.

    Abstract translation: 用于通过波长转换材料将激发光转换成不同光的光源装置的技术，装置和材料。 光源的一个例子包括激发光源; 波长转换材料，其吸收来自激发光源的光并发射较长波长的光; 以及透明材料层，其具有与波长转换材料接触或接近波长转换材料的多个光学结构，以接收来自波长转换材料的发射光并修改接收的光以产生具有所需空间图案相关联的输出光 具有多个光学结构。

    LED PACKAGE AND METHOD OF MAKING THE SAME
    3.
    发明申请
    LED PACKAGE AND METHOD OF MAKING THE SAME 有权
    LED封装及其制造方法

    公开(公告)号：US20130099275A1

    公开(公告)日：2013-04-25

    申请号：US13806696

    申请日：2011-06-27

    Applicant: Bo Pi ,  Li Xu

    Inventor： Bo Pi ,  Li Xu

    IPC: H01L33/64 ,  H01L33/62

    CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/644 ,  H01L2224/48247 ,  H01L2933/0075

    Abstract: LED packages and their fabrication techniques are disclosed to provide LED package with improved thermal dissipation based on one or more thermally conductive channels or studs. In one implementation, a LED package includes a plastic body structured to have a hole that penetrates through the plastic body; a metal contact formed on the plastic body at one side of the hole to cover the hole; a LED mounted to the metal contact at a location that spatially overlaps with the hole; and a stud formed in the hole in contact with the metal contact at a first end of the stud and extending to an opening of the hole at a second end of the stud, the stud being formed of a thermally conductive material to transfer heat from the LED through the metal contact and the stud to dissipate the heat at the opening of the hole via the second end of the stud.

    Abstract translation: LED封装及其制造技术被公开以提供基于一个或多个导热通道或螺柱的改进的散热的LED封装。 在一个实施方案中，LED封装包括塑料体，其被构造成具有穿透塑料体的孔; 形成在所述孔的一侧的所述塑料体上以覆盖所述孔的金属接触; 在与孔空间重叠的位置处安装到金属接触件的LED; 以及螺柱，其形成在所述孔中，在所述螺柱的第一端处与所述金属接触件接触并在所述螺柱的第二端处延伸到所述孔的开口，所述螺柱由导热材料形成，以将热量 LED穿过金属触点和螺柱，以通过螺柱的第二端散开孔的开口处的热量。

    Optical beam shaping and polarization selection on LED with wavelength conversion
    4.
    发明授权
    Optical beam shaping and polarization selection on LED with wavelength conversion 有权

    公开(公告)号：US09759843B2

    公开(公告)日：2017-09-12

    申请号：US13807269

    申请日：2011-06-28

    Applicant: Li Xu ,  Bo Pi

    Inventor： Li Xu ,  Bo Pi

    IPC: F21V9/00 ,  G02B5/04 ,  G02B5/02 ,  F21V9/14

    CPC classification number: G02B5/04 ,  F21V9/00 ,  F21V9/14 ,  G02B5/0231 ,  G02B5/0278

    Abstract: Techniques, devices and materials for light source devices that convert excitation light into different light via wavelength conversion materials. One example of a light source includes an excitation light source; a wavelength conversion material that absorbs light from the excitation light source and emits a longer wavelength light; and a layer of a transparent material that has plural optical structures in contact to or in close proximity to the wavelength conversion material to receive the emitted light from the wavelength conversion material and to modify the received light to produce output light with a desired spatial pattern associated with the plural optical structures.

    LED package and method of making the same
    5.
    发明授权
    LED package and method of making the same 有权
    LED封装及其制作方法

    公开(公告)号：US08896015B2

    公开(公告)日：2014-11-25

    申请号：US13806696

    申请日：2011-06-27

    Applicant: Bo Pi ,  Li Xu

    Inventor： Bo Pi ,  Li Xu

    IPC: H01L33/64 ,  H01L33/62 ,  H01L33/48

    CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/644 ,  H01L2224/48247 ,  H01L2933/0075

    Abstract: LED packages and their fabrication techniques are disclosed to provide LED package with improved thermal dissipation based on one or more thermally conductive channels or studs. In one implementation, a LED package includes a plastic body structured to have a hole that penetrates through the plastic body; a metal contact formed on the plastic body at one side of the hole to cover the hole; a LED mounted to the metal contact at a location that spatially overlaps with the hole; and a stud formed in the hole in contact with the metal contact at a first end of the stud and extending to an opening of the hole at a second end of the stud, the stud being formed of a thermally conductive material to transfer heat from the LED through the metal contact and the stud to dissipate the heat at the opening of the hole via the second end of the stud.

    Abstract translation: LED封装及其制造技术被公开以提供基于一个或多个导热通道或螺柱的改进的散热的LED封装。 在一个实施方案中，LED封装包括塑料体，其被构造成具有穿透塑料体的孔; 形成在所述孔的一侧的所述塑料体上以覆盖所述孔的金属接触; 在与孔空间重叠的位置处安装到金属接触件的LED; 以及螺柱，其形成在所述孔中，在所述螺柱的第一端处与所述金属接触件接触并在所述螺柱的第二端处延伸到所述孔的开口，所述螺柱由导热材料形成，以将热量 LED穿过金属触点和螺柱，以通过螺柱的第二端散开孔的开口处的热量。

    ADJUSTABLE SOLID STATE ILLUMINATION MODULE HAVING ARRAY OF LIGHT PIXELS
    6.
    发明申请
    ADJUSTABLE SOLID STATE ILLUMINATION MODULE HAVING ARRAY OF LIGHT PIXELS 有权
    具有光像素阵列的可调整固态照明模块

    公开(公告)号：US20130257287A1

    公开(公告)日：2013-10-03

    申请号：US13806676

    申请日：2011-06-27

    Applicant: Bo Pi ,  Li Xu

    Inventor： Bo Pi ,  Li Xu

    IPC: H05B33/08

    CPC classification number: H05B33/0845 ,  H05B33/0818 ,  H05B33/0854 ,  H05B33/086

    Abstract: Techniques for constructing a solid-state lighting module that includes solid-state light emitters that emit light of different colors and are selected from separated groups of solid-state light emitters that emit light of two or more separated colors, wherein one or more solid-state light emitters are selected from each of the separated color groups of solid-state light emitters. The lighting module includes a programmable device that stores or remembers desirable optical intensities of the separated color groups of solid-state light emitters, and a control circuit that individually controls light intensity of each of the separated color groups of solid-state light emitters. The light control circuit is coupled to or in communication with the programmable device to receive the desirable optical intensities of the separated groups of solid-state light emitters and is operable to adjust the intensities of the separated color groups of solid-state light emitters based on the desirable intensities.

    Abstract translation: 一种用于构造固态照明模块的技术，该固态照明模块包括发射不同颜色的光的固态发光体，其选自发射两种或更多种分离颜色的光的固态发光体的分离组，其中一个或多个固 - 从固态发光体的分离颜色组中的每一个中选择状态光发射器。 照明模块包括存储或记住固态发光体的分离色组的期望光强度的可编程装置，以及分别控制固态发光体分离的各色组的光强度的控制电路。 光控制电路耦合到可编程器件或与可编程器件通信，以接收分离的固态发光体组的期望的光强度，并且可操作以基于以下方式调整固态发光器的分离色组的强度 所需的强度。

    Optical multiphase flow sensor
    9.
    发明授权
    Optical multiphase flow sensor 有权
    光学多相流量传感器

    公开(公告)号：US07087887B1

    公开(公告)日：2006-08-08

    申请号：US10697673

    申请日：2003-10-29

    Applicant: Bo Pi ,  Shulai Zhao ,  Zhihao Chen

    Inventor： Bo Pi ,  Shulai Zhao ,  Zhihao Chen

    IPC: G02B6/26

    CPC classification number: G02B6/2826

    Abstract: Waveguide sensors having a side-polished coupling port at the waveguide cladding to sense a material based on material-specific optical attenuation by evanescent coupling at the coupling port.

    Abstract translation: 波导传感器在波导包层处具有侧面抛光的耦合端口，以基于耦合端口处的衰减耦合的材料特定光衰减来感测材料。

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