PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS
    1.
    发明申请
    PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS 审中-公开
    酸性电镀解决方案的脉冲反向电解

    公开(公告)号:WO2006011922A3

    公开(公告)日:2007-02-22

    申请号:PCT/US2005008502

    申请日:2005-03-15

    Applicant: MACDERMID INC

    CPC classification number: C25D5/18 C25D3/38

    Abstract: Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.

    Abstract translation: 酸性铜溶液的脉冲反向电解用于将铜应用于印刷滚筒,尤其是凹版印刷滚筒。 电镀组合物通常包含铜离子,抗衡离子,氯离子,聚亚烷基二醇和溶于水的二价硫化合物。 其优点包括电镀在电镀品上的铜的厚度分布得到改善,金属废物减少,电镀时间缩短,生产能力提高。

    CONTROLLING THE HARDNESS OF ELECTRODEPOSITED COPPER COATINGS BY VARIATION OF CURRENT PROFILE
    2.
    发明申请
    CONTROLLING THE HARDNESS OF ELECTRODEPOSITED COPPER COATINGS BY VARIATION OF CURRENT PROFILE 审中-公开
    通过电流剖面变化控制电沉积铜涂层的硬度

    公开(公告)号:WO2006036252A3

    公开(公告)日:2008-01-24

    申请号:PCT/US2005024184

    申请日:2005-07-11

    Applicant: MACDERMID INC

    CPC classification number: C25D5/38 C25D5/18

    Abstract: Pulse reverse electrolysis of acid copper solutions is used for applying copper deposits of a controlled hardness for applications such as producing printing cylinders. The benefits include improved production capacity. Hardness of the deposit is controlled by varying at least one factor selected from the group consisting of (i) cathodic pulse time, (ii) anodic pulse time, (iii) cathodic pulse current density, and (iv) anodic pulse current density. Preferably the ratio of cathodic pulse time to anodic pulse tim is varied. The figure illustrates variation of deposit hardness with reverse (anodic) pulse time.

    Abstract translation: 酸性铜溶液的脉冲反向电解用于施加可控硬度的铜沉积物,用于生产印刷滚筒等应用。 其优点包括提高生产能力。 通过改变至少一个选自(i)阴极脉冲时间,(ii)阳极脉冲时间,(iii)阴极脉冲电流密度和(iv)阳极脉冲电流密度)的因素来控制沉积物的硬度。 优选地,阴极脉冲时间与阳极脉冲tim的比率是变化的。 该图示出了反向(阳极)脉冲时间的沉积硬度的变化。

    PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS
    4.
    发明公开
    PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS 审中-公开
    PULSUMKEHRELEKTROLYSE VON SAURENKUPFERGALVANISIERUNGSLÖSUNGEN

    公开(公告)号:EP1766106A4

    公开(公告)日:2007-09-05

    申请号:EP05725574

    申请日:2005-03-15

    Applicant: MACDERMID INC

    CPC classification number: C25D5/18 C25D3/38

    Abstract: Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.

    Abstract translation: 酸性铜溶液的脉冲反向电解用于将铜应用于印刷滚筒,尤其是凹版印刷滚筒。 电镀组合物通常包含铜离子,抗衡离子,氯离子,聚亚烷基二醇和可溶于水的二价硫化合物。 其优点包括电镀制品上电沉积的铜的厚度分布改善,金属废物减少,电镀时间缩短以及生产能力增加。

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