公开(公告)号：CA2091286A1

公开(公告)日：1994-01-21

申请号：CA2091286

申请日：1993-03-09

Applicant: MACDERMID INC

Inventor： GRUNWALD JOHN ,  GAL CHAVA ,  HIRSH SHULAMIT ,  MOZEL JACOB

IPC: G03F7/004 ,  B41M5/36 ,  C08G59/50 ,  G03F7/016 ,  G03F7/038 ,  G03F7/039 ,  G03F7/20 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/28 ,  H05K3/46 ,  B41M5/24 ,  H05K3/02

Abstract: A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process), which process utilizes thermo-resists rather than photoresists, i.e., compositions which undergo thermally-induced, rather than photo-induced, chemical transformations. A film of thermo-resist composition applied to the substrate surface is scanned by a focused heat source (e.g., a thermal laser emitting in the IR region) in a predetermined pattern, without a phototool, to bring about localized thermally-induced chemical transformations of the composition which either directly produce the resist pattern or produce in the film a developable latent image of the pattern.