公开(公告)号：DE2166971A1

公开(公告)日：1977-02-10

申请号：DE2166971

申请日：1971-01-25

Applicant: MACDERMID INC

Inventor： RHODENIZER HAROLD L ,  GRUNWALD JOHN J ,  INNES WILLIAM P ,  MERCEREAU MARK

IPC: C23C18/16 ,  C23C18/20 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02 ,  B41M3/08 ,  C25D7/00 ,  H01B5/14

Abstract: 1343211 Treating plastics; electroless plating MACDERMID Inc 11 Jan 1971 [26 Jan 1970] 1276/71 Heading C7F A moulded polymerised epoxy- or phenolicbase resin reinforced with fibre-glass cloth is prepared for electroless plating, e.g. in printed circuit manufacture, by applying a 0À001 to 0À005 inch thermoset resin coating, treating with a dipolar aprotic organic liquid selected from where R 1 = H or C 1 -C 5 alkyl, R 2 = C 1 -C 5 alkyl where R 3 = H or C 1 - C 3 alkyl, R 4 and R 5 are H or C 1 - C 5 alkyl, and where R 6 = C 1 - C 5 alkyl, treating with an aqueous hexavalent chromium solution, catalysing with an aqueous precious metal solution, and heating the catalysed surface to a temperature above ambient but insufficient to char the resin. Typical process steps are (1) coat the substrate with resin and immerse in said liquid (2) immerse in chromic/ sulphuric acid solution (3) catalyze, either with SnCl 2 / PdCl 2 or Sn - Pd hydrosol, (4) either (a) apply electroless metal and (b) apply negative resist or (c) apply and develop negative resist (5) (further) metal deposition, followed by removal of resist (and unwanted metal, if steps 4(a) and (b) were used), the heating step following any of steps (3), (4) a, b, or c or (5). Examples are given in flow-sheet form; electrolessly deposited metal such as Cu or Ni may be thickened electrolytically with Cu or Ni or protected with electrolytic solder, which may be removed from contact areas to allow plating, e.g. with Au or Ag.