Abstract:
In a mechanical plating process, oxidation-prone metals, such as aluminum, titanium, magnesium, and mixtures thereof, can be applied to metal substrates without the corrosion problems encountered in the prior art. To avoid such problems, the substrate is plated with the oxidation-prone metal and relatively minor amounts of an immersion metal and, optionally, a protective metal. The immersion metal which can be salts or oxides of metals selected from the group consisting of tin, copper, nickel, cadmium, zinc, lead, and mixtures thereof coats the oxidation-prone metal in forming a mechanical plating coating and prevents formation of an oxide layer on the oxidation-prone metal. The protective metal which may be selected from the group consisting of zinc, cadmium, and mixtures thereof prevents oxidation of the plated metal substrate when exposed to the environment. An etching agent is used either prior to and/or during mechanical plating.
Abstract:
A method is disclosed for treating the surface of a polymeric plastic substrate in a chemical plating process incorporating a preliminary chromic acid etch followed by one-step activation in a tin-palladium hydrosol. The method involves the step of immersing the substrate in a dilute aqueous acid solution of stannous chloride between the etching and activating steps.
Abstract:
Plastic parts are formed against an anodically treated aluminum surface by molding, laminating, etc., whereby the surface of the formed part after removal of or separation from the aluminum has a high-energy level and is receptive to adherent coatings of paint or metal plate. In particular, in addition to preparing plastic surfaces for acceptance and adhesion of paints, inks or the like, printed circuit boards and other metal-plated plastic substrates are prepared by first bonding anodically treated aluminum foil to a plastic substrate to provide a sacrificial cladding on the substrate, then stripping the aluminum chemically from the substrate, catalyzing the stripped surface and depositing a conductor metal plate thereon by electroless and/or electrolytic deposition, after application of a resist pattern of the desired circuit in the case of printed circuit boards.
Abstract:
A METHOD OF AND COMPOSITION FOR PROMOTING ADHESION BETWEEN PLATED METAL AND A PLASTIC SUBSTRATE, IN WHICH THE ACTIVE AGENT IS PROVIDED IN FINELY DIVIDED DISPERSED OR COLLOIDAL AQUEOUS EMULSION FORM. THE ACTIVE AGENTS ARE ANY OF A GROUP OF LOW MOLECULAR WEIGHT ORGANIC UNSATURATED COMPOUNDS OF THE FATTY ACID TYPE, AND MORE ESPECIALLY OF THE GROUP OF NATURALLY OCCURRING PRODUCTS SUCH AS LINSEED, TALL, TUNG AND CASTOR OILS, TURPENTINE AND SIMILAR WOOD ROSINS. THESE, WHEN DISPERSED IN WATER TO PROVIDE STABLE EMULSIONS, ARE USED AS A PRETREATMENT BATH FOR PLASTIC SUBSTRATES, PRIOR TO PLATING OF THE SUBSTRATE, IN ORDER TO PROMOTE THE FORMTAION OF A STRONGER BOND BETWEEN THE METAL PLATE AND SUBSTRATE.
Abstract:
THE INVENTION DISCLOSES COMPOSITIONS FOR AND METHODS OF TREATING THE SURFACE OF MOLED POLYOLEFINS, MORE ESPECIALLY POLYPROPYLENE, POLYETHYLENE AND POLYBUTYLENE, PRIOR TO THE DEPOSITIONOF A METALLIC PALTE THEREON IN ORDER TO IMPROVE THE ADHERENCE OF THE PLATE TO THE SURFACE OF THE POLYOLEFIN SUBSTRATE. THE COMPOSITIONS COMPRISE STABLE, AQUEOUS MICRO-EMULSIONS OF THE OIL-IN-WATER TYPE CONTAINING AS THE PRINCIPAL ACTIVE AGENTS A MIXTURE OF WHITE PHOSPHORUS AND TRICHLORETHYLNE.
Abstract:
A procedure is disclosed for modifying the topography of the surface of a polymer substrate to improve the bonding capability of the surface of the polymer in respect to subsequently applied coatings such as metal films, paints and inks. The procedure involved comprises first laminating a sacrificial, anodized metal foil to the substrate surface by heat and pressure, chemically stripping away that foil and then developing preferably, by a supplemental chemical stripping treatment, a network of microscopic fissures and cracks which is believed to incipiently form in the surface by the laminating process. Thereafter the treated substrate may be activated and electrolessly plated by conventional methods, followed by an added electrolytic or electroless plating if desired, to provide a metal film of execellent adhesion. Alternatively, standard vacuum metallizing procedures may be used to provide the initial or finished metal coating. Adhesion of other, nonmetallic, coatings such as paints and inks is also improved by the process.
Abstract:
A METHOD IS DISCLOSED FOR FORMING PRINTED CIRCUIT BOARDS BY THE ADDITIVE PROCESS, IN WHICH THE SURFACE OF THE SUBSTRATE IS CONTACTED WITH A PARTICULAR CLASS OF SOLVENTS, PRIOR TO ELECTROLESS DEPOSITION OF THE METAL THEREON,
AND AT ONE OR MORE POINTS IN THE PROCESS THE BOARD IS HEATED OR BAKED.
Abstract:
The invention discloses compositions for and methods of treating the surface of molded polyolefins, more especially polypropylene, polyethylene and polybutylene, prior to the deposition of a metallic plate thereon in order to improve the adherence of the plate to the surface of the polyolefin substrate. The compositions comprise stable, aqueous microemulsions of the oilin-water-type containing as the principal active agents a mixture of white phosphorus and trichloroethylene.