公开(公告)号：US3698940A

公开(公告)日：1972-10-17

申请号：US3698940D

申请日：1970-01-26

Applicant: MACDERMID INC

Inventor： MERSEREAU MARK ,  RHODENIZER HAROLD L ,  GRUNWALD JOHN J ,  INNES WILLIAM P

IPC: C23C18/16 ,  C23C18/20 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  B44D1/18

CPC classification number: C23C18/1653 ,  C23C18/1605 ,  C23C18/2086 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/0783 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A METHOD IS DISCLOSED FOR FORMING PRINTED CIRCUIT BOARDS BY THE ADDITIVE PROCESS, IN WHICH THE SURFACE OF THE SUBSTRATE IS CONTACTED WITH A PARTICULAR CLASS OF SOLVENTS, PRIOR TO ELECTROLESS DEPOSITION OF THE METAL THEREON,

AND AT ONE OR MORE POINTS IN THE PROCESS THE BOARD IS HEATED OR BAKED.

公开(公告)号：US3563784A

公开(公告)日：1971-02-16

申请号：US3563784D

申请日：1968-09-09

Applicant: MACDERMID INC

Inventor： INNES WILLIAM P ,  OTTAVIO EUGENE D D ,  BROWN SHARON D

IPC: C23C18/20 ,  C23C18/26 ,  C23C3/00 ,  B44D1/40

CPC classification number: C23C18/30 ,  C23C18/208 ,  C23C18/24 ,  C23C18/26 ,  C23C18/285

Abstract: AQUEOUS DILUTE SURFACTANT SOLUTIONS ARE EMPLOYED IN THE TREATMENT OF PLASTIC SUBSTRATES TO PREPARE THEM FOR ELECTROLESS PLAING TO ENSURE COMPLETE COVERAGE OF THE SUBSTRATE SURFACE BY THE METAL. THE SUBSTRATES ARE IMMERSED IN THE SUFACTANT SOLUTION AS A PRELIMINARY STEP IMMEDIATELY PRECEDING THE ACTIVATION OF THE SUBSTRATE IN THE NORMAL CYCLE OF ELECTROLESS PLATING OPERATIONS, SUPPLANTING VARIOUS OTHER PRE-ACTIVATION STEPS AND, UNLIKE SUCH PRIOR STEPS, BEING OPERATIVE FOR ALL TYPES OF SYNTHETIC RESINS ENCOUNTERED IN ELECTROLESS PLATING OPERATIONS.

公开(公告)号：US3533727A

公开(公告)日：1970-10-13

申请号：US3533727D

申请日：1967-12-08

Applicant: MACDERMID INC

Inventor： GRUNWALD JOHN J ,  INNES WILLIAM P

IPC: D06P1/92

CPC classification number: D06P1/926 ,  D06P1/928 ,  Y10S8/907 ,  Y10S8/909 ,  Y10S8/938

公开(公告)号：US3666549A

公开(公告)日：1972-05-30

申请号：US3666549D

申请日：1969-05-09

Applicant: MACDERMID INC

Inventor： RHODENIZER HAROLD L ,  GRUNWALD JOHN J ,  INNES WILLIAM P

IPC: H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02

CPC classification number: H05K3/184 ,  C23C18/1605 ,  C23C18/1653 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/38 ,  H05K3/381 ,  H05K2203/0716 ,  H05K2203/1105 ,  H05K2203/1152 ,  H05K2203/1407

Abstract: A METHOD IS DISCLOSED FOR FORMING PRINTED CIRCUIT BOARDS USING THE ADDITIVE PROCESS. IMPROVEMENT OVER THE PRIOR ART IS OBTAINED IN RESPECT TO ADHESION OF THE CONDUCTOR METAL CIRCUIT TO A THERMOSET RESIN SUBSTRATE. IN THE PROCESS, A NICKEL OF COPPER CLAD THERMOSET RESIN SUBSTRATE IS STRIPPED OF ALL METAL ACTIVATED (CATALYZED), A RESIST PATTERN APPLIED TO OBTAIN THE DESIRED CIRCUIT AND A CONDUCTOR METAL DEPOSITED ON THE CIRCUIT AREA BY ELECTROLESS AND/OR ELECTRODEPOSITION TO A FINAL DESIRED THICKNESS. AT ONE OR MORE POINTS IN THE PROCESS THE BOARD IS HEATED OR BAKED. VARIOUS TYPES OF CIRCUIT BOARDS RESULTING FROM THE PROCESS ARE ALSO DISCLOSED.

公开(公告)号：AU3168171A

公开(公告)日：1973-02-01

申请号：AU3168171

申请日：1971-07-27

Applicant: MACDERMID INC

Inventor： MERSEREAU MARK ,  RHODENITZER HAROLD L ,  GRUNWALD JOHN J ,  INNES WILLIAM P

IPC: C23C18/20 ,  B29C27/02 ,  C08G51/22 ,  H05K1/02

公开(公告)号：DE2065349A1

公开(公告)日：1973-05-03

申请号：DE2065349

申请日：1970-12-30

Applicant: MACDERMID INC

Inventor： GRUNDWALD JOHN J ,  D OTTAVIO EUGENE H ,  RHODENIZER HAROLD L ,  LOMBARDO MICHAEL S ,  INNES WILLIAM P

IPC: B32B15/08 ,  C08J7/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/18 ,  H05K3/38 ,  H01B5/14

Abstract: An Al-plated laminate for printed circuits etc. is prepd. by (1) anodically treating one surface of an Al foil in an electrolytic phosphoric acid bath, (2) applying to this surface a sheet of thermoplastic resin, and (3) exerting sufficient heat and pressure to bond the Al foil to the resin sheet. The use of polymeric adhesive as interlayer between a metal and a synthetic carrier is avoided.

公开(公告)号：DE2065347A1

公开(公告)日：1973-05-03

申请号：DE2065347

申请日：1970-12-30

Applicant: MACDERMID INC

Inventor： GRUNWALD JOHN J ,  D OTTAVIO EUGENE H ,  RHODENIZER HAROLD L ,  LOMBARDO MICHAEL S ,  INNES WILLIAM P

IPC: B32B15/08 ,  C08J7/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/18 ,  H05K3/38 ,  H01B5/14

Abstract: An Al-plated laminate for printed circuits etc. is prepd. by (1) anodically treating an Al foil in an electrolytic bath contg. 10-60wt.% phosphoric acid for 1-30 mins. at a current density of 10.7-80.7 mA/cm2, and (2) bonding 1 or both surfaces of the treated Al foil to a substrate which is either a heat-hardenable resin layer or a thermoplastic resin layer. The use of a polymeric adhesive as inter-layer between a metal and a synthetic carrier is avoided. Al can be used in place of the more expensive Cu.

公开(公告)号：DE2166971A1

公开(公告)日：1977-02-10

申请号：DE2166971

申请日：1971-01-25

Applicant: MACDERMID INC

Inventor： RHODENIZER HAROLD L ,  GRUNWALD JOHN J ,  INNES WILLIAM P ,  MERCEREAU MARK

IPC: C23C18/16 ,  C23C18/20 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02 ,  B41M3/08 ,  C25D7/00 ,  H01B5/14

Abstract: 1343211 Treating plastics; electroless plating MACDERMID Inc 11 Jan 1971 [26 Jan 1970] 1276/71 Heading C7F A moulded polymerised epoxy- or phenolicbase resin reinforced with fibre-glass cloth is prepared for electroless plating, e.g. in printed circuit manufacture, by applying a 0À001 to 0À005 inch thermoset resin coating, treating with a dipolar aprotic organic liquid selected from where R 1 = H or C 1 -C 5 alkyl, R 2 = C 1 -C 5 alkyl where R 3 = H or C 1 - C 3 alkyl, R 4 and R 5 are H or C 1 - C 5 alkyl, and where R 6 = C 1 - C 5 alkyl, treating with an aqueous hexavalent chromium solution, catalysing with an aqueous precious metal solution, and heating the catalysed surface to a temperature above ambient but insufficient to char the resin. Typical process steps are (1) coat the substrate with resin and immerse in said liquid (2) immerse in chromic/ sulphuric acid solution (3) catalyze, either with SnCl 2 / PdCl 2 or Sn - Pd hydrosol, (4) either (a) apply electroless metal and (b) apply negative resist or (c) apply and develop negative resist (5) (further) metal deposition, followed by removal of resist (and unwanted metal, if steps 4(a) and (b) were used), the heating step following any of steps (3), (4) a, b, or c or (5). Examples are given in flow-sheet form; electrolessly deposited metal such as Cu or Ni may be thickened electrolytically with Cu or Ni or protected with electrolytic solder, which may be removed from contact areas to allow plating, e.g. with Au or Ag.

公开(公告)号：DE2065348A1

公开(公告)日：1973-05-03

申请号：DE2065348

申请日：1970-12-30

Applicant: MACDERMID INC

Inventor： GRUNWALD JOHN J ,  D OTTAVIO EUGENE H ,  RHODENIZER HAROLD L ,  LOMBARDO MICHAEL S ,  INNES WILLIAM P

IPC: B32B15/08 ,  C08J7/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/18 ,  H05K3/38 ,  H01B5/14

Abstract: Al foil is anodically treated in pref. 20-40% by wt phosphoric acid soln at current density 28-59 mA/cm2 at 32-43 degrees C for 3-7 mins. The surface with the oxide layer so formed is layed on a thermoplastic or thermosetting material and compressed at elevated temp. The aluminium is then detached or etched off in an aqs. soln of Na, K, or Li hydroxide or aqs. HCl. The result is suitable for mfg. printed circuits. Suitable thermosetting materials are phenol resins, reaction prods of dicarboxylic gps with bivalent alcohols polyesters etc suitable thermoplastic materials are polyolefines.

公开(公告)号：DE2065346A1

公开(公告)日：1973-05-03

申请号：DE2065346

申请日：1970-12-30

Applicant: MACDERMID INC

Inventor： GRUNWALD JOHN J ,  D OTTAVIO EUGENE H ,  RHODENZIER HAROLD L ,  LOMBARDO MICHAEL S ,  INNES WILLIAM P

IPC: B32B15/08 ,  C08J7/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/18 ,  H05K3/38 ,  H01B5/14

Abstract: An Al-plates laminate for printed circuits and the like is prepd. by (1) anodically treating one or both surfaces of an Al foil in an electrolytic phosphoric acid bath, (2) applying to this (or these) surface(s) a partially hardened sheet of heat-hardenable resin, and (3) exerting sufficient heat and pressure to complete the hardening of the resin and to bond the Al foil to the resin sheet. The use of a polymeric adhesive as inter-layer between a metal and a synthetic carrier is avoided.